Invention Application
- Patent Title: WIRE GRIPPER, WIRE PROCESSING APPARATUS INCLUDING THE SAME, AND WIRE PROCESSING METHOD USING THE SAME
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Application No.: US18608633Application Date: 2024-03-18
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Publication No.: US20240379384A1Publication Date: 2024-11-14
- Inventor: Jongseong Ko , Daeyong Kim , Donghyun Kim , Pyungkang Kim , Kihong Park , Jungjoon Park , Jungjun Park , Jooyoung Park , Hoseok Song , Kongwoo Lee , Hyunyoung Lee , Chuyoung Choung , Jeongmin Hwang , Jisu Kim , Junhyeok Park , Chiho Ahn
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2023-0060377 20230510,KR10-2023-0117988 20230905
- Main IPC: H01L21/67
- IPC: H01L21/67

Abstract:
The present disclosure relates to wire grippers, wire processing apparatuses, and wire processing methods. An example wire gripper comprises a gripper body, a wire supply in the gripper body and supplying a wire, a wire cutting section including a cutter that cuts the wire supplied from the wire supply, a pressure roller below the wire supply and providing a guide groove to guide the wire supplied from the wire supply, a twister on a side of the pressure roller, and a reloader that drives an end of the wire to move from the wire supply to the twister. The twister holds and twists the end of the wire guided by the pressure roller.
Information query
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