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公开(公告)号：US5053445A
公开(公告)日：1991-10-01
申请号：US397739
申请日：1989-08-23
CPC分类号： C08G59/027 , C08G77/42 , C08L63/00 , H05K1/0353
摘要： An epoxy resin composition which comprises a curable epoxy resin, a curing agent, an inorganic filler, and at least one copolymer selected from copolymers obtained by an addition reaction between aromatic polymers containing one or more epoxy groups and one or more alkenyl groups and the specific organopolysiloxanes; copolymers obtained by an addition reaction between aromatic polymers containing one or more epoxy groups and the specific amino group-containing organopolysiloxanes.
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公开(公告)号：US4877822A
公开(公告)日：1989-10-31
申请号：US179538
申请日：1988-04-08
CPC分类号： C08G59/027 , C08G77/42 , C08L63/00 , H05K1/0353
摘要： An epoxy resin composition which comprises a curable epoxy resin, a curing agent, an inorganic filler, and at least one copolymer selected from copolymers obtained by an addition reaction between aromatic polymers containing one or more epoxy groups and one or more alkenyl groups and the specific organopolysiloxanes; copolymers obtained by an addition reaction between aromatic polymers containing one or more epoxy groups and the specific amino group-containing organopolysiloxanes.
摘要翻译： 一种环氧树脂组合物，其包含可固化环氧树脂，固化剂，无机填料和至少一种共聚物，所述共聚物选自通过在含有一个或多个环氧基和一个或多个烯基的芳族聚合物之间的加成反应获得的共聚物， 有机聚硅氧烷; 通过含有一个或多个环氧基的芳族聚合物与特定含氨基的有机聚硅氧烷之间的加成反应获得的共聚物。
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公开(公告)号：US4701482A
公开(公告)日：1987-10-20
申请号：US865416
申请日：1986-05-21
CPC分类号： H01L23/293 , C08K3/0033 , C08L63/00 , H01L2924/0002
摘要： An epoxy resin-based composition suitable for encapsulation of semiconductor devices is proposed. The resin composition is capable of giving a cured resin encapsulation highly resistant against crack formation by virtue of the unique ingredient therein, in addition to the thermally curable epoxy resin and an inorganic filler, which is a combination of an organopolysiloxane having a hydrocarbon group substituted by certain functional groups, e.g. glycidyl, amino, mercapto and the like, and a block copolymer composed of the segments of a polymeric aromatic moiety and segments of an organopolysiloxane moiety.
摘要翻译： 提出了适用于半导体器件封装的基于环氧树脂的组合物。 除了可热固化的环氧树脂和无机填料之外，树脂组合物还可以通过其中独特的成分提供高度抗裂纹形成的固化树脂封装，该无机填料是具有被烃基取代的烃基的有机聚硅氧烷的组合 某些功能组，例如 缩水甘油基，氨基，巯基等，以及由聚合芳族部分的链段和有机聚硅氧烷部分的链段组成的嵌段共聚物。
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4.发明授权Epoxy resin compositions containing polysubstituted novolac epoxy resins and naphthylene based phenolic resin curing agents and semiconductor devices encapsulated therewith 失效含有多羟基化合物环氧树脂和基于苯乙烯的酚醛树脂固化剂的环氧树脂组合物和其中包含的半导体器件
公开(公告)号：US5166228A
公开(公告)日：1992-11-24
申请号：US739447
申请日：1991-08-02
IPC分类号： C08G59/62 , C08G8/00 , C08G8/08 , C08G59/00 , C08G59/08 , C08G59/20 , C08G59/32 , C08L63/00 , C08L63/04 , C08L83/05 , H01B3/40 , H01L23/29 , H01L23/31
摘要： An epoxy resin composition comprising (A) a specific epoxy resin, (B) a phenolic resin having at least one naphthalene ring in a molecule, and (C) an inorganic filler has improved flow and cures into products having a low coefficient of expansion, high Tg, and low moisture absorption. The composition is suitable for encapsulating semiconductor devices.
摘要翻译： 包含（A）特定环氧树脂，（B）在分子中具有至少一个萘环的酚醛树脂和（C）无机填料的环氧树脂组合物具有改善的流动性并固化成具有低膨胀系数的产品， 高Tg，低吸湿性。 该组合物适用于封装半导体器件。
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公开(公告)号：US5137940A
公开(公告)日：1992-08-11
申请号：US476700
申请日：1990-02-08
摘要： A semiconductor encapsulating epoxy resin composition comprising an epoxy resin, a curing agent, and an inorganic filler is improved in melt flow and moldability when the filler comprises spherical silica having a mean particle size of 5 to 35 .mu.m and a specific surface area of up to 1.4 m.sup.2 /g. A mixture of (A) spherical silica having a mean particle size of 0.1 to 2 .mu.m, and (C) ground silica having a mean particle size of 2 to 15 .mu.m is also useful as the filler. A cured product thereof has a low coefficient of expansion and improved crack resistance upon soldering after moisture absorption.
摘要翻译： 包含环氧树脂，固化剂和无机填料的半导体封装环氧树脂组合物在熔体流动性和成型性方面得到改善，当填料包括平均粒度为5至35μm的球形二氧化硅和比表面积 至1.4m2 / g。 平均粒径为0.1〜2μm的（A）球状二氧化硅和（C）平均粒径为2〜15μm的研磨二氧化硅的混合物也可用作填料。 其固化产物在吸湿后焊接时具有低膨胀系数和改善的抗裂性。
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6.发明授权Epoxy resin composition and semiconductor device encapsulated therewith containing polymaleimide and (allyl-epoxy)novolac/siloxane graft copolymer 失效环氧树脂组合物和包封聚马来酰亚胺和（烯丙基 - 环氧）酚醛清漆/硅氧烷接枝共聚物的半导体器件
公开(公告)号：US5006614A
公开(公告)日：1991-04-09
申请号：US373286
申请日：1989-06-29
申请人： Kunio Itoh , Toshio Shiobara , Koji Futatsumori
发明人： Kunio Itoh , Toshio Shiobara , Koji Futatsumori
IPC分类号： C09K3/10 , C08G59/00 , C08G59/08 , C08G59/14 , C08G59/40 , C08L63/00 , C08L63/04 , C08L79/08 , C08L83/10 , C09D5/03 , C09D5/46 , C09D103/04 , C09D163/00 , H01L23/29 , H01L23/31
摘要： A curable epoxy resin is blended with (a) an alkenyl group-containing epoxidized novolak resin/organopolysiloxane copolymer and (b) a polyimide resin in addition to a curing agent and an inorganic filler. The resulting epoxy resin composition can be cured both under moisture-free conditions and even under moist conditions without inducing a crack. It is suitable for the encapsulation of semiconductor devices as well as for molding and powder coating.
摘要翻译： 可固化环氧树脂与（a）含烯基的环氧化酚醛清漆树脂/有机聚硅氧烷共聚物和（b）除了固化剂和无机填料之外的聚酰亚胺树脂共混。 所得到的环氧树脂组合物可以在无湿度条件下甚至在潮湿条件下都不会发生裂纹。 它适用于半导体器件的封装以及模制和粉末涂层。
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公开(公告)号：US4902732A
公开(公告)日：1990-02-20
申请号：US928654
申请日：1986-11-05
摘要： The present invention provides a novel epoxy resin-based curable composition suitable for use as an encapsulating resin composition for semiconductor devices capable of being highly resistant against crack formation with low internal stress by curing and yet having very high heat conductivity and maintaining high glass transition temperature. The inventive composition comprises (a) 100 parts by weight of a curable epoxy resin blend which is a mixture of an epoxy resin and a curing agent therefor, (b) from 5 to 100 parts by weight of a block copolymer composed of at least one segment of an aromatic polymeric moiety, phenyl novolac, and at least one segment of an organopolysiloxane moiety having 30 to 200 silicon atoms and bonded to the aromatic polymeric moiety through a carbon-to-silicon linkage, and optionally (c) an inorganic filler which is preferably a silica filler such as powdered quartz in an amount not exceeding 1000 parts by weight.
摘要翻译： 本发明提供一种适用于半导体器件的封装树脂组合物的新型环氧树脂类固化性组合物，能够通过固化而具有低内应力的高裂纹形成，并具有非常高的导热性和保持高的玻璃化转变温度 。 本发明的组合物包含（a）100重量份作为环氧树脂和其固化剂的混合物的可固化环氧树脂共混物，（b）5至100重量份的由至少一种 芳族聚合物部分的段，苯基酚醛清漆和至少一个具有30-200个硅原子的有机聚硅氧烷部分，并通过碳 - 硅键连接到芳族聚合物部分，和任选地（c）无机填料， 优选为不超过1000重量份的二氧化硅填料，例如石英粉末。
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8.发明授权
公开(公告)号：US5298548A
公开(公告)日：1994-03-29
申请号：US885965
申请日：1992-05-20
IPC分类号： C08G59/24 , C08G59/00 , C08G59/20 , C08G59/32 , C08G59/38 , C08G59/62 , C08L63/00 , H01B3/40 , H01L23/29 , H01L23/31 , C08G59/22
CPC分类号： H01B3/40 , C08G59/3218 , C08G59/38 , C08L63/00
摘要： An epoxy resin composition comprising (A) a naphthalene ring-containing epoxy resin, (B) a biphenyl-containing epoxy resin, (C) a specific phenolic resin, and (D) an inorganic filler shows good flow and cures to products having low modulus of elasticity, especially at temperatures above Tg, a low coefficient of expansion, high Tg irrespective of low stresses, and minimized water absorption. Then semiconductor devices encapsulated with the present composition remain highly reliable even after being subject to thermal shocks upon surface mounting.
摘要翻译： 包含（A）含萘环氧树脂，（B）含联苯的环氧树脂，（C）特定酚醛树脂和（D）无机填料的环氧树脂组合物显示出良好的流动性和固化性， 弹性模量，特别是在高于Tg的温度下，低膨胀系数，高Tg，不论低应力如何，吸水率最小化。 然后，即使在表面安装时受到热冲击，用本发明组合物封装的半导体器件也保持高度可靠性。
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公开(公告)号：US5243058A
公开(公告)日：1993-09-07
申请号：US824967
申请日：1992-01-24
IPC分类号： C07C39/225 , C07C43/215 , C07D303/24 , C08G59/24 , C08G59/32 , C08G59/40
CPC分类号： C07C43/215 , C07C39/225 , C07D303/24 , C08G59/245 , C08G59/3218 , C08G59/4042
摘要： A naphthalene derivative of the following general formula (1) having at least one allyl or propenyl group is described. ##STR1## In the formula, each G represents a hydrogen atoms or ##STR2## R.sup.1 's independently represent a hydrogen atom, an allyl group or a propenyl group provided that at least one or R.sup.1 's is an allyl group or a propenyl group, and R.sup.2 's independently represent a hydrogen atom, an unsubstituted or substituted monovalent hydrocarbon group having from 1 to 6 carbon atoms, or a halogen atom. The derivative is useful for modifying curable resins or resin compositions to provide cured products which have a low water absorption, high strength and a high glass transition temperature. The derivative has good working properties and a good heat resistance.
摘要翻译： 描述了具有至少一个烯丙基或丙烯基的下述通式（1）的萘衍生物。 （1）在该式中，每个G表示氢原子，或者如果至少一个或R 1为烯丙基或丙烯基，则R 1独立地表示氢原子，烯丙基或丙烯基， 并且R 2独立地表示氢原子，具有1至6个碳原子的未取代或取代的一价烃基或卤素原子。 该衍生物可用于改性可固化树脂或树脂组合物以提供具有低吸水性，高强度和高玻璃化转变温度的固化产物。 该衍生物具有良好的加工性能和良好的耐热性。
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公开(公告)号：US5171869A
公开(公告)日：1992-12-15
申请号：US825222
申请日：1992-01-24
IPC分类号： C07D303/27 , C07C39/225 , C07D303/24 , C08F290/00 , C08F299/02 , C08G8/08 , C08G8/24 , C08G8/36 , C08G59/08 , C08G59/32
CPC分类号： C07D303/24 , C08G59/3218 , C08G8/08
摘要： A naphthalene of the following formula (1) having at least two allyl or propenyl groups ##STR1## wherein each G represents a hydrogen atoms or ##STR2## R.sup.1 's independently represent a hydrogen atom or an unsubstituted or substituted monovalent hydrocarbon group having from 1 to 6 carbon atoms, R.sup.2 's independently represent a hydrogen atom, an allyl group or a propenyl group, R.sup.3 represents an allyl group or a propenyl group, X represents a hydrogen atom or a halogen atom, and n is an integer of from 0 to 6. The derivative is useful for modifying curable resins or resin compositions to provide cured products which have a low water absorption, high strength and a high glass transition temperature. The derivative has good working properties and a good heat resistance.
摘要翻译： 具有至少两个烯丙基或丙烯基的下式（1）的萘，其中每个G表示氢原子，或者R 1独立地表示氢原子或未取代或取代的一价烃基，其具有 1〜6个碳原子，R2独立地表示氢原子，烯丙基或丙烯基，R3表示烯丙基或丙烯基，X表示氢原子或卤素原子，n表示0〜 该衍生物可用于改性可固化树脂或树脂组合物以提供具有低吸水性，高强度和高玻璃化转变温度的固化产物。 该衍生物具有良好的加工性能和良好的耐热性。
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