公开(公告)号：US20240385654A1

公开(公告)日：2024-11-21

申请号：US18329148

申请日：2023-06-05

Applicant: Intel Corporation

Inventor： Jeff Ku ,  MING-SHENG Tsai ,  Twan Sing Loo ,  Jeffrey Ho ,  Songlin Zhou

IPC: G06F1/16 ,  G06F1/20

Abstract: Systems, apparatus, articles of manufacture, and methods are disclosed for deploying feet and/or including hinge gaskets to improve thermal solutions and/or acoustic experience with electronic devices. An example electronic device includes a first panel; a second panel; a hinge coupling the first panel and the second panel; a foot coupled to the second panel, the foot movable between a deployed position and a retracted position; a sensor to detect a position of the first panel; and programmable circuitry to execute instructions to cause the foot to be moved between the deployed position and the retracted position based on the position of the first panel.

公开(公告)号：US20240431066A1

公开(公告)日：2024-12-26

申请号：US18340577

申请日：2023-06-23

Applicant: Intel Corporation

Inventor： Jeff Ku ,  Chi Chou Cheng ,  Jeffrey Ho ,  Chih-Tsung Hu ,  Srinivasarao Konakalla ,  Tsung-Kai Lin ,  Arnab Sen ,  Chiu-Chun Wang ,  Jiacheng Wu

IPC: H05K7/20 ,  G06F1/20

Abstract: Heat exchange apparatuses and methods for hyperbaric cooling fan applications such as computing devices. The apparatus comprises a material with high thermal conductivity and is configured to be overlaid on an internal surface of the housing, such that an internal surface of the apparatus is exposed to the hot air flowing inside the housing, and an external surface of the apparatus occludes at least some of the existing through-holes of the housing. In operation, the apparatus converts the through-holes into passive heat exchanging regions that passively transfer heat from inside the housing to outside the housing, which brings the internal air temperature and junction temperature (Tj) of the heat generating components down. Provided embodiments do not require reworking of the original industrial design (ID) of the housing.

公开(公告)号：US20240310881A1

公开(公告)日：2024-09-19

申请号：US18185505

申请日：2023-03-17

Applicant: Intel Corporation

Inventor： Jeffrey Ho ,  Shawn Mceuen ,  Min Suet Lim ,  Yew San Lim ,  Bruce Cheng

IPC: G06F1/16 ,  F16C11/04

CPC classification number: G06F1/1681 ,  F16C11/04 ,  E05D3/02 ,  E05D5/14 ,  E05Y2999/00

Abstract: Hinges for electronic devices are disclosed herein. An example hinge includes a bracket capable of being coupled to a first portion of the electrical device. The bracket has a barrel defining a first opening. The hinge also includes a shaft in the first opening. The shaft is rotatable in the first opening. The hinge further includes a sleeve capable of being inserted into a bore in a second portion of the electronic device. The sleeve defines a second opening to receive a portion of the shaft.