发明授权
- 专利标题: Epoxy resin composition for encapsulation of semiconductor devices
- 专利标题(中): 用于半导体器件封装的环氧树脂组合物
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申请号: US865416申请日: 1986-05-21
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公开(公告)号: US4701482A公开(公告)日: 1987-10-20
- 发明人: Kunio Itoh , Toshio Shiobara , Koji Futatsumori , Kazutoshi Tomiyoshi , Hisashi Shimizu
- 申请人: Kunio Itoh , Toshio Shiobara , Koji Futatsumori , Kazutoshi Tomiyoshi , Hisashi Shimizu
- 申请人地址: JPX Tokyo
- 专利权人: Shin-Etsu Chemical Co., Ltd.
- 当前专利权人: Shin-Etsu Chemical Co., Ltd.
- 当前专利权人地址: JPX Tokyo
- 优先权: JPX60-111557 19850524
- 主分类号: C08G59/00
- IPC分类号: C08G59/00 ; C08G59/18 ; C08K3/00 ; C08L63/00 ; H01L23/29 ; H01L23/31 ; C08K3/24 ; C08K9/06
摘要:
An epoxy resin-based composition suitable for encapsulation of semiconductor devices is proposed. The resin composition is capable of giving a cured resin encapsulation highly resistant against crack formation by virtue of the unique ingredient therein, in addition to the thermally curable epoxy resin and an inorganic filler, which is a combination of an organopolysiloxane having a hydrocarbon group substituted by certain functional groups, e.g. glycidyl, amino, mercapto and the like, and a block copolymer composed of the segments of a polymeric aromatic moiety and segments of an organopolysiloxane moiety.
公开/授权文献
- US5913580A Structure of drawer type storage bin 公开/授权日:1999-06-22
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