发明授权
- 专利标题： Method of manufacturing probing head for testing equipment of semi-conductor large scale integrated circuits
- 专利标题（中）： 制造半导体大规模集成电路检测设备探测头的方法
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申请号： US358252申请日： 1989-05-30
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公开(公告)号： US4952272A公开(公告)日： 1990-08-28
- 发明人: Hironobu Okino , Akio Fujiwara , Yutaka Akiba , Susumu Kasukabe , Tsuyoshi Fujita , Masao Mitani , Kazuo Hirota
- 申请人： Hironobu Okino , Akio Fujiwara , Yutaka Akiba , Susumu Kasukabe , Tsuyoshi Fujita , Masao Mitani , Kazuo Hirota
- 申请人地址： JPX Tokyo
- 专利权人： Hitachi, Ltd.
- 当前专利权人： Hitachi, Ltd.
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX63-130130 19880530
- 主分类号： G01R31/26
- IPC分类号： G01R31/26 ; G01R1/073 ; G01R31/28 ; H01L21/66
摘要：
A probe head for use with equipment for testing a semiconductor device such as a large scale integrated circuit (LSI) includes electrode pads are formed on a circuit substrate, and a pad protecting conductive layer formed on the pads. A probe pin forming material is grown which is worked into a pin-like configuration, thereby improving a pin assembling property of a probe head portion and this realizes highly accurate pinning with high reliability.
公开/授权文献
- US4381193A Internal treatment system for glassware 公开/授权日：1983-04-26
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