发明授权
US5166228A Epoxy resin compositions containing polysubstituted novolac epoxy resins
and naphthylene based phenolic resin curing agents and semiconductor
devices encapsulated therewith
失效
含有多羟基化合物环氧树脂和基于苯乙烯的酚醛树脂固化剂的环氧树脂组合物和其中包含的半导体器件
- 专利标题： Epoxy resin compositions containing polysubstituted novolac epoxy resins and naphthylene based phenolic resin curing agents and semiconductor devices encapsulated therewith
- 专利标题（中）： 含有多羟基化合物环氧树脂和基于苯乙烯的酚醛树脂固化剂的环氧树脂组合物和其中包含的半导体器件
-
申请号： US739447申请日： 1991-08-02
-
公开(公告)号： US5166228A公开(公告)日： 1992-11-24
- 发明人: Toshio Shiobara , Kazutoshi Tomiyoshi , Koji Futatsumori , Takashi Tsuchiya , Takayuki Aoki
- 申请人： Toshio Shiobara , Kazutoshi Tomiyoshi , Koji Futatsumori , Takashi Tsuchiya , Takayuki Aoki
- 申请人地址： JPX Tokyo
- 专利权人： Shin-Etsu Chemical Co., Ltd.
- 当前专利权人： Shin-Etsu Chemical Co., Ltd.
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX2-214589 19900814
- 主分类号： C08G59/62
- IPC分类号： C08G59/62 ; C08G8/00 ; C08G8/08 ; C08G59/00 ; C08G59/08 ; C08G59/20 ; C08G59/32 ; C08L63/00 ; C08L63/04 ; C08L83/05 ; H01B3/40 ; H01L23/29 ; H01L23/31
摘要：
An epoxy resin composition comprising (A) a specific epoxy resin, (B) a phenolic resin having at least one naphthalene ring in a molecule, and (C) an inorganic filler has improved flow and cures into products having a low coefficient of expansion, high Tg, and low moisture absorption. The composition is suitable for encapsulating semiconductor devices.
公开/授权文献
- US5791748A Compact disc holder 公开/授权日：1998-08-11