Invention Application
- Patent Title: CORROSION RESISTANT SINGLE DAMASCENE INTERCONNECTS
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Application No.: US18214159Application Date: 2023-06-26
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Publication No.: US20240431025A1Publication Date: 2024-12-26
- Inventor: Takeshi Nogami , Daniel Charles Edelstein , Wei-Tsu Tseng , James J. Kelly , Donald Francis Canaperi
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Main IPC: H05K1/11
- IPC: H05K1/11 ; C23C14/08 ; C23C14/34 ; H05K1/09 ; H05K3/42

Abstract:
A single-damascene interconnect comprises a first conductor line and a second conductor line. The single-damascene interconnect also comprises a via connecting the first conductor line and second conductor line. The via is filled with a low resistivity metal conductor. The low resistivity metal conductor has high corrosion resistance. The metal conductor is not the same material as the first or second conductor lines.
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