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US4753821A Process for the partial metallization of substrate surfaces 失效
用于衬底表面部分金属化的工艺

Process for the partial metallization of substrate surfaces
摘要:
A process suitable for the fully additive technique for the electroless partial metallization of substrate surfaces consists in treating the surface with photosensitive silver(I) compounds (e.g. carboxylic acid salts), partially exposing the silver(I) compounds left behind on the surfaces, if necessary intensifying the exposure effect and/or exchanging the silver produced during the exposure for nobler metals, and detaching the unexposed silver(I) compounds.
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