公开(公告)号：US5286330A

公开(公告)日：1994-02-15

申请号：US877833

申请日：1992-05-01

申请人： Keiji Azuma ,  Kimikazu Katoh ,  Ryoichi Oguro

发明人： Keiji Azuma ,  Kimikazu Katoh ,  Ryoichi Oguro

IPC分类号： B29C43/18 ,  B29C33/68 ,  B29C43/20 ,  B29C43/32 ,  B29K105/08 ,  B29L9/00 ,  B29L31/34 ,  B32B15/08 ,  H05K1/03 ,  H05K3/02 ,  B65C9/25

CPC分类号： B29C33/68 ,  B32B37/26 ,  H05K3/022 ,  B29L2031/3425 ,  H05K1/0366 ,  H05K2203/068 ,  Y10T29/49124

摘要： A method for preparing a copper-clad laminated board for a printed circuit board which comprises: (a) preparing a prepreg by permeating a thermosetting resin into a fabric and then drying the resulting material to a half-hardened state, (b) laminating a both-side roughened copper foil on both sides or one side of the prepreg or a plurality of prepregs bonded together, (c) placing the resulting laminate from step (b) between both press plates of a press machine, (d) placing a polyamide film having a melting point equal to or higher than 170.degree. C. between the exposed side of the both-side roughened copper foil of the laminate and a press plate, (e) pressing the laminate with the press plates of the press machine at a temperature of 170.degree. C. or higher, a pressure of 10 kgf/cm.sup.2 or higher for a time of 60 minutes or longer, (f) separating the laminate from the press machine and (g) peeling the polyamide film from the laminate to obtain the copper-clad laminated board. The copper-clad laminated board can be used for a printed circuit board.

摘要翻译： 一种制备用于印刷电路板的覆铜层压板的方法，包括：（a）通过将热固性树脂渗透到织物中然后将所得材料干燥至半硬化状态来制备预浸料，（b）将 （c）将来自步骤（b）的所得层压体放置在压制机的两个压板之间，（d）放置聚酰胺（b），将聚酰胺 在层叠体的两面粗糙化铜箔的露出侧和压板之间具有等于或高于170℃的熔点的膜，（e）在压机的压板上压制层压体 温度为170℃以上，压力为10kgf / cm 2以上，时间为60分钟以上，（f）从压制机中分离层压体，（g）从层叠体剥离聚酰胺膜，得到 覆铜层压板。 覆铜层压板可用于印刷电路板。

公开(公告)号：US5320919A

公开(公告)日：1994-06-14

申请号：US706053

申请日：1991-05-28

申请人： Keiji Azuma ,  Kimikazu Katoh ,  Ryoichi Oguro ,  Takashi Inada

发明人： Keiji Azuma ,  Kimikazu Katoh ,  Ryoichi Oguro ,  Takashi Inada

IPC分类号： H05K3/38 ,  H05K3/46 ,  B22F7/04

CPC分类号： H05K3/384 ,  H05K2201/0355 ,  H05K2203/0307 ,  H05K2203/0723 ,  H05K3/4611 ,  Y10T428/12014 ,  Y10T428/12049 ,  Y10T428/12056 ,  Y10T428/12063 ,  Y10T428/12431 ,  Y10T428/12438 ,  Y10T428/12715 ,  Y10T428/12792 ,  Y10T428/12847 ,  Y10T428/12861 ,  Y10T428/12903 ,  Y10T428/1291 ,  Y10T428/12931

摘要： A copper foil for an inner layer circuit of a multi-layered printed circuit board, which comprises a black metal plated layer formed on at least the rough surface which becomes a surface of an inner layer circuit of a copper foil having both sides roughened in advance, in order to enhance the bonding strength to a prepreg, make it safe from haloing and facilitate optical checking of the copper foil.

摘要翻译： 一种用于多层印刷电路板的内层电路的铜箔，其包括至少形成在粗糙表面上的黑色金属镀层，该粗糙表面成为预先具有粗糙化的铜箔的内层电路的表面的表面 为了提高对预浸料坯的接合强度，可以防止卤素的安全，便于铜箔的光学检查。

公开(公告)号：US5413838A

公开(公告)日：1995-05-09

申请号：US111018

申请日：1993-08-24

申请人： Keiji Azuma ,  Kimikazu Katoh ,  Ryoichi Oguro

发明人： Keiji Azuma ,  Kimikazu Katoh ,  Ryoichi Oguro

IPC分类号： H05K3/02 ,  H05K3/38 ,  H05K3/46 ,  B32B23/02 ,  B32B3/00 ,  B32B15/08

CPC分类号： H05K3/022 ,  H05K2201/0355 ,  H05K3/025 ,  H05K3/382 ,  H05K3/4611 ,  Y10S428/901 ,  Y10T428/12569 ,  Y10T428/12736 ,  Y10T428/1275 ,  Y10T428/24793 ,  Y10T428/24917 ,  Y10T428/24967 ,  Y10T428/31515 ,  Y10T428/31522 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31699 ,  Y10T428/31739 ,  Y10T428/31743

摘要： Disclosed is a both-side roughened copper foil with a protection film, comprising a metal foil as soft as or softer than copper, or an organic type film having a melting point equal to or higher than a lamination temperature, laminated on one side of a copper foil with both sides roughened, the metal foil or organic film being continuously or continually bonded or adhered to the copper foil. It is possible to protect the ruggedness on the roughened surface at the time the both-side roughened copper foil is cut, packed, transported or stacked on another both-side roughened copper foil, simplify the press molding work, and improve the production efficiency particularly in the step of fabricating a copper-clad laminated board for a printed circuit board as well as the quality of the acquired copper-clad laminated board.

摘要翻译： 公开了一种具有保护膜的双面粗糙化铜箔，其包含比铜柔软或比软的金属箔，或层压在层压温度的一侧上的熔点等于或高于层压温度的有机型膜 铜箔两面粗糙，金属箔或有机膜连续或连续地粘合或粘附在铜箔上。 在双面粗糙的铜箔被切割，包装，运输或堆放在另一个双面粗糙的铜箔上时，可以保护粗糙表面上的粗糙度，简化压模成型工作，特别是提高生产效率 在制造用于印刷电路板的覆铜层压板以及所获得的覆铜层压板的质量的步骤中。