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公开(公告)号：US5285107A
公开(公告)日：1994-02-08
申请号：US510467
申请日：1990-04-18
申请人： Akira Kazami , Osamu Nakamoto , Hisashi Shimizu , Katsumi Ohkawa , Yasuhiro Koike , Koji Nagahama , Masao Kaneko , Masakazu Ueno , Yasuo Saitou
发明人： Akira Kazami , Osamu Nakamoto , Hisashi Shimizu , Katsumi Ohkawa , Yasuhiro Koike , Koji Nagahama , Masao Kaneko , Masakazu Ueno , Yasuo Saitou
CPC分类号： H01L21/67126 , H01L21/67121 , H01L25/162 , H01L2224/45124 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2924/01014 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/3025 , H05K1/141 , H05K1/189
摘要： A hybrid integrated circuit device is provided with: a microcomputer, a plurality of peripheral circuit elements, and a non-volatile memory which is positioned adjacent to the microcomputer, all of which are interconnected by a plurality of specified conductive paths; pair of integrated circuit substrates on which is formed the conductive paths and a casing provided with the pair of integrated circuit substrates secured to the upper and lower surfaces of the casing, forming a sealed space between these surfaces. The microcomputer and the peripheral circuit elements are positioned in the sealed space and only the non-volatile memory is positioned in an exposed space. The hybrid integrated circuit device of the present invention has a compact and simple form with a high degree of mounting density as well as superior handling capabilities and reliability.
摘要翻译： 混合集成电路装置具有：微型计算机，多个外围电路元件和位于微型计算机附近的非易失性存储器，所有这些都通过多个指定的导电路径相互连接; 一对集成电路基板，其上形成有导电路径，并且壳体设置有固定到壳体的上表面和下表面的一对集成电路基板，在这些表面之间形成密封空间。 微型计算机和外围电路元件位于密封空间中，只有非易失性存储器位于暴露的空间中。 本发明的混合集成电路器件具有紧凑且简单的形式，具有高度的安装密度以及优异的处理能力和可靠性。
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公开(公告)号：US5159433A
公开(公告)日：1992-10-27
申请号：US510468
申请日：1990-04-18
申请人： Akira Kazami , Osamu Nakamoto , Hisashi Shimizu , Katsumi Ohkawa , Yasuhiro Koike , Koji Nagahama , Masao Kaneko , Masakazu Ueno , Yasuo Saitou
发明人： Akira Kazami , Osamu Nakamoto , Hisashi Shimizu , Katsumi Ohkawa , Yasuhiro Koike , Koji Nagahama , Masao Kaneko , Masakazu Ueno , Yasuo Saitou
CPC分类号： H01L21/67126 , H01L21/67121 , H01L25/162 , H01L2224/45124 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2924/09701 , H01L2924/3025 , H05K1/141 , H05K1/18
摘要： In a position closest to the mounting position of a microcomputer in a casing of a hybrid integrated circuit device on which is mounted the microcomputer and its peripheral circuit elements, an insertion hole is formed for a non-volatile memory which feeds data to the microcomputer. A socket for connecting the non-volatile memory is provided at the bottom of this insertion hole. Because of this configuration it is possible to connect the microcomputer and the non-volatile memory at an extremely short distance and the mounting efficiency of the integrated circuit device is increased. In addition, the non-volatile memory can detachably be mounted. Furthermore, the external shape of the insertion hole for the non-volatile memory is essentially the same as the external shape of the non-volatile memory so that when the non-volatile memory is inserted, the entire surface of this hybrid integrated circuit device is almost flat, providing excellent handling characteristics.
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