Invention Application
- Patent Title: Highly Textured Buffer Layer to Grow YBiPt (110) For Spintronic Applications
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Application No.: US18740054Application Date: 2024-06-11
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Publication No.: US20240420733A1Publication Date: 2024-12-19
- Inventor: Quang LE , Brian R. YORK , Sharon Swee Ling BANH , Hassan OSMAN , Hisashi TAKANO
- Applicant: Western Digital Technologies, Inc.
- Applicant Address: US CA San Jose
- Assignee: Western Digital Technologies, Inc.
- Current Assignee: Western Digital Technologies, Inc.
- Current Assignee Address: US CA San Jose
- Main IPC: G11B5/39
- IPC: G11B5/39 ; G01R33/09 ; G11C11/16 ; H03K19/18 ; H10B61/00 ; H10N50/10 ; H10N50/85 ; H10N52/80

Abstract:
The present disclosure generally relates to spintronic material stacks and devices. The various disclosed embodiments of YBiPt based spin orbit torque (SOT) stacks can be used for high temperature applications. Disclosed herein are various buffer and/or interlayer configurations in spintronic stacks that can promote growth of YBiPt in the (110) orientation, to promote a high spin Hall angle (SHA) in SOT applications. One embodiment is a spintronic stack comprising a buffer layer comprising one or more layers, the one or more layers each individually comprising: MgO (100), TiN (100), Ta, Nb, HfN, Ta3W2 (110), TaW2 (100), Ta3W2N, TaW2N, or heated YPt, an SOT layer comprising YBiPt in the (110) orientation, an interlayer comprising one or more of MgO, Ta3WN, TaW3N, Ta3W (110), TaW3 (100), YPt (110), NiFeGeN, NiAlN, NiAl, NiFeGe, NiAlGe, or HfN, and a ferromagnetic layer.
Information query
IPC分类: