The present invention relates to an IC socket to be used for testing various IC packages, an object of which is to provide the IC socket with means facilitating insertion and removal of IC packages either in testing by employing an automatic loader or in testing with manual operation. It is constructed to have a socket body formed with a plurality of contacts for establishing electric contact with leads of an IC package, a cover 2 for removably fitting the IC package on the socket body, latches 4 having hooks 42 arranged at least at two diagonally opposing corners of said cover 2, and hooking to said socket body 1, and projections extending in the same direction to the hooks 42, releasing blocks 5 arranged in the vicinity of said latches and movable in the vertical direction with respect to said projection 43, and catching portions 11 formed in said socket body 1 and to be hooked the hook 42 of said latch 4.