发明授权
- 专利标题： Technique for bonding a chip carrier to a metallized substrate
- 专利标题（中）： 将芯片载体接合到金属化基板的技术
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申请号： US469662申请日： 1983-02-25
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公开(公告)号： US4512509A公开(公告)日： 1985-04-23
- 发明人: Roland Ellis, Jr. , Brian E. Jacobs , Edward J. March , Raymond J. Newman
- 申请人： Roland Ellis, Jr. , Brian E. Jacobs , Edward J. March , Raymond J. Newman
- 申请人地址： NY New York
- 专利权人： AT&T Technologies, Inc.
- 当前专利权人： AT&T Technologies, Inc.
- 当前专利权人地址： NY New York
- 主分类号： H05K3/30
- IPC分类号： H05K3/30 ; H05K7/04 ; H05K13/04 ; B23K31/02
摘要：
A template (148), having at least one opening (152) therein, is placed in close, spaced, relation to a PCB (30). The opening (152) is circular with a small semicircular notch (154) on the periphery thereof. A chip carrier (10) is positioned in the opening (152) with one corner (22) loosely captured in the notch (154). The PCB (30), template (148) and the loosely captured chip carriers (10) are placed in a condensation soldering facility to reflow the solder. As the solder reflows the chip carrier (10) rotates slightly about the loosely captured corner (22) to self align pads (33) on the PCB (30) to leads (16) on the chip carrier (10) as the bond is being formed.
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