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1.发明授权Multi-layer metal core circuit board laminate with a controlled thermal coefficient of expansion 失效多层金属芯电路板层压板具有受控的热膨胀系数
公开(公告)号：US4496793A
公开(公告)日：1985-01-29
申请号：US461061
申请日：1983-01-26
CPC分类号： H05K1/03 , B32B15/14 , H05K2201/0355 , H05K2201/068 , H05K2201/09309 , H05K2201/09781 , H05K3/429 , H05K3/4611 , Y10S428/901 , Y10T29/49126 , Y10T428/24347 , Y10T428/24942
摘要： The subject invention relates to a multi-layer circuit board laminate which includes one or more stabilizing metal sheets for reducing the thermal coefficient of expansion of the laminate. In addition, a novel two-step fabrication method is disclosed which permits apertures to be provided in the metal stabilizing layer and prevents the entrapment of air in those apertures as they are filled with epoxy.A multi-layer circuit board laminate is disclosed having a controlled thermal coefficient of expansion which is particularly useful in conjunction with leadless components. The subject invention includes incorporating one or more stabilizing metal sheets into a composite multi-layer circuit board laminate assembly. The stabilizing metal sheets function to significantly reduce the circuit board laminate's thermal coefficient of expansion, thereby enabling the laminate to be used in conjunction with leadless electronic components. In addition, a novel method is disclosed for fabricating one embodiment of the subject invention and includes a unique two-step lamination process which permits apertures to be provided in the metal stabilizing layer and allows the bonding epoxy resin to solidify within the apertures, while simultaneously preventing the entrapment of air. In another embodiment of the subject invention the stabilizing layer is formed of a composite metal-dielectric laminate enabling the layer to be provided with a non-contiguous floating type pattern.
摘要翻译： 本发明涉及一种多层电路板层压板，其包括用于降低层压板的热膨胀系数的一种或多种稳定金属板。 此外，公开了一种新颖的两步制造方法，其允许在金属稳定层中提供孔，并且防止在它们填充有环氧树脂时在这些孔中捕获空气。 公开了一种具有受控的热膨胀系数的多层电路板层压板，其特别适用于无引线部件。 本发明包括将一种或多种稳定金属片合并到复合多层电路板层叠组件中。 稳定金属片起到显着降低电路板层压板的热膨胀系数的作用，从而能够将层压板与无引线电子部件结合使用。 另外，公开了一种用于制造本发明的一个实施例的新颖方法，并且包括一种独特的两步层压工艺，其允许在金属稳定层中提供孔，并允许粘合环氧树脂在孔内固化，同时 防止空气的夹带。 在本发明的另一个实施方案中，稳定层由复合金属 - 电介质层压体形成，使该层能够提供非连续的浮动型图案。
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2.发明授权Method for making multi-layer metal core circuit board laminate with a controlled thermal coefficient of expansion 失效制造具有受控热膨胀系数的多层金属芯电路板层压板的方法
公开(公告)号：US4522667A
公开(公告)日：1985-06-11
申请号：US443275
申请日：1982-11-22
CPC分类号： B32B15/14 , H05K1/03 , H05K2201/0355 , H05K2201/068 , H05K2201/09309 , H05K2201/09781 , H05K3/429 , H05K3/4611 , Y10S428/901 , Y10T29/49155 , Y10T428/12396
摘要： A multi-layer circuit board laminate is disclosed having a controlled thermal coefficient of expansion which is particularly useful in conjunction with leadless components. The subject invention includes incorporating one or more stabilizing metal sheets into a composite multi-layer circuit board laminate assembly. The stabilizing metal sheets function to significantly reduce the circuit board laminate's thermal coefficient of expansion, thereby enabling the laminate to be used in conjunction with leadless electronic components. In addition, a novel method is disclosed for fabricating one embodiment of the subject invention and includes a unique two-step lamination process which permits apertures to be provided in the metal stabilizing layer and allows the bonding epoxy resin to solidify within the apertures, while simultaneously preventing the entrapment of air. In another embodiment of the subject invention the stabilizing layer is formed of a composite metal-dielectric laminate enabling the layer to be provided with a non-contiguous floating type pattern.
摘要翻译： 公开了一种具有受控的热膨胀系数的多层电路板层压板，其特别适用于无引线部件。 本发明包括将一种或多种稳定金属片合并到复合多层电路板层叠组件中。 稳定金属片起到显着降低电路板层压板的热膨胀系数的作用，从而能够将层压板与无引线电子部件结合使用。 另外，公开了一种用于制造本发明的一个实施例的新颖方法，并且包括一种独特的两步层压工艺，其允许在金属稳定层中提供孔，并允许粘合环氧树脂在孔内固化，同时 防止空气的夹带。 在本发明的另一个实施方案中，稳定层由复合金属 - 电介质层压体形成，使该层能够提供非连续的浮动型图案。
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