摘要:
Primers, essentially consisting of a film former or matrix former, an additive, an ionic and/or colloidal noble metal, a filler and a solvent, are suitable for coating substrate surfaces for subsequent chemical metallization.
摘要:
The firmly adhesive metallization, in particular partial metallization, of the surface of semiconductors is possible, without pickling, by carrying out the activation with organometallic compounds of metals of the I and VIII Secondary Groups of the Periodic Table of Elements, then reducing in a conventional manner and metallization without current.
摘要:
The invention relates to pharmaceutical compositions containing, as an active ingredient, a water-soluble polyester or polycarbonate based on one or more polyetherglycols of Formula (I) as defined in the specification. Also included in the invention is the use of said compositions for their tumor-inhibiting action.
摘要:
The invention relates to semipermeable membranes with a water absorption capacity of from 4.5 to 11% by weight, preferably from 4.5 to 8% by weight, as measured on approximately 40.mu. thick symmetrical films at room temperature and at 65% relative air humidity, a throughflow of 130 to 200 l/m.sup.2 d for a desalination level of 94.6 to 99.5% and consisting of an aromatic heterocycle-containing copolyamide with a relative viscosity of .gtoreq.1.4, as measured on a 0.5% N-methyl pyrrolidone solution at a temperature of 20.degree. C.
摘要:
Flexible circuits are obtained in an elegant manner, without the customary etching methods, wet-chemically in accordance with the principles of semiadditive or fully additive technology by using for the activation noble metal activators and, as base material, films or flexible boards whose surface has (a) a specific total pore volume per unit area of 0.015-0.045 dm.sup.3/ m.sup.2, (b) an average pore diameter of 0.05-5.0 .mu.m and (c) an average pore depth of 0.05-4.0 .mu.m.
摘要翻译:柔性电路以优雅的方式获得,没有常规的蚀刻方法,根据半辅助或全添加技术的原理湿法化学,通过使用活化贵金属活化剂和作为基材的膜或柔性板,其表面具有 (a)每单位面积的特定总孔体积为0.015-0.045dm 3 / m 2,(b)平均孔径为0.05-5.0μm,(c)平均孔深为0.05-4.0μm。
摘要:
Polymer membranes metallized by wet chemistry are highly suitable, for example, for the separation of inert, reactive and fermentation gases.The metallization is carried out after activation with noble-metal complex compounds which have at least two functional groups.Preferred metal coatings are those of Cu, Co and Ni.
摘要:
Activation baths containing an organometallic compound based on elements of sub-group 1 or 8 of the periodic table with a "guest/host" interrelationship are outstandingly suitable for electroless metallization of preferably non-metallic substrates. Activators of palladium compounds and cyclic crown ethers are particularly suitable.
摘要:
A mild activation process for the adhesion-activation of polyamide mouldings for electroless metallization comprises treating the substrates, successively or simultaneously, with the solution of a mixture of CaCl.sub.2, LiCl and/or MgCl.sub.2 with AlCl.sub.3, FeCl.sub.3 and/or TiCl.sub.4 in a lower alcohol and with an activator solution based on inorganic complex compounds of the formulaM.sup.n+ [E.sup.m+ Hal.sub.z.sup.- ]in whichM represents two hydrogen or alkali metal atoms or one alkaline earth metal atom,Hal represents a halogen, preferably Cl, andE represents a noble metal atom of the 1st or 8th subgroup of the periodic table, having the valency m and the coordination number z (z-m=n),or with customary colloidal or ionic systems of these noble metals.
摘要:
Activator formulations which contain an aromatic polyurethane as binder are highly suitable for the preparation of non-metallic substrate surfaces for currentless metallization.The metal coatings produced are distinguished by good adhesion.
摘要:
Conductor boards with well adhering conductor tracks are obtained if the substrates, which are clad on both sides with copper foils, have said cladding removed chemically or mechanically, are activated, if necessary sensitized, and are provided with a 0.05-2.0 .mu.m thick layer of nickel, cobalt, manganese, a nickel/iron or nickel/cobalt mixture in an electroless metallizing bath, a 0.5-5.0 .mu.m thick copper layer is applied in a subsequent copper bath and the conductor pattern is then built up by the standard semi-additive methods.