发明授权
- 专利标题： Hybrid integrated circuit device
- 专利标题（中）： 混合集成电路器件
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申请号： US510467申请日： 1990-04-18
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公开(公告)号： US5285107A公开(公告)日： 1994-02-08
- 发明人: Akira Kazami , Osamu Nakamoto , Hisashi Shimizu , Katsumi Ohkawa , Yasuhiro Koike , Koji Nagahama , Masao Kaneko , Masakazu Ueno , Yasuo Saitou
- 申请人： Akira Kazami , Osamu Nakamoto , Hisashi Shimizu , Katsumi Ohkawa , Yasuhiro Koike , Koji Nagahama , Masao Kaneko , Masakazu Ueno , Yasuo Saitou
- 申请人地址： JPX Osaka
- 专利权人： Sanyo Electric Co., Ltd.
- 当前专利权人： Sanyo Electric Co., Ltd.
- 当前专利权人地址： JPX Osaka
- 优先权： JPX1-100785 19890420; JPX1-100786 19890420; JPX1-119109 19890512; JPX1-119110 19890512; JPX1-119113 19890512; JPX1-120901 19890515; JPX1-120906 19890515; JPX1-122356 19890516; JPX1-122357 19890516; JPX1-123903 19890517; JPX1-123904 19890517; JPX1-124912 19890518; JPX1-124913 19890518; JPX1-127310 19890519
- 主分类号： H01L21/00
- IPC分类号： H01L21/00 ; H01L25/16 ; H05K1/14 ; H05K1/18 ; H01L23/02 ; H01L23/12
摘要：
A hybrid integrated circuit device is provided with: a microcomputer, a plurality of peripheral circuit elements, and a non-volatile memory which is positioned adjacent to the microcomputer, all of which are interconnected by a plurality of specified conductive paths; pair of integrated circuit substrates on which is formed the conductive paths and a casing provided with the pair of integrated circuit substrates secured to the upper and lower surfaces of the casing, forming a sealed space between these surfaces. The microcomputer and the peripheral circuit elements are positioned in the sealed space and only the non-volatile memory is positioned in an exposed space. The hybrid integrated circuit device of the present invention has a compact and simple form with a high degree of mounting density as well as superior handling capabilities and reliability.
公开/授权文献
- US5594991A Marking device 公开/授权日：1997-01-21
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