发明授权
- 专利标题: Method of encasing electric components
- 专利标题(中): 封装电气元件的方法
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申请号: US143041申请日: 1980-04-23
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公开(公告)号: US4307129A公开(公告)日: 1981-12-22
- 发明人: Masaharu Nisigahana , Haruo Hori
- 申请人: Masaharu Nisigahana , Haruo Hori
- 申请人地址: JPX
- 专利权人: Murata Manufacturing Co., Ltd.
- 当前专利权人: Murata Manufacturing Co., Ltd.
- 当前专利权人地址: JPX
- 优先权: JPX54-54514 19790105
- 主分类号: H01C17/02
- IPC分类号: H01C17/02 ; B05D1/18 ; H01B19/04 ; H01G2/10 ; H01G2/12 ; H01G4/224 ; H01G13/00 ; B05D5/12
摘要:
A method for encasing an electric component of a type comprising a body and at least one pair of lead wires extending outwardly therefrom in the same direction. An outer protective coating or casing enclosing the body therein is formed by dipping the electric component into a solution of chlorinated hydrocarbon containing either a chained aliphatic hydrocarbon or a higher fatty acid to form a film covering the entire surface of the body and the surfaces of portions of the lead wires adjacent the body, then dipping the electric component into a solvent to remove the film except for that covering the surface of a portion of the body adjacent the lead wires and also that covering the surfaces of that portions of the lead wires, and finally dipping the electric component into a coating solution.
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