Systems, apparatus, articles of manufacture, and methods are disclosed for deploying feet and/or including hinge gaskets to improve thermal solutions and/or acoustic experience with electronic devices. An example electronic device includes a first panel; a second panel; a hinge coupling the first panel and the second panel; a foot coupled to the second panel, the foot movable between a deployed position and a retracted position; a sensor to detect a position of the first panel; and programmable circuitry to execute instructions to cause the foot to be moved between the deployed position and the retracted position based on the position of the first panel.