公开(公告)号：US3625384A

公开(公告)日：1971-12-07

申请号：US3625384D

申请日：1968-09-26

Applicant: IBM

Inventor： BOERGER FRANK E ,  NUCCIO CARLO ,  ROSBOSCHIL CHARLES A

IPC: B65G59/06 ,  H01L21/677 ,  H01L21/683 ,  B65G59/00

CPC classification number: H01L21/6835 ,  B65G59/062

Abstract: Articles are transported from one position to another by being disposed in trays, which are carried within a portable magazine. The trays are automatically unloaded in sequence from the magazine and transported to a position in which the articles in the tray may be removed therefrom. The unloaded tray is then returned to the magazine and the next of the trays is removed from the magazine. The apparatus includes coding means on the magazine to indicate the status of the articles within each of the trays in the magazine.

公开(公告)号：US3916266A

公开(公告)日：1975-10-28

申请号：US42449073

申请日：1973-12-13

Applicant: IBM

Inventor： BENNETT MARVIN ,  NUCCIO CARLO ,  WURMS CHARLES

IPC: H05K1/14 ,  H01L21/768 ,  H01L23/13 ,  H01L23/52 ,  H01L23/522 ,  H01L23/538 ,  H01L25/00 ,  H05K1/00 ,  H05K1/05 ,  H05K7/20 ,  H02B1/00

CPC classification number: H01L23/5385 ,  H01L23/13 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0284 ,  H05K1/053 ,  H05K1/056 ,  H05K2201/09118 ,  H05K2201/09754 ,  H05K2201/0999 ,  H01L2924/00

Abstract: A package for interconnecting a plurality of integrated circuit chips including a dielectric body having a plurality of intersecting planes and a plurality of metallized interconnection patterns located thereon. Conductive interconnecting lines connected to at least some of said metallized patterns located on different intersecting planes provide inter-plane electrical continuity, and input/output connectors connect to at least one of the metallized patterns for connecting to the outside world.

Abstract translation: 一种用于互连多个集成电路芯片的封装，包括具有多个相交平面的绝缘体和位于其上的多个金属化互连图案。 连接到位于不同交叉平面上的至少一些所述金属化图案的导电互连线提供了平面间电连续性，并且输入/输出连接器连接至至少一个金属化图案以连接到外界。

公开(公告)号：US3652444A

公开(公告)日：1972-03-28

申请号：US3652444D

申请日：1969-10-24

Applicant: IBM

Inventor： LESTER WILLIAM C ,  NUCCIO CARLO ,  WARD ERNEST S

IPC: B23Q3/08 ,  B01J3/00 ,  B01J3/02 ,  C23C14/56 ,  H01L21/677 ,  C23C15/00

CPC classification number: B01J3/006 ,  C23C14/568 ,  Y10S414/139

Abstract: The invention is directed to a continuous vacuum multiprocessing system for treating, evaporation, or sputter vacuum depositing on a substrate or wafer for the preparation of semiconductors. The utilized structure comprises an annular chamber partitioned into alternating process and isolation compartments which are circularly arranged around a common (central) vacuum manifold. A circular transport ring, confined to the evacuated annular mechanically transports (via rotation) the substrates through the various serially connected compartments.

Abstract translation: 本发明涉及用于处理，蒸发或溅射真空沉积在用于制备半导体的衬底或晶片上的真空多处理系统。 所使用的结构包括分隔成交替的过​​程和隔离隔室的环形室，其围绕公共（中心）真空歧管圆形布置。 限制在抽空环形中的圆形运输环通过各种串联连接的隔室机械地运输（通过旋转）基板。

公开(公告)号：US3707452A

公开(公告)日：1972-12-26

申请号：US3707452D

申请日：1970-01-22

Applicant: IBM

Inventor： LESTER WILLIAM CARL ,  NUCCIO CARLO ,  WARD ERNEST S

IPC: H05B7/00 ,  B65H18/02 ,  C23C14/34 ,  C23C14/40 ,  H01J37/34 ,  C23C15/00

CPC classification number: B65H18/021 ,  C23C14/3478 ,  H01J37/34

Abstract: AN RF SPUTTERING APPARATUS HAS AN ELONGATED HOLLOW CYLINDRICAL TARGET SURROUNDING AN ELONGATED CYLINDRICAL CATHODE TO SHIELD THE CATHODE FROM A PARTIALLY EVACUATED CHAMBER IN WHICH THE TARGET IS DISPOSED. AN ELONGATED HOLLOW CYLINDRICAL ANODE IS DISPOSED IN SURROUNDING RELATION TO THE TARGET. THE TARGET IS SPACED FROM THE CATHODE SO THAT COOLING OF THE TARGET MAY OCCUR BY DIELECTRIC COOLANT FLOWING THEREBETWEEN WITH THE DIELECTRIC COOLANT ALSO TRANSFERRING RF POWER TO THE TARGET FROM THE CATHODE WHEN RF POWER IS APPLIED BETWEEN THE CATHODE AND THE ANODE. IN AN EXTENSION TO CONTINUOUS MODE DEPOSITION (AS OPPOSED TO BATCH MODE DEPOSITION), SUBSTRATES CAN HAVE VARYING THICKNESSES OF MATERIAL DEPOSITED THEREON FROM THE TARGET UNDER THE SAME SPUTTERING CONDITIONS BY MOVING EACH SUBSTRATE INTO THE CHAMBER FOR SUPPORT ON THE INNER SURFACE OF THE ANODE, ROTATING THE ANODE ABOUT THE TARGET AT A CONSTANT VELOCITY, AND THEN REMOVING EACH SUBSTRATE AFTER A PERIOD OF TIME. THE AMOUNT OF TIME THAT EACH OF THE SUBSTRATES IS SUPPORTED ON THE ANODE DETERMINES THE THICKNESS OF THE DEPOSITED MATERIAL ON THE SUBSTRATE.

公开(公告)号：US3630881A

公开(公告)日：1971-12-28

申请号：US3630881D

申请日：1970-01-22

Applicant: IBM

Inventor： LESTER WILLIAM C ,  NUCCIO CARLO ,  WARD ERNEST S

IPC: C23C14/40 ,  B05B5/00 ,  B41J2/005 ,  C23C14/35 ,  H01J37/34 ,  C23C15/00

CPC classification number: C23C14/35 ,  B05B5/00 ,  B05B5/001 ,  B41J2/005 ,  H01J37/34

Abstract: A TARGET OF A DIELECTRIC MATERIAL IS MOUNTED IN SPACED RELATION TO A CATHODE, WHICH IS ISOLATED FROM THE SPUTTERING CHAMBER AND THE ANODE IN THE SPUTTERING CHAMBER BY THE TARGET AND ITS MOUNTING STRUCTURE. RF ENERGY IS TRANSFERRED FROM THE CATHODE TO THE TARGET, WHICH HAS AT LEAST A PORTION PARALLEL TO THE ANODE, THROUGH THE SPACE BY A DIELECTRIC COOLANT, A LIQUID METAL, OR A METALLIC PASTE. WHEN EITHER THE METALLIC PASTE OR THE LIQUID METAL IS EMPLOYED, THE CATHODE IS COOLED BY CIRCULTING A COOLANT SUCH AS WATER THERETHROUGH.