公开(公告)号：US5159433A

公开(公告)日：1992-10-27

申请号：US510468

申请日：1990-04-18

申请人： Akira Kazami ,  Osamu Nakamoto ,  Hisashi Shimizu ,  Katsumi Ohkawa ,  Yasuhiro Koike ,  Koji Nagahama ,  Masao Kaneko ,  Masakazu Ueno ,  Yasuo Saitou

发明人： Akira Kazami ,  Osamu Nakamoto ,  Hisashi Shimizu ,  Katsumi Ohkawa ,  Yasuhiro Koike ,  Koji Nagahama ,  Masao Kaneko ,  Masakazu Ueno ,  Yasuo Saitou

IPC分类号： H01L21/00 ,  H01L25/16 ,  H05K1/14 ,  H05K1/18

CPC分类号： H01L21/67126 ,  H01L21/67121 ,  H01L25/162 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/09701 ,  H01L2924/3025 ,  H05K1/141 ,  H05K1/18

摘要： In a position closest to the mounting position of a microcomputer in a casing of a hybrid integrated circuit device on which is mounted the microcomputer and its peripheral circuit elements, an insertion hole is formed for a non-volatile memory which feeds data to the microcomputer. A socket for connecting the non-volatile memory is provided at the bottom of this insertion hole. Because of this configuration it is possible to connect the microcomputer and the non-volatile memory at an extremely short distance and the mounting efficiency of the integrated circuit device is increased. In addition, the non-volatile memory can detachably be mounted. Furthermore, the external shape of the insertion hole for the non-volatile memory is essentially the same as the external shape of the non-volatile memory so that when the non-volatile memory is inserted, the entire surface of this hybrid integrated circuit device is almost flat, providing excellent handling characteristics.

公开(公告)号：US5285107A

公开(公告)日：1994-02-08

申请号：US510467

申请日：1990-04-18

申请人： Akira Kazami ,  Osamu Nakamoto ,  Hisashi Shimizu ,  Katsumi Ohkawa ,  Yasuhiro Koike ,  Koji Nagahama ,  Masao Kaneko ,  Masakazu Ueno ,  Yasuo Saitou

发明人： Akira Kazami ,  Osamu Nakamoto ,  Hisashi Shimizu ,  Katsumi Ohkawa ,  Yasuhiro Koike ,  Koji Nagahama ,  Masao Kaneko ,  Masakazu Ueno ,  Yasuo Saitou

IPC分类号： H01L21/00 ,  H01L25/16 ,  H05K1/14 ,  H05K1/18 ,  H01L23/02 ,  H01L23/12

CPC分类号： H01L21/67126 ,  H01L21/67121 ,  H01L25/162 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/01014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/3025 ,  H05K1/141 ,  H05K1/189

摘要： A hybrid integrated circuit device is provided with: a microcomputer, a plurality of peripheral circuit elements, and a non-volatile memory which is positioned adjacent to the microcomputer, all of which are interconnected by a plurality of specified conductive paths; pair of integrated circuit substrates on which is formed the conductive paths and a casing provided with the pair of integrated circuit substrates secured to the upper and lower surfaces of the casing, forming a sealed space between these surfaces. The microcomputer and the peripheral circuit elements are positioned in the sealed space and only the non-volatile memory is positioned in an exposed space. The hybrid integrated circuit device of the present invention has a compact and simple form with a high degree of mounting density as well as superior handling capabilities and reliability.

摘要翻译： 混合集成电路装置具有：微型计算机，多个外围电路元件和位于微型计算机附近的非易失性存储器，所有这些都通过多个指定的导电路径相互连接; 一对集成电路基板，其上形成有导电路径，并且壳体设置有固定到壳体的上表面和下表面的一对集成电路基板，在这些表面之间形成密封空间。 微型计算机和外围电路元件位于密封空间中，只有非易失性存储器位于暴露的空间中。 本发明的混合集成电路器件具有紧凑且简单的形式，具有高度的安装密度以及优异的处理能力和可靠性。

公开(公告)号：US5321299A

公开(公告)日：1994-06-14

申请号：US951348

申请日：1992-09-25

申请人： Katsumi Ohkawa ,  Hisashi Shimizu ,  Hirofumi Kikuchi

发明人： Katsumi Ohkawa ,  Hisashi Shimizu ,  Hirofumi Kikuchi

IPC分类号： H01L25/16 ,  H02M1/00 ,  H02M1/12 ,  H02M1/42 ,  H02M3/158 ,  H05K1/02 ,  H05K9/00 ,  H01L23/02

CPC分类号： H02M1/4225 ,  H01L25/16 ,  H02M1/12 ,  H02M3/158 ,  H05K1/0218 ,  H05K9/0039 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3025 ,  Y02B70/126

摘要： Disclosed is a hybrid integrated circuit device provided with an active filter. The active filter is constructed mainly from a rectifier circuit, a reactor with one terminal connected with an output terminal of the rectifier, a switching element connected with one terminal of the reactor and a smoothing condenser connected with the other terminal of the reactor. The active filter is mounted on an insulating metal substrate and has, other than the above feature, a specific circuit structure wherein the substrate is divided by a ground pattern or power supply pattern into two blocks. One block is for a large current circuit such as the rectifier circuit, the switching element, and a diode and another block for a small signal circuit such as a control circuit. The hybrid integrated circuit device is of remarkably compact size. Also, it is greatly superior in a noise performance because switching noise does not flow into the chassis of electronic equipment from the metal substrate and the control circuit is shielded from the noise produced by the large current circuit, and also because the noise caused by wiring inductance can be limited.

摘要翻译： 公开了一种具有有源滤波器的混合集成电路装置。 有源滤波器主要由整流电路，一端与整流器的输出端连接的电抗器，与电抗器的一端连接的开关元件和与电抗器的另一端连接的平滑电容器构成。 有源滤波器安装在绝缘金属基板上，并且除了上述特征之外，具有特定的电路结构，其中基板被接地图案或电源图案划分成两个块。 一个块用于诸如整流器电路，开关元件和二极管之类的大电流电路，以及用于诸如控制电路的小信号电路的另一块。 混合集成电路器件尺寸非常紧凑。 此外，由于开关噪声不从金属基板流入电子设备的底盘，并且控制电路被大电流电路产生的噪声屏蔽，并且还因为布线引起的噪声，噪声性能非常优越 电感可以受到限制。

公开(公告)号：US5559374A

公开(公告)日：1996-09-24

申请号：US218604

申请日：1994-03-25

申请人： Susumu Ohta ,  Katsumi Ohkawa ,  Noriaki Sakamoto

发明人： Susumu Ohta ,  Katsumi Ohkawa ,  Noriaki Sakamoto

IPC分类号： H01L23/13 ,  H01L25/07 ,  H01L23/48 ,  H01L23/34

CPC分类号： H01L24/49 ,  H01L23/13 ,  H01L25/072 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/30107

摘要： A hybrid integrated circuit includes a plurality of metal plates supporting circuit elements and connectable directly to external power/output lines. The direct connection eliminates the need for solder terminals, allowing for reduced size and cost with increased reliability and lifespan. The metal plates can be position to allow for further minimization of the device, and uniform connection of internal wiring to the circuit elements.

摘要翻译： 混合集成电路包括支持电路元件并可直接连接到外部电源/输出线的多个金属板。 直接连接消除了对焊接端子的需要，从而减小了尺寸和成本，同时提高了可靠性和寿命。 金属板可以是位置，以允许进一步最小化装置，以及内部布线与电路元件的均匀连接。