发明授权
US4151543A Lead electrode structure for a semiconductor chip carried on a flexible
carrier
失效
用于在柔性载体上承载的半导体芯片的引线电极结构
- 专利标题： Lead electrode structure for a semiconductor chip carried on a flexible carrier
- 专利标题（中）： 用于在柔性载体上承载的半导体芯片的引线电极结构
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申请号： US786841申请日： 1977-04-12
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公开(公告)号： US4151543A公开(公告)日： 1979-04-24
- 发明人: Masao Hayakawa , Takamichi Maeda , Masao Kumura
- 申请人： Masao Hayakawa , Takamichi Maeda , Masao Kumura
- 申请人地址： JPX Osaka
- 专利权人： Sharp Kabushiki Kaisha
- 当前专利权人： Sharp Kabushiki Kaisha
- 当前专利权人地址： JPX Osaka
- 优先权： JPX51/42232 19760413
- 主分类号： H03H9/02
- IPC分类号： H03H9/02 ; H01L21/60 ; H01L23/14 ; H01L23/48 ; H01L29/44 ; H01L29/52
摘要：
A semiconductor device comprises an insulating substrate such as a film carrier having wiring patterns formed thereon, lead electrodes connected to the wiring patterns, and a semiconductor chip bonded to the lead electrodes. The surface of the lead electrodes, to which the semiconductor chip is bonded, is smooth as compared with that of the wiring patterns, thereby ensuring accurate operation of the semiconductor device.
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