Method for producing an electrically conductive and solderable structure along with the resulting article are disclosed. The method comprises admixing metal particles, metal salts and an organic polymer binder as a paste which is applied to a non-conductive substrate by printing or the like. The paste is heated to permit metal salts to migrate to the surface of the binder where they become concentrated. During metallizing the salts are removed by the bath and metal is deposited in pores formed in the binder by the dissolved salts. The metal layer is adherent to the binder and provides good solderable points.