发明授权
- 专利标题: Method of producing copper-clad laminated board
- 专利标题(中): 生产覆铜层压板的方法
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申请号: US877833申请日: 1992-05-01
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公开(公告)号: US5286330A公开(公告)日: 1994-02-15
- 发明人: Keiji Azuma , Kimikazu Katoh , Ryoichi Oguro
- 申请人: Keiji Azuma , Kimikazu Katoh , Ryoichi Oguro
- 申请人地址: JPX Tokyo JPX Tokyo
- 专利权人: Sumitomo Bakelite Company Limited,Circuit Foil Japan Co., Ltd.
- 当前专利权人: Sumitomo Bakelite Company Limited,Circuit Foil Japan Co., Ltd.
- 当前专利权人地址: JPX Tokyo JPX Tokyo
- 优先权: JPX3-201525 19910513
- 主分类号: B29C43/18
- IPC分类号: B29C43/18 ; B29C33/68 ; B29C43/20 ; B29C43/32 ; B29K105/08 ; B29L9/00 ; B29L31/34 ; B32B15/08 ; H05K1/03 ; H05K3/02 ; B65C9/25
摘要:
A method for preparing a copper-clad laminated board for a printed circuit board which comprises: (a) preparing a prepreg by permeating a thermosetting resin into a fabric and then drying the resulting material to a half-hardened state, (b) laminating a both-side roughened copper foil on both sides or one side of the prepreg or a plurality of prepregs bonded together, (c) placing the resulting laminate from step (b) between both press plates of a press machine, (d) placing a polyamide film having a melting point equal to or higher than 170.degree. C. between the exposed side of the both-side roughened copper foil of the laminate and a press plate, (e) pressing the laminate with the press plates of the press machine at a temperature of 170.degree. C. or higher, a pressure of 10 kgf/cm.sup.2 or higher for a time of 60 minutes or longer, (f) separating the laminate from the press machine and (g) peeling the polyamide film from the laminate to obtain the copper-clad laminated board. The copper-clad laminated board can be used for a printed circuit board.
公开/授权文献
- US5966689A Adaptive filter and filtering method for low bit rate coding 公开/授权日:1999-10-12