发明授权
US5312878A Naphthalene containing epoxy resin cured with a dicyclopentadiene
phenolic resin
失效
用二环戊二烯酚醛树脂固化的含萘环氧树脂
- 专利标题： Naphthalene containing epoxy resin cured with a dicyclopentadiene phenolic resin
- 专利标题（中）： 用二环戊二烯酚醛树脂固化的含萘环氧树脂
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申请号： US955613申请日： 1992-10-01
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公开(公告)号： US5312878A公开(公告)日： 1994-05-17
- 发明人: Toshio Shiobara , Kazutoshi Tomiyoshi , Takayuki Aoki , Hatsuji Shiraishi
- 申请人： Toshio Shiobara , Kazutoshi Tomiyoshi , Takayuki Aoki , Hatsuji Shiraishi
- 申请人地址： JPX Tokyo
- 专利权人： Shin-Etsu Chemical Company, Limited
- 当前专利权人： Shin-Etsu Chemical Company, Limited
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX3-286993 19911007
- 主分类号： C08G59/20
- IPC分类号： C08G59/20 ; C08G59/00 ; C08G59/32 ; C08G59/62 ; C08L63/00 ; H01B3/40 ; H01L23/29 ; H01L23/31 ; C08F283/00
摘要：
A thermosetting resin composition comprising (A) a naphthalene ring-bearing epoxy resin, (B) a dicyclopentadiene-modified phenolic resin, and (C) an inorganic filler is suitable for encapsulating semiconductor devices since the composition cures into a product having a low coefficient of expansion, good adhesion and low moisture absorption.