发明授权
US4610910A Printed circuit board, process for preparing the same and resist ink
used therefor
失效
印刷电路板，其制备方法和抵抗用于其的油墨
- 专利标题： Printed circuit board, process for preparing the same and resist ink used therefor
- 专利标题（中）： 印刷电路板，其制备方法和抵抗用于其的油墨
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申请号： US655426申请日： 1984-09-28
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公开(公告)号： US4610910A公开(公告)日： 1986-09-09
- 发明人: Mineo Kawamoto , Kanji Murakami , Haruo Akahoshi , Yoichi Matsuda , Motoyo Wajima , Makoto Matsunaga , Shoji Kawakubo , Toyofusa Yoshimura , Haruo Suzuki , Tomio Yoshida
- 申请人： Mineo Kawamoto , Kanji Murakami , Haruo Akahoshi , Yoichi Matsuda , Motoyo Wajima , Makoto Matsunaga , Shoji Kawakubo , Toyofusa Yoshimura , Haruo Suzuki , Tomio Yoshida
- 申请人地址： JPX Tokyo
- 专利权人： Hitachi, Ltd.
- 当前专利权人： Hitachi, Ltd.
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX58-180648 19830930
- 主分类号： H05K3/42
- IPC分类号： H05K3/42 ; C23C18/16 ; H05K3/18 ; C23C18/28
摘要：
A printed circuit board comprising an insulating board deposited with a catalyst having reactivity against electroless plating deposition, a resist for electroless plating provided on the insulating board excepting the part where a circuit is to be formed and a circuit formed by electroless plating, wherein the resist for electroless plating contains a coupling agent having a function of preventing the catalyst from ionizing. A process for producing the printed circuit board in which the insulating board surface excepting the part where a circuit is to be formed is covered with a resist for electroless plating containing a coupling agent having a function of preventing the catalyst from ionizing. Use of said resist for electroless plating can prevent drop of insulation resistance of the insulating board after moisture absorption.
公开/授权文献
- US5684212A Nitrile removal process and etherification process with same 公开/授权日：1997-11-04
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