Invention Application
- Patent Title: SEMICONDUCTOR DEVICE COMPRISING A HIGH-K GATE DIELECTRIC MULTILAYER LAMINATE STRUCTURE AND A METHOD FOR MANUFACTURING THEREOF
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Application No.: US18664904Application Date: 2024-05-15
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Publication No.: US20240405092A1Publication Date: 2024-12-05
- Inventor: Armin TILKE , Sandra KRAUSE , Thomas AICHINGER , Wolfgang LEHNERT , Francisco Javier SANTOS RODRIGUEZ
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Priority: DE102023205087.0 20230531,DE102024202924.6 20240327
- Main IPC: H01L29/51
- IPC: H01L29/51 ; H01L29/16 ; H01L29/423

Abstract:
There is described a semiconductor device comprising an SiC body with a gate structure comprising a gate dielectric with a specific multilayer laminate structure including alternating layers of a first dielectric material and of a second dielectric material having a dielectric constant of 4 or higher. There is further described a method for manufacturing such a semiconductor device including an SiC body as mentioned before.
Information query
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