发明授权
US5066357A Method for making flexible circuit card with laser-contoured vias and
machined capacitors
失效
制造具有激光波纹通孔和加工电容器的柔性电路卡的方法
- 专利标题: Method for making flexible circuit card with laser-contoured vias and machined capacitors
- 专利标题(中): 制造具有激光波纹通孔和加工电容器的柔性电路卡的方法
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申请号: US463695申请日: 1990-01-11
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公开(公告)号: US5066357A公开(公告)日: 1991-11-19
- 发明人: John B. Smyth, Jr. , Ellen R. Tappon
- 申请人: John B. Smyth, Jr. , Ellen R. Tappon
- 申请人地址: CA Palo Alto
- 专利权人: Hewlett-Packard Company
- 当前专利权人: Hewlett-Packard Company
- 当前专利权人地址: CA Palo Alto
- 主分类号: G01R1/073
- IPC分类号: G01R1/073 ; G01R1/06 ; H01L21/66 ; H05K1/00 ; H05K1/16 ; H05K3/00 ; H05K3/14
摘要:
A flexible circuit such as a membrane probe (10) is made by forming a trench (50, 60) in the upper surface (39) of a polyimide substrate (38) with a trench base (52, 62) spaced below the upper surface. The trench has an end wall (54, 64) ramped at an obtuse angle to the substrate upper surface and the trench base. A conductive layer deposited on the upper surface is patterned to form a line trace (44, 46) extending continuously over the substrate upper surface, down the ramped end wall and along the trench base, to contact a ground plane or form a distributed capacitance. An excimer laser is used, at a wavelength of 308 nm., an energy density less than 0.54 J./cm.sup.2 (preferably 0.18 to 0.35 J./cm.sup.2), and a pulse frequency of about 100 Hz., to ablate successive incremental thicknesses (80) of polyimide from the substrate in sweeps of depthwise decreasing length.
公开/授权文献
- US5658410A Apparatus and method for preparing printing labels 公开/授权日:1997-08-19
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