A multi-layer circuit board laminate is disclosed having a controlled thermal coefficient of expansion which is particularly useful in conjunction with leadless components. The subject invention includes incorporating one or more stabilizing metal sheets into a composite multi-layer circuit board laminate assembly. The stabilizing metal sheets function to significantly reduce the circuit board laminate's thermal coefficient of expansion, thereby enabling the laminate to be used in conjunction with leadless electronic components. In addition, a novel method is disclosed for fabricating one embodiment of the subject invention and includes a unique two-step lamination process which permits apertures to be provided in the metal stabilizing layer and allows the bonding epoxy resin to solidify within the apertures, while simultaneously preventing the entrapment of air. In another embodiment of the subject invention the stabilizing layer is formed of a composite metal-dielectric laminate enabling the layer to be provided with a non-contiguous floating type pattern.