公开(公告)号：US3630881A

公开(公告)日：1971-12-28

申请号：US3630881D

申请日：1970-01-22

Applicant: IBM

Inventor： LESTER WILLIAM C ,  NUCCIO CARLO ,  WARD ERNEST S

IPC: C23C14/40 ,  B05B5/00 ,  B41J2/005 ,  C23C14/35 ,  H01J37/34 ,  C23C15/00

CPC classification number: C23C14/35 ,  B05B5/00 ,  B05B5/001 ,  B41J2/005 ,  H01J37/34

Abstract: A TARGET OF A DIELECTRIC MATERIAL IS MOUNTED IN SPACED RELATION TO A CATHODE, WHICH IS ISOLATED FROM THE SPUTTERING CHAMBER AND THE ANODE IN THE SPUTTERING CHAMBER BY THE TARGET AND ITS MOUNTING STRUCTURE. RF ENERGY IS TRANSFERRED FROM THE CATHODE TO THE TARGET, WHICH HAS AT LEAST A PORTION PARALLEL TO THE ANODE, THROUGH THE SPACE BY A DIELECTRIC COOLANT, A LIQUID METAL, OR A METALLIC PASTE. WHEN EITHER THE METALLIC PASTE OR THE LIQUID METAL IS EMPLOYED, THE CATHODE IS COOLED BY CIRCULTING A COOLANT SUCH AS WATER THERETHROUGH.

公开(公告)号：US3652444A

公开(公告)日：1972-03-28

申请号：US3652444D

申请日：1969-10-24

Applicant: IBM

Inventor： LESTER WILLIAM C ,  NUCCIO CARLO ,  WARD ERNEST S

IPC: B23Q3/08 ,  B01J3/00 ,  B01J3/02 ,  C23C14/56 ,  H01L21/677 ,  C23C15/00

CPC classification number: B01J3/006 ,  C23C14/568 ,  Y10S414/139

Abstract: The invention is directed to a continuous vacuum multiprocessing system for treating, evaporation, or sputter vacuum depositing on a substrate or wafer for the preparation of semiconductors. The utilized structure comprises an annular chamber partitioned into alternating process and isolation compartments which are circularly arranged around a common (central) vacuum manifold. A circular transport ring, confined to the evacuated annular mechanically transports (via rotation) the substrates through the various serially connected compartments.

Abstract translation: 本发明涉及用于处理，蒸发或溅射真空沉积在用于制备半导体的衬底或晶片上的真空多处理系统。 所使用的结构包括分隔成交替的过​​程和隔离隔室的环形室，其围绕公共（中心）真空歧管圆形布置。 限制在抽空环形中的圆形运输环通过各种串联连接的隔室机械地运输（通过旋转）基板。

公开(公告)号：US3921572A

公开(公告)日：1975-11-25

申请号：US44519974

申请日：1974-02-25

Applicant: IBM

Inventor： BRUNNER ROLF H ,  CARBONE QUIEDO J ,  LESTER WILLIAM C

IPC: C23C14/24 ,  C23C14/56 ,  H01L21/285 ,  C23C13/08

CPC classification number: C23C14/56

Abstract: Vacuum coating apparatus having isolatable coating and vacuum chambers whose volumes are correlated to each other to minimize contamination and pump-down time, with the coating chamber having a closure means mounting a substrate holder for positioning substrates in an evaporant stream from a vapor source contained in the vacuum chamber.

Abstract translation: 具有可分离的涂层和真空室的真空涂布装置，其体积彼此相关，以最小化污染和抽空时间，涂覆室具有封闭装置，该封闭装置安装用于将基板定位在蒸发源中的封闭装置， 真空室。

公开(公告)号：US3889632A

公开(公告)日：1975-06-17

申请号：US47500574

申请日：1974-05-31

Applicant: IBM

Inventor： BRUNNER ROLF H ,  LESTER WILLIAM C

IPC: B23K35/40 ,  C23C14/50 ,  H01L21/285 ,  C23C13/08

CPC classification number: C23C14/505

Abstract: A coating apparatus, such as for vacuum deposition, in which an access port, of a deposition chamber, is provided with a hatch door having mounted on its inner surface workpiece supports adapted for turning on two mutually perpendicular axii within a stream of coating material. Included is a modification in which a plurality of supports are concentrically orbited about a third axis with the coating stream.

Abstract translation: 一种用于真空沉积的涂覆装置，其中沉积室的进入端口设置有舱口门，该舱口门安装在其内表面上，适于在涂层材料流内转动两个相互垂直的轴线的工件支撑件。 包括的是一种修改，其中多个支撑体围绕第三轴同心地绕着涂层流动。