公开(公告)号：US4835595A

公开(公告)日：1989-05-30

申请号：US100742

申请日：1987-09-24

申请人： Shigeru Oho ,  Kazuji Yamada ,  Shigeki Tsuchitani

发明人： Shigeru Oho ,  Kazuji Yamada ,  Shigeki Tsuchitani

IPC分类号： H01L27/14 ,  H01L27/144 ,  H01L27/15 ,  H01L31/0216 ,  H01L31/0232 ,  H01L31/10 ,  H01L31/12 ,  H04B10/00 ,  H04B10/2507

CPC分类号： H01L31/0232 ,  H01L27/1443 ,  H01L31/02164 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/16152

摘要： An optical interconnection in a semiconductor integrated circuit includes an opaque coating provided on a surface of the integrated circuit chip. The opaque coating has therein an opening which is positioned above a light receiving element incorporated in the chip and is filled with a transparent material layer. The transparent layer may have a lens action and/or a wavelength-selectivity.

摘要翻译： 半导体集成电路中的光互连包括设置在集成电路芯片的表面上的不透明涂层。 不透明涂层在其中具有开口，该开口位于结合在芯片中的光接收元件上方，并且填充有透明材料层。 透明层可具有透镜作用和/或波长选择性。

公开(公告)号：US4896930A

公开(公告)日：1990-01-30

申请号：US158706

申请日：1988-02-22

申请人： Shigeki Tsuchitani ,  Kazuji Yamada

发明人： Shigeki Tsuchitani ,  Kazuji Yamada

IPC分类号： G02B6/12 ,  G02F1/01 ,  G02F1/065 ,  G02F1/313 ,  G02F1/35 ,  G02F1/355 ,  G02F1/361

CPC分类号： G02F1/065 ,  G02F1/3138 ,  G02F1/0147 ,  G02F1/3137

摘要： The present invention relates to an optical functional device of an optical waveguide type, particularly to an optical waveguide type with an organic nonlinear optical material suitable for the use in the fields of optical communication or optical information processing. In other words, the present invention provides an optical functional device having an organic nonlinear optical material as an optical waveguide embedded into the surface of a substrate and being an organic nonlinear optical material charged into a hollow part which is composed of a channel as a slit provided on the surface of said substrate and a further substrate for covering the upper part of the channel.

摘要翻译： 本发明涉及一种光波导型的光功能器件，特别涉及适合于在光通信或光信息处理领域中使用的有机非线性光学材料的光波导型。 换句话说，本发明提供一种光学功能元件，其具有嵌入到基板的表面的作为光波导的有机非线性光学材料，并且是装入中空部分的有机非线性光学材料，所述中空部分由通道作为狭缝 设置在所述基板的表面上，以及另一基板，用于覆盖通道的上部。

公开(公告)号：US06588647B2

公开(公告)日：2003-07-08

申请号：US10228295

申请日：2002-08-27

申请人： Kazuji Yamada ,  Akihiro Tamba ,  Takayoshi Nakamura ,  Ryuichi Saito ,  Toshio Ogawa ,  Hisanori Okamura

发明人： Kazuji Yamada ,  Akihiro Tamba ,  Takayoshi Nakamura ,  Ryuichi Saito ,  Toshio Ogawa ,  Hisanori Okamura

IPC分类号： B23K2012

CPC分类号： H05K7/20872 ,  H01L2924/0002 ,  H05K7/20927 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/4935 ,  H01L2924/00

摘要： A liquid-cooled circuit device including: a module having a circuit element and a module base plate on surface of which the circuit element is mounted; a circuit case for accommodating the module; and a cooling liquid chamber for flowing a cooling liquid in contact with a back face of the module base plate of said module. The module base plate of the module is fitted into an opening provided in a member forming the cooling liquid chamber and welded without a gap.

公开(公告)号：US5097318A

公开(公告)日：1992-03-17

申请号：US331802

申请日：1989-04-03

申请人： Akira Tanaka ,  Kazuji Yamada ,  Hirokazu Inoue ,  Hideo Arakawa ,  Masahide Okamoto

发明人： Akira Tanaka ,  Kazuji Yamada ,  Hirokazu Inoue ,  Hideo Arakawa ,  Masahide Okamoto

IPC分类号： H01L23/538 ,  H01L23/04 ,  H01L23/057 ,  H01L23/12 ,  H01L23/467 ,  H01L23/498 ,  H01L23/50

CPC分类号： H01L23/49822 ,  H01L23/057 ,  H01L23/467 ,  H01L23/49838 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/30107

摘要： A cavity-down type package for a semiconductor device comprises an insulating base substrate on which the semiconductor device and another insulating cap substrate with plural outer connection terminals on its outer surface and with electrodes provided on conductive layers for electric conduction on its inner surface. The electrodes on the insulating base substrate and those on the insulating cap substrate are connected with each other by using conductive material such as bumps.

摘要翻译： 一种用于半导体器件的降空型封装，包括其上安装有半导体器件（1）的绝缘基底（6）和在其外表面上具有多个外连接端子（5）的另一绝缘帽衬底（8） 其中电极（11）设置在导电层（4）上，用于在其内表面上导电。 绝缘基底基板上的电极和绝缘帽基板（8）上的电极通过诸如凸块的导电材料相互连接。

公开(公告)号：US5095359A

公开(公告)日：1992-03-10

申请号：US413622

申请日：1989-09-28

申请人： Akira Tanaka ,  Hirokazu Inoue ,  Kazuji Yamada ,  Kunio Miyazaki ,  Osamu Miura ,  Hideo Arakawa ,  Hiroshi Yokoyama ,  Yoshio Naganuma ,  Atsushi Morihara ,  Katsunori Ouchi

发明人： Akira Tanaka ,  Hirokazu Inoue ,  Kazuji Yamada ,  Kunio Miyazaki ,  Osamu Miura ,  Hideo Arakawa ,  Hiroshi Yokoyama ,  Yoshio Naganuma ,  Atsushi Morihara ,  Katsunori Ouchi

IPC分类号： G06F1/18 ,  H01L21/60 ,  H01L23/057 ,  H01L23/467 ,  H01L23/498 ,  H01L23/50 ,  H01L25/065

CPC分类号： H01L23/467 ,  H01L23/057 ,  H01L23/49822 ,  H01L23/50 ,  H01L24/32 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/32188 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/49109 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/30107

摘要： A semiconductor package for use in computers includes a insulating substrate onto which a semiconductor device is mounted, an insulating cap which shuts out outside air and seals said semiconductor device, power-source lines which provide power to the semiconductor device, and signal lines which transmit output signals from the semiconductor device to external circuits. The signal lines are arranged perpendicularly to the insulating substrate so that they are prevented from the dielectric constant of the insulating substrate, while the power-source lines are formed within the insulating substrate and connected through conductive layers parallel to the surface onto which the semiconductor is mounted to external leads.

公开(公告)号：US4670969A

公开(公告)日：1987-06-09

申请号：US694990

申请日：1985-01-25

申请人： Kazuji Yamada ,  Yutaka Kobayashi ,  Kanji Kawakami ,  Satoshi Shimada ,  Masanori Tanabe ,  Shigeyuki Kobori

发明人： Kazuji Yamada ,  Yutaka Kobayashi ,  Kanji Kawakami ,  Satoshi Shimada ,  Masanori Tanabe ,  Shigeyuki Kobori

IPC分类号： H01L29/84 ,  G01L9/00 ,  G01P15/08 ,  H01L21/428

CPC分类号： G01L9/0042 ,  G01P15/0802 ,  G01P2015/084 ,  Y10S148/012 ,  Y10S148/159 ,  Y10S148/168 ,  Y10T29/42 ,  Y10T29/49103

摘要： A method of making a silicon diaphragm pressure sensor includes forming an oxide film on one surface of a monocrystalline silicon substrate. A polycrystalline silicon layer is formed on the oxide film. The oxide film may be partly removed before the formation of the polycrystalline silicon layer. The polycrystalline silicon layer is heated and melt to recrystallize the same, thereby converting the polycrystalline silicon layer into a monocrystalline silicon layer. On the monocrystalline silicon layer may be epitaxially grown an additional monocrystalline silicon layer. By using the oxide film as an etching stopper, a predetermined portion of the substrate is etched over a range from the other surface of the substrate to the oxide film, thereby providing a diaphragm of the pressure sensor.

摘要翻译： 制造硅膜压力传感器的方法包括在单晶硅衬底的一个表面上形成氧化膜。 在氧化物膜上形成多晶硅层。 在形成多晶硅层之前可以部分地去除氧化膜。 将多晶硅层加热熔化，使其重结晶，从而将多晶硅层转化为单晶硅层。 在单晶硅层上可以外延生长另外的单晶硅层。 通过使用氧化膜作为蚀刻停止层，在从衬底的另一个表面到氧化膜的范围内蚀刻衬底的预定部分，从而提供压力传感器的隔膜。

公开(公告)号：US4527428A

公开(公告)日：1985-07-09

申请号：US442665

申请日：1982-12-30

申请人： Satoshi Shimada ,  Kazuji Yamada ,  Seikou Suzuki ,  Shigeyuki Kobori ,  Motohisa Nishihara

发明人： Satoshi Shimada ,  Kazuji Yamada ,  Seikou Suzuki ,  Shigeyuki Kobori ,  Motohisa Nishihara

IPC分类号： G01L9/00 ,  G01L13/02 ,  G01L9/06

CPC分类号： G01L19/147 ,  G01L13/025 ,  G01L19/0038 ,  G01L19/0645 ,  G01L9/0054

摘要： A semiconductor pressure transducer including a measuring diaphragm of semiconductor material for sensing pressure supported by a support member of the same material. An oxide layer and a thin glass layer are interposed between the measuring diaphragm and the support member.

摘要翻译： 一种半导体压力传感器，包括用于感测由相同材料的支撑构件支撑的压力的半导体材料的测量膜。 氧化层和薄玻璃层介于测量膜片和支撑件之间。

公开(公告)号：US4065971A

公开(公告)日：1978-01-03

申请号：US701531

申请日：1976-07-01

申请人： Michitaka Shimazoe ,  Kousuke Nakamura ,  Yasuo Matsushita ,  Satoshi Shimada ,  Kazuji Yamada ,  Yukio Takahashi

发明人： Michitaka Shimazoe ,  Kousuke Nakamura ,  Yasuo Matsushita ,  Satoshi Shimada ,  Kazuji Yamada ,  Yukio Takahashi

IPC分类号： H01L29/84 ,  G01L9/00 ,  G01L9/06

CPC分类号： G01L9/0054

摘要： A semiconductor pressure transducer includes a monocrystalline semiconductor diaphragm, the outer edges of which are fixed. When subjected to pressure, the transducer produces radial strains of opposite polarity in a central portion thereof and a portion surrounding the central portion close to the edge of the strain inducing region. The diaphragm contains a plurality of elongated resistances formed of semiconductor material of the same conductivity type which are electrically isolated from the diaphragm, per se. Resistances of an individual set which lie in proximity to one another are combined in the form of a bridge. The longitudinal direction of resistances forming one set of opposing arms of the bridge extend along axes of the same crystal system as the longitudinal direction of the elongated resistances forming the other set of opposing arms of the bridge. However, the longitudinal directions of the separate sets of resistances forming the opposing arms of the bridge lie in directions so that they do not orthogonally intersect each other.

摘要翻译： 半导体压力传感器包括其外边缘固定的单晶半导体膜片。 当经受压力时，换能器在其中心部分产生相反极性的径向应变，并且围绕中心部分的部分靠近应变诱导区域的边缘产生。 隔膜包含由与膜片电气隔离的相同导电类型的半导体材料形成的多个细长电阻。 位于彼此靠近的单个组的电阻以桥的形式组合。 形成桥的一组相对臂的电阻的纵向方向沿与构成桥的另一组相对臂的细长电阻的纵向相同的晶体系的轴线延伸。 然而，形成桥的相对臂的单独的电阻组的纵向方向在方向上，使得它们不会彼此正交相交。

公开(公告)号：US6144571A

公开(公告)日：2000-11-07

申请号：US506269

申请日：2000-02-17

申请人： Yasushi Sasaki ,  Yutaka Maeno ,  Hiroshi Fujii ,  Kinya Nakatsu ,  Toshio Ogawa ,  Akihiro Tamba ,  Kazuji Yamada

发明人： Yasushi Sasaki ,  Yutaka Maeno ,  Hiroshi Fujii ,  Kinya Nakatsu ,  Toshio Ogawa ,  Akihiro Tamba ,  Kazuji Yamada

IPC分类号： H02M7/04 ,  H01L25/16 ,  H02M7/48 ,  H05K1/14 ,  H03M7/00 ,  H01L23/043

CPC分类号： H01L25/165 ,  H01L25/162 ,  H01L2224/45124 ,  H01L2224/48137 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/19041 ,  H05K1/144

摘要： In order to bring a moduled power converter into less size and cost in the case of a structure having a lead-insert-case, an insulated metal circuit board and a printed circuit board, a difficulty was encountered in thinning a wiring width and an increase in pad area for each metal wire has interfered with a reduction in its size and cost.In the present invention to cope with it, a power converter is constructed by using a semiconductor module having such a structure that a metal base and lead frames are adhered to each other in a state in which an insulating adhesive sheet is interposed therebetween, a resin-molded outer package is adhered to the metal base with an adhesive or the like, and a resin sealing agent is charged into the resin-molded outer package to thereby integrally seal the resin-molded outer package and circuit parts such as semiconductor elements implemented therein, whereby a reduction in size and cost thereof is realized.

摘要翻译： 为了在具有引线插入壳体，绝缘金属电路板和印刷电路板的结构的情况下将模块化的功率转换器带入更小的尺寸和成本，在布线宽度变薄和增加时遇到困难 在每个金属线的焊盘区域中，其尺寸和成本受到干扰。 在本发明中，通过使用具有这样的结构的半导体模块来构成功率转换器，所述半导体模块具有金属基底和引线框架彼此粘合的状态，其间插入有绝缘粘合片，树脂 模塑的外包装用粘合剂等粘合到金属基底上，树脂密封剂装入树脂模塑的外包装中，从而将树脂模塑的外包装和其中实现的半导体元件的电路部件整体密封 从而实现了尺寸和成本的降低。

公开(公告)号：US5661343A

公开(公告)日：1997-08-26

申请号：US405791

申请日：1995-03-16

申请人： Masaaki Takahashi ,  Kazuji Yamada ,  Hideki Miyazaki ,  Kazuo Kato

发明人： Masaaki Takahashi ,  Kazuji Yamada ,  Hideki Miyazaki ,  Kazuo Kato

IPC分类号： H05K1/05 ,  H01L23/14 ,  H01L25/16 ,  H05K1/03 ,  H05K1/14 ,  H05K3/22 ,  H01L23/34

CPC分类号： H05K1/142 ,  H01L23/142 ,  H01L25/16 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19105 ,  H05K1/0306 ,  H05K1/0313 ,  H05K2201/1028 ,  H05K3/0061 ,  H05K3/222

摘要： An input-output wiring for the power circuit and a ground layer are formed on a metal substrate of a power hybrid integrated circuit apparatus. A plurality of windows are opened at predetermined positions of a circuit substrate to which electronic parts such as an IC driver, a chip resistor etc. are connected. Ceramic chips are soldered on the exposed surface of the metal substrate in the windows, and the power semiconductor elements are connected through metal bridges on the ceramic chips. Connection between lower electrode of adjoining power semiconductor elements or between lower part of the power semiconductor element and an input/output wiring is made by means of a part of the metal bridge.

摘要翻译： 用于电力电路和接地层的输入输出布线形成在功率混合集成电路装置的金属基板上。 在电路基板的与IC驱动器，片式电阻等电子部件连接的规定位置开放多个窗口。 陶瓷芯片焊接在窗户的金属基板的露出面上，功率半导体元件通过陶瓷芯片上的金属桥连接。 相邻的功率半导体元件的下电极之间或功率半导体元件的下部与输入/输出布线之间的连接通过金属桥的一部分制成。