发明授权
- 专利标题： Optical interconnections for integrated circuits
- 专利标题（中）： 集成电路的光互连
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申请号： US100742申请日： 1987-09-24
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公开(公告)号： US4835595A公开(公告)日： 1989-05-30
- 发明人: Shigeru Oho , Kazuji Yamada , Shigeki Tsuchitani
- 申请人： Shigeru Oho , Kazuji Yamada , Shigeki Tsuchitani
- 申请人地址： JPX Tokyo
- 专利权人： Hitachi, Ltd.
- 当前专利权人： Hitachi, Ltd.
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX61-224907 19860925
- 主分类号： H01L27/14
- IPC分类号： H01L27/14 ; H01L27/144 ; H01L27/15 ; H01L31/0216 ; H01L31/0232 ; H01L31/10 ; H01L31/12 ; H04B10/00 ; H04B10/2507
摘要：
An optical interconnection in a semiconductor integrated circuit includes an opaque coating provided on a surface of the integrated circuit chip. The opaque coating has therein an opening which is positioned above a light receiving element incorporated in the chip and is filled with a transparent material layer. The transparent layer may have a lens action and/or a wavelength-selectivity.
公开/授权文献
- USD418456S Tire tread 公开/授权日：2000-01-04
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