- 专利标题： Applying conductive lines to integrated circuits
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申请号： US68037申请日： 1993-05-28
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公开(公告)号： US5321886A公开(公告)日： 1994-06-21
- 发明人: Pedro A. Chalco , Matthew F. Cali , Laertis Economikos , James L. Speidell
- 申请人： Pedro A. Chalco , Matthew F. Cali , Laertis Economikos , James L. Speidell
- 申请人地址： NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： NY Armonk
- 主分类号： H01L23/12
- IPC分类号： H01L23/12 ; G02F1/13 ; H01L21/768 ; H05K3/00 ; H05K3/02 ; H05K3/20 ; H05K3/22 ; H05K3/28 ; H05K3/46
摘要：
A conductive line is applied to a substrate by aligning the conductive line in juxtaposition with a selected area of the substrate; bonding the conductive line to the substrate; and detaching the conductive line from a carrier in which the conductive line is suspended. The carrier has a carrier opening defined by sidewalls, and conductive material is suspended by the sidewalls of the carrier opening so as to be embedded within the carrier opening, and form the conductive line.
公开/授权文献
- USD396007S Nozzle 公开/授权日：1998-07-14
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