发明授权
US4827327A Integrated circuit device having stacked conductive layers connecting
circuit elements therethrough
失效
集成电路器件，其具有通过其连接电路元件的堆叠导电层
- 专利标题： Integrated circuit device having stacked conductive layers connecting circuit elements therethrough
- 专利标题（中）： 集成电路器件，其具有通过其连接电路元件的堆叠导电层
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申请号： US214838申请日： 1988-07-05
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公开(公告)号： US4827327A公开(公告)日： 1989-05-02
- 发明人: Akira Miyauchi , Hiroshi Nishimoto , Tadashi Okiyama , Hiroo Kitasagami , Masahiro Sugimoto , Haruo Tamada , Shinji Emori
- 申请人： Akira Miyauchi , Hiroshi Nishimoto , Tadashi Okiyama , Hiroo Kitasagami , Masahiro Sugimoto , Haruo Tamada , Shinji Emori
- 申请人地址： JPX Kawasaki
- 专利权人： Fujitsu Limited
- 当前专利权人： Fujitsu Limited
- 当前专利权人地址： JPX Kawasaki
- 优先权： JPX60-077549 19850413
- 主分类号： H01L23/12
- IPC分类号： H01L23/12 ; H01L21/60 ; H01L23/057 ; H01L23/498 ; H01L23/64 ; H01P1/00 ; H01P3/08 ; H01P5/00 ; H01P5/02 ; H01P5/08 ; H05K1/02 ; H05K1/18 ; H05K3/32 ; H05K3/40 ; H01L23/14 ; H01L23/52
摘要：
An integrated circuit device including a stacked layer unit having a plurality of stacked layers each having an insulation layer and at least one conductive layer strip formed on a surface of the insulation layer, and at least one chip mounted on the top of the insulation layer and having a plurality of circuit elements. The IC device also includes at least one first conductive member formed in the stacked layer unit, having a low inductance for first signals applied thereto and operatively connecting the first signals to be transferred between the circuit elements. The IC device further includes at least one second conductive member formed in the stacked layer unit, having a higher inductance for the first signals than that of the first conductive member and operatively connecting second signals to be transferred between the circuit elements the stacked layer unit, the chip, and the first and second conductive members are enclosed by a package and sealed with a hermetic seal.
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