利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

204 条记录 (耗时 0.038 秒)

    Multi-layer wiring structure
    3.
    发明授权
    Multi-layer wiring structure 失效
    多层布线结构

    公开(公告)号：US5768108A

    公开(公告)日：1998-06-16

    申请号：US720028

    申请日：1996-09-27

    申请人： Osamu Miura ,  Kunio Miyazaki ,  Akio Takahashi ,  Motoyo Wajima ,  Ryuji Watanabe ,  Takao Miwa ,  Yuichi Satsu ,  Shigeo Amagi

    发明人： Osamu Miura ,  Kunio Miyazaki ,  Akio Takahashi ,  Motoyo Wajima ,  Ryuji Watanabe ,  Takao Miwa ,  Yuichi Satsu ,  Shigeo Amagi

    IPC分类号： H05K1/05 ,  H01L21/48 ,  H01L23/538 ,  H05K1/11 ,  H05K3/40 ,  H05K3/42 ,  H05K3/46 ,  H05K1/00 ,  H05K1/09 ,  H05K1/16

    CPC分类号： H01L21/4857 ,  H01L23/5385 ,  H05K3/4641 ,  H01L2224/16225 ,  H05K1/113 ,  H05K2201/068 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K3/4069 ,  H05K3/429 ,  H05K3/4623

    摘要： A multi-layer wiring structure for mounting electronic devices is provided to be used in an electronic computer, a work station or the like, and more particularly a multi-layer packaging board having microscopic wiring layers, which board has an excellent dimensional stability and a high reliability, and also a method of producing such a board are provided. The multi-layer wiring structure includes a complex of at least two sub-assemblies each having wiring layers formed respectively on opposite sides of a core material of a low thermal expansive metal through an insulation layer in such a manner that the wiring layers correspond in area ratio to each other. The sub-assemblies are connected to one another by conductors via through holes. In this structure, the wiring structure having the core material of a low thermal expansive metal is used as a base, and therefore a dimensional change of a board is small, and microscopic wiring layers can be formed, and the reliability of connection between the sub-assemblies is enhanced. Furthermore, the board can be produced at low costs.

    摘要翻译： 在电子计算机，工作站等中使用用于安装电子装置的多层布线结构，特别是具有微细布线层的多层封装板，该板具有优异的尺寸稳定性和 高可靠性，以及制造这种基板的方法。 多层布线结构包括至少两个子组件的复合体，每个子组件具有通过绝缘层分别形成在低热膨胀金属的芯材的相对侧上的布线层，使得布线层对应于区域 相互之间的比例。 子组件通过导体经由通孔彼此连接。 在这种结构中，将具有低热膨胀金属的芯材的布线结构用作基底，因此板的尺寸变化小，并且可以形成微细的布线层，并且子层之间的连接的可靠性 大会组合得到增强。 此外，该板可以低成本生产。

    Superconducting magnet coil and curable resin composition used therein
    9.
    发明授权
    Superconducting magnet coil and curable resin composition used therein 失效
    超导磁体线圈及其中使用的可固化树脂组合物

    公开(公告)号：US5384197A

    公开(公告)日：1995-01-24

    申请号：US171780

    申请日：1993-12-22

    申请人： Toru Koyama ,  Koo Honjo ,  Masao Suzuki ,  Akio Takahashi ,  Akio Mukoh ,  Keiji Fukushi ,  Seiji Numata

    发明人： Toru Koyama ,  Koo Honjo ,  Masao Suzuki ,  Akio Takahashi ,  Akio Mukoh ,  Keiji Fukushi ,  Seiji Numata

    IPC分类号： C08G59/18 ,  H01B3/30 ,  H01B3/40 ,  H01F6/00 ,  H01F6/06 ,  B32B9/00

    CPC分类号： H01F6/06 ,  Y10S428/93 ,  Y10S505/705 ,  Y10S505/813 ,  Y10S505/884 ,  Y10S505/887 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31721 ,  Y10T428/31725

    摘要： A superconducting magnet coil contains a coil of superconducting wire and a cured product of a curable resin composition with which the coil has been impregnated, the cured product having a thermal shrinkage factor of 1.5-0.3%, preferably 1.0-0.3%, when cooled from the glass transition temperature to 4.2K, a bend-breaking strain of 2.9-3.9%, preferably 3.2-3.9%, at 4.2K and a modulus of 500-1,000 kg/mm.sup.2 at 4.2K, or undergoing a thermal stress of 0-10 kg/mm.sup.2 when cooled from the glass transition temperature to 4.2K and resisting to quench during superconducting operation. It is produced by winding a superconducting wire to form a coil; impregnating the coil with a curable resin composition of low viscosity which contains for example at least one epoxy resin selected from the group consisting of diglycidyl ether of bisphenol A, diglycidyl ether of bisphenol F and diglycidyl ether of bisphenol AF, all having a number-average molecular weight of 350-1,000, a flexibilizer and a curing catalyst, to obtain a curable-resin composition-impregnated coil; and heating the curable-resin-composition-impregnated coil to cure the composition.

    摘要翻译： 超导磁体线圈包含超导线圈和固化树脂组合物的固化物，线圈已被浸渍，固化产物的热收缩率为1.5-0.3％，优选为1.0-0.3％，优选为1.0-0.3％，当从 玻璃化转变温度为4.2K，4.2K时的断裂应变为2.9-3.9％，优选为3.2-3.9％，4.2K时的弯曲应变为500-1,000 kg / mm2，或者经受0〜 从玻璃化转变温度冷却至4.2K，并在超导操作期间耐猝熄时为10kg / mm2。 通过缠绕超导线形成线圈产生; 用低粘度的可固化树脂组合物浸渍线圈，其包含例如至少一种选自双酚A的二缩水甘油醚，双酚F的二缩水甘油醚和双酚AF的二缩水甘油醚的环氧树脂，其全部具有数均分子量 分子量为350〜1,000，增韧剂和固化催化剂，得到固化树脂组合物浸渍线圈; 并加热固化树脂组合物浸渍的线圈以固化组合物。