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1.发明授权Epoxy resin compositions containing polysubstituted novolac epoxy resins and naphthylene based phenolic resin curing agents and semiconductor devices encapsulated therewith 失效含有多羟基化合物环氧树脂和基于苯乙烯的酚醛树脂固化剂的环氧树脂组合物和其中包含的半导体器件
公开(公告)号：US5166228A
公开(公告)日：1992-11-24
申请号：US739447
申请日：1991-08-02
IPC分类号： C08G59/62 , C08G8/00 , C08G8/08 , C08G59/00 , C08G59/08 , C08G59/20 , C08G59/32 , C08L63/00 , C08L63/04 , C08L83/05 , H01B3/40 , H01L23/29 , H01L23/31
摘要： An epoxy resin composition comprising (A) a specific epoxy resin, (B) a phenolic resin having at least one naphthalene ring in a molecule, and (C) an inorganic filler has improved flow and cures into products having a low coefficient of expansion, high Tg, and low moisture absorption. The composition is suitable for encapsulating semiconductor devices.
摘要翻译： 包含（A）特定环氧树脂，（B）在分子中具有至少一个萘环的酚醛树脂和（C）无机填料的环氧树脂组合物具有改善的流动性并固化成具有低膨胀系数的产品， 高Tg，低吸湿性。 该组合物适用于封装半导体器件。
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2.发明授权
公开(公告)号：US5298548A
公开(公告)日：1994-03-29
申请号：US885965
申请日：1992-05-20
IPC分类号： C08G59/24 , C08G59/00 , C08G59/20 , C08G59/32 , C08G59/38 , C08G59/62 , C08L63/00 , H01B3/40 , H01L23/29 , H01L23/31 , C08G59/22
CPC分类号： H01B3/40 , C08G59/3218 , C08G59/38 , C08L63/00
摘要： An epoxy resin composition comprising (A) a naphthalene ring-containing epoxy resin, (B) a biphenyl-containing epoxy resin, (C) a specific phenolic resin, and (D) an inorganic filler shows good flow and cures to products having low modulus of elasticity, especially at temperatures above Tg, a low coefficient of expansion, high Tg irrespective of low stresses, and minimized water absorption. Then semiconductor devices encapsulated with the present composition remain highly reliable even after being subject to thermal shocks upon surface mounting.
摘要翻译： 包含（A）含萘环氧树脂，（B）含联苯的环氧树脂，（C）特定酚醛树脂和（D）无机填料的环氧树脂组合物显示出良好的流动性和固化性， 弹性模量，特别是在高于Tg的温度下，低膨胀系数，高Tg，不论低应力如何，吸水率最小化。 然后，即使在表面安装时受到热冲击，用本发明组合物封装的半导体器件也保持高度可靠性。
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公开(公告)号：US5225484A
公开(公告)日：1993-07-06
申请号：US798750
申请日：1991-11-27
IPC分类号： C08G59/62 , C08G59/00 , C08G59/02 , C08G59/14 , C08G59/18 , C08G59/32 , C08G59/40 , C08K5/5425 , C08L63/00 , C08L101/00 , H01L23/29 , H01L23/31
CPC分类号： C08L63/00 , C08G59/02 , C08G59/1444 , C08G59/3218 , C08L101/00
摘要： A composition comprising an epoxy resin and a curing agent is blended with a thermoplastic resin impregnated with an organic silicon compound to provide an epoxy resin composition which cures into products having improved adhesion and thermal impact and is suitable for encapsulating semiconductor devices.The impregnated thermoplastic resin is formed by swelling the thermoplastic resin with a solvent and impregnating the swollen thermoplastic resin with the organic silicon compound.
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4.发明授权
公开(公告)号：US5162400A
公开(公告)日：1992-11-10
申请号：US713841
申请日：1991-06-12
IPC分类号： C08G59/62 , C08G8/00 , C08G8/08 , C08G59/00 , C08G59/20 , C08G59/24 , C08G59/32 , C08L63/00 , H01B3/40 , H01L23/29 , H01L23/31
CPC分类号： H01L23/293 , C08G59/3218 , C08L63/00 , H01B3/40 , H01L2924/0002
摘要： An epoxy resin composition comprising (A) an epoxy resin having at least two epoxy groups in a molecule, (B) a phenolic resin having at least one naphthalene ring in a molecule, and (C) an inorganic filler has improved flow and cures into products having a low coefficient of expansion, high Tg, and low moisture absorption. The composition is thus suitable for encapsulating semiconductor devices.
摘要翻译： 一种环氧树脂组合物，其包含（A）在分子中具有至少两个环氧基的环氧树脂，（B）分子中具有至少一个萘环的酚醛树脂和（C）无机填料，具有改善的流动性和固化性 具有低膨胀系数，高Tg，低吸湿性的产品。 因此，该组合物适用于封装半导体器件。
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公开(公告)号：US5053445A
公开(公告)日：1991-10-01
申请号：US397739
申请日：1989-08-23
CPC分类号： C08G59/027 , C08G77/42 , C08L63/00 , H05K1/0353
摘要： An epoxy resin composition which comprises a curable epoxy resin, a curing agent, an inorganic filler, and at least one copolymer selected from copolymers obtained by an addition reaction between aromatic polymers containing one or more epoxy groups and one or more alkenyl groups and the specific organopolysiloxanes; copolymers obtained by an addition reaction between aromatic polymers containing one or more epoxy groups and the specific amino group-containing organopolysiloxanes.
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公开(公告)号：US5137940A
公开(公告)日：1992-08-11
申请号：US476700
申请日：1990-02-08
摘要： A semiconductor encapsulating epoxy resin composition comprising an epoxy resin, a curing agent, and an inorganic filler is improved in melt flow and moldability when the filler comprises spherical silica having a mean particle size of 5 to 35 .mu.m and a specific surface area of up to 1.4 m.sup.2 /g. A mixture of (A) spherical silica having a mean particle size of 0.1 to 2 .mu.m, and (C) ground silica having a mean particle size of 2 to 15 .mu.m is also useful as the filler. A cured product thereof has a low coefficient of expansion and improved crack resistance upon soldering after moisture absorption.
摘要翻译： 包含环氧树脂，固化剂和无机填料的半导体封装环氧树脂组合物在熔体流动性和成型性方面得到改善，当填料包括平均粒度为5至35μm的球形二氧化硅和比表面积 至1.4m2 / g。 平均粒径为0.1〜2μm的（A）球状二氧化硅和（C）平均粒径为2〜15μm的研磨二氧化硅的混合物也可用作填料。 其固化产物在吸湿后焊接时具有低膨胀系数和改善的抗裂性。
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公开(公告)号：US4877822A
公开(公告)日：1989-10-31
申请号：US179538
申请日：1988-04-08
CPC分类号： C08G59/027 , C08G77/42 , C08L63/00 , H05K1/0353
摘要： An epoxy resin composition which comprises a curable epoxy resin, a curing agent, an inorganic filler, and at least one copolymer selected from copolymers obtained by an addition reaction between aromatic polymers containing one or more epoxy groups and one or more alkenyl groups and the specific organopolysiloxanes; copolymers obtained by an addition reaction between aromatic polymers containing one or more epoxy groups and the specific amino group-containing organopolysiloxanes.
摘要翻译： 一种环氧树脂组合物，其包含可固化环氧树脂，固化剂，无机填料和至少一种共聚物，所述共聚物选自通过在含有一个或多个环氧基和一个或多个烯基的芳族聚合物之间的加成反应获得的共聚物， 有机聚硅氧烷; 通过含有一个或多个环氧基的芳族聚合物与特定含氨基的有机聚硅氧烷之间的加成反应获得的共聚物。
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公开(公告)号：US4701482A
公开(公告)日：1987-10-20
申请号：US865416
申请日：1986-05-21
CPC分类号： H01L23/293 , C08K3/0033 , C08L63/00 , H01L2924/0002
摘要： An epoxy resin-based composition suitable for encapsulation of semiconductor devices is proposed. The resin composition is capable of giving a cured resin encapsulation highly resistant against crack formation by virtue of the unique ingredient therein, in addition to the thermally curable epoxy resin and an inorganic filler, which is a combination of an organopolysiloxane having a hydrocarbon group substituted by certain functional groups, e.g. glycidyl, amino, mercapto and the like, and a block copolymer composed of the segments of a polymeric aromatic moiety and segments of an organopolysiloxane moiety.
摘要翻译： 提出了适用于半导体器件封装的基于环氧树脂的组合物。 除了可热固化的环氧树脂和无机填料之外，树脂组合物还可以通过其中独特的成分提供高度抗裂纹形成的固化树脂封装，该无机填料是具有被烃基取代的烃基的有机聚硅氧烷的组合 某些功能组，例如 缩水甘油基，氨基，巯基等，以及由聚合芳族部分的链段和有机聚硅氧烷部分的链段组成的嵌段共聚物。
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9.发明授权公开(公告)号：US06630745B1
公开(公告)日：2003-10-07
申请号：US09558384
申请日：2000-04-26
申请人： Shoichi Osada , Eiichi Asano , Shigeki Ino , Takayuki Aoki , Kazutoshi Tomiyoshi , Toshio Shiobara
发明人： Shoichi Osada , Eiichi Asano , Shigeki Ino , Takayuki Aoki , Kazutoshi Tomiyoshi , Toshio Shiobara
IPC分类号： H01L2329
CPC分类号： H01L23/293 , C08L63/00 , H01L2924/0002 , Y10T428/12528 , Y10T428/31511 , C08L83/00 , H01L2924/00
摘要： A semiconductor encapsulating epoxy resin composition is provided comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a molybdenum compound, (D-i) an organopolysiloxane, (D-ii) an organopolysiloxane cured product, or (D-iii) a block copolymer obtained by reacting an epoxy resin or alkenyl group-bearing epoxy resin with an organohydrogenpolysiloxane, and (E) an inorganic filler. The composition has improved moldability and solder crack resistance while exhibiting high flame retardance despite the absence of halogenated epoxy resins and antimony oxide.
摘要翻译： 提供半导体封装环氧树脂组合物，其包含（A）环氧树脂，（B）酚醛树脂固化剂，（C）钼化合物，（Di）有机聚硅氧烷，（D-ii）有机聚硅氧烷固化产物或（ D-iii）通过环氧树脂或含烯基的环氧树脂与有机氢聚硅氧烷反应得到的嵌段共聚物和（E）无机填料。 尽管没有卤化环氧树脂和氧化锑，该组合物具有改进的成型性和耐焊料裂纹性，同时显示出高阻燃性。
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10.发明授权公开(公告)号：US06297306B1
公开(公告)日：2001-10-02
申请号：US09310924
申请日：1999-05-13
IPC分类号： C08K310
CPC分类号： C08K3/22 , C08K3/2279 , C08K2003/2227 , C08L63/00
摘要： An epoxy resin composition comprising (A) a biphenyl skeleton epoxy resin, (B) a biphenyl skeleton phenolic resin as a curing agent, (C) molybdenum compound, and (D) an inorganic filler is suited for semiconductor encapsulation since it is effectively moldable and cures into a part having improved reflow crack resistance, moisture resistance, and flame retardance. It does not pose a hazard to human health or the environment.
摘要翻译： 一种环氧树脂组合物，其包含（A）联苯骨架环氧树脂，（B）作为固化剂的联苯骨架酚醛树脂，（C）钼化合物和（D）无机填料适合于半导体封装，因为它是有效模塑的 并固化成具有改善的回流裂纹性，耐湿性和阻燃性的部分。 它不会对人体健康或环境构成危害。
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