发明授权
- 专利标题： Mounting substrate
- 专利标题（中）： 安装基板
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申请号： US659672申请日： 1991-02-25
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公开(公告)号： US5350886A公开(公告)日： 1994-09-27
- 发明人: Kunio Miyazaki , Yutaka Sugita , Akio Mukoh , Tadahiko Miyoshi , Osamu Miura , Akio Takahashi , Shunichi Numata , Satoru Ogihara , Kazuji Yamada , Hirokazu Inoue , Fumiyuki Kobayashi
- 申请人： Kunio Miyazaki , Yutaka Sugita , Akio Mukoh , Tadahiko Miyoshi , Osamu Miura , Akio Takahashi , Shunichi Numata , Satoru Ogihara , Kazuji Yamada , Hirokazu Inoue , Fumiyuki Kobayashi
- 申请人地址： JPX Tokyo
- 专利权人： Hitachi, Ltd.
- 当前专利权人： Hitachi, Ltd.
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX2-042468 19900226
- 主分类号： H01L23/538
- IPC分类号： H01L23/538 ; H05K1/03 ; H05K3/46 ; H05K1/00
摘要：
An LSI mounting substrate having a multilayered thin film wiring portion, with the thin film wiring portion being divided into wiring units each composed of a plurality of wiring layers, with the wirings between the units being electrically connected through connecting pads defined in the same surface as that of a surface conductive layer of the unit.
公开/授权文献
- US6067350A Long distance telephone communication system and method 公开/授权日：2000-05-23
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