Method of encasing electric components
    1.
    发明授权
    Method of encasing electric components 失效
    封装电气元件的方法

    公开(公告)号:US4307129A

    公开(公告)日:1981-12-22

    申请号:US143041

    申请日:1980-04-23

    CPC分类号: H01G2/12 B05D1/18 H01B19/04

    摘要: A method for encasing an electric component of a type comprising a body and at least one pair of lead wires extending outwardly therefrom in the same direction. An outer protective coating or casing enclosing the body therein is formed by dipping the electric component into a solution of chlorinated hydrocarbon containing either a chained aliphatic hydrocarbon or a higher fatty acid to form a film covering the entire surface of the body and the surfaces of portions of the lead wires adjacent the body, then dipping the electric component into a solvent to remove the film except for that covering the surface of a portion of the body adjacent the lead wires and also that covering the surfaces of that portions of the lead wires, and finally dipping the electric component into a coating solution.

    摘要翻译: 一种用于封装包括主体的类型的电气部件的方法和从其向同一方向向外延伸的至少一对引线。 通过将电气部件浸入含有链状脂族烃或高级脂肪酸的氯化烃的溶液中形成覆盖主体的整个表面的膜和部分的表面,形成外部保护涂层或外壳, 的导线相邻,然后将电子部件浸入溶剂中以除去膜,除了覆盖邻近引线的本体部分的表面,以及覆盖导线的该部分的表面, 最后将电子部件浸渍在涂布液中。