-
公开(公告)号：US5310967A
公开(公告)日：1994-05-10
申请号：US68036
申请日：1993-05-28
IPC分类号： H01L23/12 , G02F1/13 , H01L21/768 , H05K3/00 , H05K3/02 , H05K3/20 , H05K3/22 , H05K3/28 , H05K3/46 , H05K1/00
CPC分类号： H05K3/225 , H01L21/76886 , G02F1/1309 , H05K2201/0394 , H05K2201/1028 , H05K2203/0769 , H05K2203/107 , H05K2203/173 , H05K3/0017 , H05K3/027 , H05K3/20 , H05K3/28 , Y10T29/49124 , Y10T29/49155 , Y10T29/49742
摘要： A conductive line is applied to a substrate by aligning the conductive line in juxtaposition with a selected area of the substrate; bonding the conductive line to the substrate; and detaching the conductive line from a carrier in which the conductive line is suspended. The carrier has a carrier opening defined by sidewalls, and conductive material is suspended by the sidewalls of the carrier opening so as to be embedded within the carrier opening, and form the conductive line.
-
公开(公告)号：US5289632A
公开(公告)日：1994-03-01
申请号：US981458
申请日：1992-11-25
IPC分类号： H01L23/12 , G02F1/13 , H01L21/768 , H05K3/00 , H05K3/02 , H05K3/20 , H05K3/22 , H05K3/28 , H05K3/46
CPC分类号： H05K3/225 , H01L21/76886 , G02F1/1309 , H05K2201/0394 , H05K2201/1028 , H05K2203/0769 , H05K2203/107 , H05K2203/173 , H05K3/0017 , H05K3/027 , H05K3/20 , H05K3/28 , Y10T29/49124 , Y10T29/49155 , Y10T29/49742
摘要： A conductive line is applied to a substrate by aligning the conductive line in juxtaposition with a selected area of the substrate; bonding the conductive line to the substrate; and detaching the conductive line from a carrier in which the conductive line is suspended. The carrier has a carrier opening defined by sidewalls, and conductive material is suspended by the sidewalls of the carrier opening so as to be embedded within the carrier opening, and form the conductive line.
摘要翻译： 通过将导线与衬底的选定区域并置定位来将导线施加到衬底; 将导线接合到基板上; 以及将导线从其中悬挂有导线的载体分离。 载体具有由侧壁限定的载体开口，并且导电材料被载体开口的侧壁悬挂以嵌入载体开口中，并形成导电线。
-
公开(公告)号：US5321886A
公开(公告)日：1994-06-21
申请号：US68037
申请日：1993-05-28
IPC分类号： H01L23/12 , G02F1/13 , H01L21/768 , H05K3/00 , H05K3/02 , H05K3/20 , H05K3/22 , H05K3/28 , H05K3/46
CPC分类号： H05K3/225 , H01L21/76886 , G02F1/1309 , H05K2201/0394 , H05K2201/1028 , H05K2203/0769 , H05K2203/107 , H05K2203/173 , H05K3/0017 , H05K3/027 , H05K3/20 , H05K3/28 , Y10T29/49124 , Y10T29/49155 , Y10T29/49742
摘要： A conductive line is applied to a substrate by aligning the conductive line in juxtaposition with a selected area of the substrate; bonding the conductive line to the substrate; and detaching the conductive line from a carrier in which the conductive line is suspended. The carrier has a carrier opening defined by sidewalls, and conductive material is suspended by the sidewalls of the carrier opening so as to be embedded within the carrier opening, and form the conductive line.
-
4.发明授权Temperature sensing device for dynamically measuring temperature fluctuation in a tip of a bonding device 失效用于动态测量接合装置的尖端中的温度波动的温度感测装置
公开(公告)号：US5281025A
公开(公告)日：1994-01-25
申请号：US4365
申请日：1993-01-14
申请人： Matthew F. Cali , Pedro A. Chalco
发明人： Matthew F. Cali , Pedro A. Chalco
CPC分类号： B23K3/0478 , G01K7/021 , G01K7/023
摘要： A temperature sensing device for accurately measuring the temperature of a microbonding device tip. The temperature sensing device consists of an array of thin-film thermocouples produced by thin-film patterning techniques on a substrate card. Each thermocouple is composed of two circuit lines of dissimilar metals A & B. The dissimilar metals are superimposed at a junction point. A third metal C is deposited between the metals A and B to prevent premature degradation of the thermocouple junction. A common line is used for one of the two metals connecting to the junctions. This allows almost twice as many thermocouples than conventional layout techniques.
摘要翻译： 一种温度感测装置，用于精确测量微型结合装置尖端的温度。 温度感测装置由在衬底卡上通过薄膜图案化技术制成的薄膜热电偶阵列组成。 每个热电偶由不同金属A和B的两条电路线组成。不同金属在接合点处叠加。 第三金属C沉积在金属A和B之间，以防止热电偶结的过早劣化。 连接到接头的两个金属中的一个使用公共线。 这比传统的布局技术几乎是热电偶的两倍。
-
公开(公告)号：US06697037B1
公开(公告)日：2004-02-24
申请号：US08639583
申请日：1996-04-29
申请人： Paul Matthew Alt , Pedro A. Chalco , Bruce Kenneth Furman , Raymond Robert Horton , Chandrasekhar Narayan , Benal Lee Owens, Jr. , Kevin Wilson Warren , Steven Lorenz Wright
发明人： Paul Matthew Alt , Pedro A. Chalco , Bruce Kenneth Furman , Raymond Robert Horton , Chandrasekhar Narayan , Benal Lee Owens, Jr. , Kevin Wilson Warren , Steven Lorenz Wright
IPC分类号： G09G336
CPC分类号： G02F1/1309 , G02F2001/136272 , G09G3/3611 , G09G3/3685 , G09G2300/0426 , G09G2310/0297 , G09G2330/08 , G11C29/76 , Y10S345/904
摘要： A matrix addressed display system designed so as to enable data line repair by electronic mechanisms which is efficient and low in cost and thus increases yield. Such active data line repair utilizes additional data driver outputs, a defect map memory in the TFT/LCD module and modification of the data stream to the data drivers by additional circuits between the display and the display adapter. A bus configuration on the display substrate is utilized which combines repair flexibility, low parasitic capacitance, and the ability to easily make the necessary interconnections. The number of interconnections is kept to a minimum, the connections are reliable, and the connections may be made with conventional wire bond or laser bond technology, or disk bond technology.
摘要翻译： 矩阵寻址显示系统设计，以便通过电子机制进行数据线修复，这是有效率和低成本的，从而提高产量。 这种有源数据线修复利用附加数据驱动器输出，TFT / LCD模块中的缺陷图存储器，以及通过显示器和显示适配器之间的附加电路将数据流修改为数据驱动器。 使用显示基板上的总线配置，其结合了修复灵活性，低寄生电容和容易进行必要互连的能力。 互连的数量保持最小，连接是可靠的，并且可以用传统的引线键合或激光键合技术或磁盘接合技术来进行连接。
-
6.发明授权Diffusion bonding of lead interconnections using precise laser-thermosonic energy 失效使用精确的激光热循环能量进行引线互连的扩散接合
公开(公告)号：US5948286A
公开(公告)日：1999-09-07
申请号：US796767
申请日：1997-02-06
CPC分类号： H05K3/328 , B23K26/06 , H01L21/4853 , H05K2201/10681 , H05K2203/0285 , H05K2203/107
摘要： Thin film diffusion bonding of lead assemblies under severly limited spacing, thermal and pressure conditions is achieved through application of precisely controlled energy at the bond interface. The precisely controlled energy is a laser thermosonic energy pulse, delivered through a cleaved optical fiber end and closed end tip, that produces a heat increment in excess of the steady state manufacturing design temperature for the assembly and which is applied directly at the bond interface.
摘要翻译： 通过在接合界面应用精确控制的能量，可以实现极限间隔，热和压力条件下引线组件的薄膜扩散接合。 精确控制的能量是通过裂开的光纤端和封闭端尖端传送的激光热能量脉冲，其产生超过组件的稳态制造设计温度的热增量，并且直接应用于接合界面处。
-
公开(公告)号：US5826328A
公开(公告)日：1998-10-27
申请号：US621385
申请日：1996-03-25
IPC分类号： H01L21/50 , G06K19/077 , H01L23/31 , H01L23/495 , H04B1/59 , H01R43/00
CPC分类号： G06K19/07749 , H01L23/3107 , H01L23/49541 , H01L2924/0002 , H01L2924/3011 , Y10T29/49016 , Y10T29/49018 , Y10T29/49121
摘要： Manufacturing of a novel thin and flexible radio frequency (RF) tag with a stamped metal leadframe antenna is disclosed. The tag is made by transporting a leadframe strip having leadframe antenna "cutouts" to a point where a chip is mechanically and electrically attached directly to the leadframe antenna. A battery can be attached to the chip in the process. Processes to cut support bars holding the leadframe antenna to the leadframe strip, seal the package (by lamination or molding), and to excise the sealed component are performed in various orders to produce a final product. Intermediate support (positioners) for the thin leadframe are optionally provided add structural support to the antenna while the sealed component is made. A protective surround can be added to cover the package and to provide further structural support for the package while still permitting the sealed component to be thin and flexible.
摘要翻译： 公开了一种具有冲压金属引线框架天线的新型薄而灵活的射频（RF）标签的制造。 标签通过将具有引线框天线“切口”的引线框条传送到芯片直接机械地和电连接到引线框架天线的点。 在此过程中可以将电池连接到芯片。 将保持引线框架天线的支撑杆切割到引线框条，密封封装（通过层压或模制）和切割密封部件的工艺以各种顺序执行以产生最终产品。 在制造密封部件的过程中，可选地为薄型引线框架提供中间支撑（定位器），为天线增加结构支撑。 可以添加保护性环绕以覆盖包装并且为包装提供进一步的结构支撑，同时仍允许密封部件变薄和柔性。
-
8.发明授权Method and apparatus for soldering with a multiple tip and associated optical fiber heating device 失效用多焊头和相关光纤加热装置焊接的方法和装置
公开(公告)号：US5565119A
公开(公告)日：1996-10-15
申请号：US431245
申请日：1995-04-28
申请人： John R. Behun , Pedro A. Chalco , Joseph Funari , J. Robert Young
发明人： John R. Behun , Pedro A. Chalco , Joseph Funari , J. Robert Young
CPC分类号： B29C65/18 , B23K1/0056 , B23K26/06 , B23K26/064 , B29C65/245 , B29C65/606 , B29C66/43 , B29C66/7424 , B29C66/80 , B29C66/8322 , B23K2201/40 , B29C2791/009 , B29C65/1612 , B29C65/1687 , B29C66/843 , H05K3/3478 , H05K3/3494
摘要： A laser head for simultaneously attaching solder balls to a carrier has at least one solder tip, with the number of solder tips being equal to the number of solder balls to be attached to the carrier. Each solder tip is heated by an optical fiber in thermal contact with the tip at one end of the fiber and coupled to a laser, preferably operating in the infrared wavelength range, at the other end of the fiber via a multiplexer coupling device. A spring is used in association with each solder tip to bias each solder tip to hold the carrier in contact with the solder balls. The tip absorbs the radiant energy as it exits the optical fiber, and the tip is heated. The laser and multiplexer permit precise control over the heat imparted to the tip, which in turn permits control of the amount of the solder ball that is reflowed.
摘要翻译： 用于将焊球同时附着到载体上的激光头具有至少一个焊嘴，其中焊锡头的数量等于要附着到载体的焊球的数量。 每个焊嘴通过光纤加热，该光纤与光纤的一端处的尖端热接触，并且经由多路复用器耦合器件耦合到光纤的另一端处优选在红外波长范围内工作的激光器。 与每个焊嘴相关联地使用弹簧以偏置每个焊嘴以保持载体与焊球接触。 尖端在离开光纤时吸收辐射能，并且尖端被加热。 激光器和多路复用器允许精确地控制施加到尖端的热量，这又允许控制回流焊球的量。
-
9.发明授权Semiconductor chip packaging method which heat cures an encapsulant deposited on a chip using a laser beam to heat the back side of the chip 失效使用激光束加热沉积在芯片上的密封剂来加热芯片的背面的半导体芯片封装方法
公开(公告)号：US5457299A
公开(公告)日：1995-10-10
申请号：US144948
申请日：1993-10-29
申请人： Claude Blais , Pedro A. Chalco
发明人： Claude Blais , Pedro A. Chalco
CPC分类号： H01L21/56 , B29C35/08 , B29C70/78 , B29C2035/0838 , B29C33/06 , B29L2031/3406 , H01L2924/0002
摘要： A method for encapsulating a semiconductor chip. The method includes the steps of first positioning a chip over a laser-curing cavity, and then dispensing a predetermined amount of encapsulant over the chip. Sequential steps include synchronizing a firing of a laser pulse immediately after the dispensing step, and curing the encapsulant by conducting heat generated by the laser pulse, through the chip.
摘要翻译： 一种封装半导体芯片的方法。 该方法包括以下步骤：首先将芯片定位在激光固化腔上，然后在芯片上分配预定量的密封剂。 顺序步骤包括在分配步骤之后立即同步激光脉冲的点火，以及通过通过芯片传导由激光脉冲产生的热量来固化密封剂。
-
10.发明授权
公开(公告)号：US5298715A
公开(公告)日：1994-03-29
申请号：US874666
申请日：1992-04-27
CPC分类号： B29C66/69 , B23K1/0056 , B23K20/10 , B23K26/06 , B23K26/0604 , B29C65/08 , H05K3/341 , H05K3/3494
摘要： A combination of laser energy and ultrasonic energy is used for soldering an insulated wire to a pad located on a substrate. The combined laser energy and ultrasonic energy strips the insulation from the wire and solders the resulting bare wire to the pad. The method has particular use for soldering insulated wire to pads located on heat sensitive substrates or to pads located in close proximity to heat sensitive devices. A principal application is for soldering fine insulated wires for connecting a thin film magnetic head to a circuit carrier substrate.
摘要翻译： 使用激光能量和超声波能量的组合来将绝缘电线焊接到位于基板上的焊盘。 组合的激光能量和超声波能量从电线剥离绝缘体，并将所得裸线焊接到焊盘。 该方法特别用于将绝缘导线焊接到位于热敏基板上的焊盘或靠近热敏器件的焊盘。 主要应用是用于焊接用于将薄膜磁头连接到电路载体衬底的细绝缘电线。
-
-
-
-
-
-
-
-
-
搜索结果
15 条记录 (耗时 0.021 秒)
