Invention Application
- Patent Title: BUTTED CONTACTS AND METHODS OF FABRICATING THE SAME IN SEMICONDUCTOR DEVICES
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Application No.: US18783869Application Date: 2024-07-25
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Publication No.: US20240387658A1Publication Date: 2024-11-21
- Inventor: Li-Zhen Yu , Lin-Yu Huang , Cheng-Chi Chuang , Yu-Ming Lin , Chih-Hao Wang
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Main IPC: H01L29/417
- IPC: H01L29/417 ; H01L21/285 ; H01L21/321 ; H01L21/8234 ; H01L23/528 ; H01L23/535 ; H01L29/49 ; H01L29/66 ; H01L29/78

Abstract:
A semiconductor structure includes a metal gate structure (MG) formed over a substrate, a first gate spacer formed on a first sidewall of the MG, a second gate spacer formed on a second sidewall of the MG opposite to the first sidewall, where the second gate spacer is shorter than the first gate spacer, a source/drain (S/D) contact (MD) adjacent to the MG, where a sidewall of the MD is defined by the second gate spacer, and a contact feature configured to electrically connect the MG to the MD.
Information query
IPC分类: