A TARGET OF A DIELECTRIC MATERIAL IS MOUNTED IN SPACED RELATION TO A CATHODE, WHICH IS ISOLATED FROM THE SPUTTERING CHAMBER AND THE ANODE IN THE SPUTTERING CHAMBER BY THE TARGET AND ITS MOUNTING STRUCTURE. RF ENERGY IS TRANSFERRED FROM THE CATHODE TO THE TARGET, WHICH HAS AT LEAST A PORTION PARALLEL TO THE ANODE, THROUGH THE SPACE BY A DIELECTRIC COOLANT, A LIQUID METAL, OR A METALLIC PASTE. WHEN EITHER THE METALLIC PASTE OR THE LIQUID METAL IS EMPLOYED, THE CATHODE IS COOLED BY CIRCULTING A COOLANT SUCH AS WATER THERETHROUGH.