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公开(公告)号：US07032762B2
公开(公告)日：2006-04-25
申请号：US10399787
申请日：2001-08-27
IPC分类号： E05D15/22
CPC分类号： A47B53/02
摘要： The invention provides a relatively simple and inexpensive power-assisted movable rack system, movement of which is controlled by an operator. The movable rack system comprises a plurality of movable racks, each of which includes a plurality of wheels, a DC motor turning forward or backward and reciprocating the movable rack, a pair of direction switches provided at opposite positions in moving directions of the movable rack, and an actuating circuit rotating the DC motor in one direction during the operation of one of the direction switches and rotating the DC motor in an opposite direction during the operation of the other direction switch. The DC motor applies dynamic braking force, so that movable racks can be stopped with a short braking distance.
摘要翻译： 本发明提供了一种相对简单和便宜的动力辅助可移动支架系统，其运动由操作者控制。 可动齿条系统包括多个可移动齿条，每个可移动齿条包括多个车轮，直流电动机向前或向后转动并使可移动齿条往复运动;一对方向开关，设置在可移动齿条移动方向上的相对位置， 以及在一个方向开关的操作期间使DC电动机沿一个方向旋转并且在另一方向开关的操作期间使DC电动机沿相反方向旋转的致动电路。 直流电机施加动态制动力，使得可以在短的制动距离内停止可动齿条。
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公开(公告)号：US20050184018A1
公开(公告)日：2005-08-25
申请号：US11117370
申请日：2005-04-29
CPC分类号： A47B53/02
摘要： The invention provides a relatively simple and inexpensive power-assisted movable rack system, movement of which is controlled by an operator. The movable rack system comprises a plurality of movable racks, each of which includes a plurality of wheels, a DC motor turning forward or backward and reciprocating the movable rack, a pair of direction switches provided at opposite positions in moving directions of the movable rack, and an actuating circuit rotating the DC motor in one direction during the operation of one of the direction switches and rotating the DC motor in an opposite direction during the operation of the other direction switch. The DC motor applies dynamic braking force, so that movable racks can be stopped with a short braking distance.
摘要翻译： 本发明提供了一种相对简单和便宜的动力辅助可移动支架系统，其运动由操作者控制。 可动齿条系统包括多个可移动齿条，每个可移动齿条包括多个车轮，直流电动机向前或向后转动并使可移动齿条往复运动;一对方向开关，设置在可移动齿条移动方向上的相对位置， 以及在一个方向开关的操作期间使DC电动机沿一个方向旋转并且在另一方向开关的操作期间使DC电动机沿相反方向旋转的致动电路。 直流电机施加动态制动力，使得可以在短的制动距离内停止可动齿条。
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公开(公告)号：US06591776B2
公开(公告)日：2003-07-15
申请号：US09987344
申请日：2001-11-14
申请人： Kunio Miyazaki
发明人： Kunio Miyazaki
IPC分类号： B63B124
摘要： A hydrofoil craft using a novel propulsive system able to greatly reduce wave making resistance at a sailing time is provided. Therefore, a semi-submergence type hydrofoil craft has a craft main body having a water surface craft body located above the water surface at the sailing time, an underwater craft body located below the water surface, and one or plural struts vertically connecting these craft bodies. The above underwater craft body has a water suction port opened to suck water from a front face of the underwater craft body, a propeller for sending-out the sucked water backward, at least one water injection port opened to inject the water sent-out from the propeller backward, at least one water sending passage extending from the rear of the propeller to the at least one water injection port, and at least one pair of wings projected from both side faces of the underwater craft body.
摘要翻译： 提供了一种使用能够在航行时间大大降低制波阻力的新型推进系统的水翼工艺。 因此，半潜式水翼艇具有在航行时刻位于水面以上的水面飞行体的船体主体，位于水面下方的水下工艺体，以及将这些飞行体垂直连接的一个或多个支柱 。 上述水下工艺体具有开口的吸水口，从水下工具体的前表面吸水，向后排出吸水的螺旋桨，至少一个打开的注水口，将从水 螺旋桨向后，至少一个从螺旋桨的后部延伸到至少一个注水口的送水通道，以及从水下工艺体的两侧面突出的至少一对翼。
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公开(公告)号：US5768108A
公开(公告)日：1998-06-16
申请号：US720028
申请日：1996-09-27
申请人： Osamu Miura , Kunio Miyazaki , Akio Takahashi , Motoyo Wajima , Ryuji Watanabe , Takao Miwa , Yuichi Satsu , Shigeo Amagi
发明人： Osamu Miura , Kunio Miyazaki , Akio Takahashi , Motoyo Wajima , Ryuji Watanabe , Takao Miwa , Yuichi Satsu , Shigeo Amagi
IPC分类号： H05K1/05 , H01L21/48 , H01L23/538 , H05K1/11 , H05K3/40 , H05K3/42 , H05K3/46 , H05K1/00 , H05K1/09 , H05K1/16
CPC分类号： H01L21/4857 , H01L23/5385 , H05K3/4641 , H01L2224/16225 , H05K1/113 , H05K2201/068 , H05K2201/09536 , H05K2201/096 , H05K3/4069 , H05K3/429 , H05K3/4623
摘要： A multi-layer wiring structure for mounting electronic devices is provided to be used in an electronic computer, a work station or the like, and more particularly a multi-layer packaging board having microscopic wiring layers, which board has an excellent dimensional stability and a high reliability, and also a method of producing such a board are provided. The multi-layer wiring structure includes a complex of at least two sub-assemblies each having wiring layers formed respectively on opposite sides of a core material of a low thermal expansive metal through an insulation layer in such a manner that the wiring layers correspond in area ratio to each other. The sub-assemblies are connected to one another by conductors via through holes. In this structure, the wiring structure having the core material of a low thermal expansive metal is used as a base, and therefore a dimensional change of a board is small, and microscopic wiring layers can be formed, and the reliability of connection between the sub-assemblies is enhanced. Furthermore, the board can be produced at low costs.
摘要翻译： 在电子计算机，工作站等中使用用于安装电子装置的多层布线结构，特别是具有微细布线层的多层封装板，该板具有优异的尺寸稳定性和 高可靠性，以及制造这种基板的方法。 多层布线结构包括至少两个子组件的复合体，每个子组件具有通过绝缘层分别形成在低热膨胀金属的芯材的相对侧上的布线层，使得布线层对应于区域 相互之间的比例。 子组件通过导体经由通孔彼此连接。 在这种结构中，将具有低热膨胀金属的芯材的布线结构用作基底，因此板的尺寸变化小，并且可以形成微细的布线层，并且子层之间的连接的可靠性 大会组合得到增强。 此外，该板可以低成本生产。
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5.发明授权Method of making electrical connections in the manufacture of wiring sheet assemblies 失效在制造接线板组件时制造电气连接的方法
公开(公告)号：US5497545A
公开(公告)日：1996-03-12
申请号：US34372
申请日：1993-03-18
申请人： Ryuji Watanabe , Osamu Miura , Kunio Miyazaki , Yukio Ookoshi , Akio Takahashi
发明人： Ryuji Watanabe , Osamu Miura , Kunio Miyazaki , Yukio Ookoshi , Akio Takahashi
IPC分类号： H01L21/60 , H01L21/48 , H01L21/58 , H01L23/12 , H01L23/538 , H01R12/51 , H05K3/32 , H05K3/40 , H05K3/46 , H05K3/36 , H01R9/09
CPC分类号： H05K3/4046 , H01L21/4857 , H01L21/486 , H01L23/5384 , H01L23/5385 , H01R12/523 , H01L2224/1134 , H01L2224/13099 , H01L2224/45144 , H01L2224/78301 , H01L2924/00013 , H01L2924/01014 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/15312 , H05K2201/0382 , H05K2201/10234 , H05K2201/10287 , H05K2201/10416 , H05K2203/0195 , H05K2203/0278 , H05K3/328 , H05K3/4644 , Y10T29/49126 , Y10T29/49149 , Y10T29/49151
摘要： A multi-layer wiring assembly including a stack of insulating layers, e.g. of polyimide, alternating with wiring patterns, typically of copper. To establish the circuit pattern, successive wiring patterns are connected to one another through the intervening insulating layers at predetermined locations, by metal stud connections. The studs are formed during assembly of the stack by wire-bonding a stud onto an underlying wiring pattern through a through-hole of the insulating layer above, and then stamping the exposed end of the wire-bonded stud to spread it into contact with the uppermost wiring pattern. The wire-bonded studs e.g. of Au, form strong bonds with the underlying conductor and are quick to apply in an automated process using a wire-bonding machine.
摘要翻译： 一种多层布线组件，包括一层绝缘层，例如 的聚酰亚胺，与布线图案交替，通常为铜。 为了建立电路图案，连续的布线图案通过金属螺柱连接在预定位置处通过中间绝缘层彼此连接。 通过将螺柱通过上面的绝缘层的通孔将螺柱线接合到下面的布线图案上，并且然后冲压引线接合的螺柱的暴露的端部以使其与 最上面的布线图案。 例如， 的Au与底层导体形成牢固的结合，并且使用引线接合机快速地应用于自动化过程中。
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公开(公告)号：US5120573A
公开(公告)日：1992-06-09
申请号：US416280
申请日：1989-09-27
申请人： Kunio Miyazaki , Osamu Miura , Ryuji Watanabe , Yukio Ookoshi , Toshio Miyamoto , Mikio Aizawa , Kazumasa Igarashi , Amane Mochizuki
发明人： Kunio Miyazaki , Osamu Miura , Ryuji Watanabe , Yukio Ookoshi , Toshio Miyamoto , Mikio Aizawa , Kazumasa Igarashi , Amane Mochizuki
CPC分类号： H01B1/22 , C08G73/1007 , H01B3/306 , H01L21/481 , H05K1/0346 , H01L2224/16225
摘要： The present invention provides a process for producing a metal/polyimide composite article such as high-density wiring boards. This metal/polyimide composite article is produced by a method which comprises coating a polyamic acid alkyl ester represented by the following formula on a metallic film and curing it: ##STR1## wherein R.sub.1 and R.sub.2 which may be identical or different each represents an organic group of 1 or more carbon atoms.
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公开(公告)号：US4999096A
公开(公告)日：1991-03-12
申请号：US213136
申请日：1988-06-29
申请人： Masayasu Nihei , Jin Onuki , Yasushi Koubuchi , Kunio Miyazaki , Tatsuo Itagaki
发明人： Masayasu Nihei , Jin Onuki , Yasushi Koubuchi , Kunio Miyazaki , Tatsuo Itagaki
IPC分类号： C23C14/06 , C23C14/04 , C23C14/34 , C23C14/35 , H01J37/34 , H01L21/203 , H01L21/28 , H01L21/285 , H01L21/768
CPC分类号： C23C14/345 , C23C14/046 , C23C14/35 , C23C14/358 , H01J37/321 , H01J37/34 , H01J37/3444 , H01L21/76843
摘要： A thin film forming method and apparatus is provided, wherein a negative voltage is applied alternately to a target and a substrate to perform film formation and reverse sputter alternately. Further, a coil is mounted between the target and the substrate and a high frequency current is made to flow therethrough to generate plasma. A negative base voltage smaller in absolute value than that during sputter may be applied to the substrate to make a fraction of Ar ions to flow into the substrate while it is subjected to reverse sputter. Thus, a film whose step coverage is 0.3 or more is possible. It becomes also possible to hold stable discharge and reverse sputter at a high vacuum region. The pressure of an Ar atmosphere may be lowered to 10.sup.-3 Torr or less. A film whose peak value of x-ray diffraction strength in the (111) plane is 150 Xcps or more is possible. Also, a barrier layer with a layered structure of granular and columnar crystals or a mixed structure thereof and hence with an efficient barrier effect and a large specific resistance is possible.
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公开(公告)号：US4970577A
公开(公告)日：1990-11-13
申请号：US337145
申请日：1989-04-12
申请人： Satoru Ogihara , Shunichi Numata , Kunio Miyazaki , Takashi Yokoyama , Ken Takahashi , Tasao Soga , Kazuji Yamada , Hiroichi Shinohara , Hideo Suzuki
发明人： Satoru Ogihara , Shunichi Numata , Kunio Miyazaki , Takashi Yokoyama , Ken Takahashi , Tasao Soga , Kazuji Yamada , Hiroichi Shinohara , Hideo Suzuki
IPC分类号： H01L21/60 , H01L23/12 , H01L23/498 , H01L23/52 , H01L23/64 , H05K1/02 , H05K1/03 , H05K1/14 , H05K3/34 , H05K3/36
CPC分类号： H01L23/642 , H01L23/49827 , H01L23/49833 , H05K1/141 , H01L2224/16 , H01L2224/73253 , H01L2924/01004 , H01L2924/01014 , H01L2924/01019 , H01L2924/0102 , H01L2924/01046 , H01L2924/01079 , H01L2924/15312 , H01L2924/16152 , H05K1/0271 , H05K1/0306 , H05K2201/045 , H05K2201/049 , H05K2201/068 , H05K2201/10318 , H05K2201/10704 , H05K3/3426 , H05K3/368
摘要： A semiconductor chip module includes semiconductor chips each of which has contacts on its entire front face. A multi-layered organic circuit board having a small dielectric constant is provided for mounting the semiconductor chips. Intermediate ceramic substrates having the same thermal expansion coefficient as that of the semiconductor chip, are also provided. Each such intermediate ceramic substrate has contacts on its front and back faces corresponding to those of the semiconductor chip. These contacts are electrically connected directly in a one-to-one relationship. The contacts on the semiconductor chip and the corresponding ones on the front face of the intermediate ceramic substrates are connected by solder. The contacts on the back face of the intermediate ceramic substrate and the corresponding contacts on the front face of the multi-layered ceramic circuit board are connected by respective conductive pins having a predetermined flexibility and rigidity through a predetermined gap therebetween. With this arrangement, the relative displacement due to a thermal expansion difference between the intermediate ceramic substrate and the multi-layered organic circuit board is permitted without causing substantial stress thereon.
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公开(公告)号：US4821396A
公开(公告)日：1989-04-18
申请号：US784591
申请日：1985-10-04
CPC分类号： A44B19/60 , A44B19/62 , Y10T29/49785 , Y10T29/53291 , Y10T29/53304
摘要： Separable slide fasteners are manufactured from an alongate slide fastener chain composed of a pair of slide fastener stringers having rows of coupling elements alternating with element-free portions having substantially U-shaped recesses defined in inner edges thereof. The elongate slide fastener chain is fed under tension along a longitudinal path, and the slide fastener stringers are separated from each other. Then, an insertion pin is attached laterally to the inner edge of one of the element-free portions, and a box pin is attached laterally to the inner edge of another element-free portion confronting said one element-free portion. The insertion pin and the box pin which are laterally aligned with each other are threaded through a slider until certain coupling elements of the slide fasteners stringers are interengaged. Then, a box is attached to the box pin. An elongate product composed of joined separable slide fasteners may be sewn to successive garment fabrics, or may be cut off into individual separable slide fasteners.
摘要翻译： 可分离的拉链由由一对拉链条组成的沿着拉链条的拉链链条制成，所述拉链条具有一排连接元件，所述多个连接元件与在其内边缘中限定的具有大致U形凹槽的无元件部分交替。 细长的拉链链条沿着纵向路径被张紧地进给，并且拉链条彼此分开。 然后，插入销横向地附接到一个无元件部分的内边缘，并且盒销横向地附接到面对所述一个无元件部分的另一无元件部分的内边缘。 相互横向对齐的插销和盒销穿过滑块，直到拉链连接件的某些连接元件相互接合为止。 然后，盒子被连接到盒子销。 由连接的可分离拉链组成的细长产品可以缝合到连续的衣服织物上，或者可以切割成单独的可分离拉链。
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公开(公告)号：US4690793A
公开(公告)日：1987-09-01
申请号：US581076
申请日：1984-02-17
申请人： Hisanori Okamura , Kunio Miyazaki , Hirosi Akiyama , Shinichi Itoh , Tomio Yasuda , Kousuke Nakamura , Yukio Okoshi , Mutuo Kamoshita , Akio Chiba
发明人： Hisanori Okamura , Kunio Miyazaki , Hirosi Akiyama , Shinichi Itoh , Tomio Yasuda , Kousuke Nakamura , Yukio Okoshi , Mutuo Kamoshita , Akio Chiba
CPC分类号： G21B1/13 , B23K1/0008 , B23K1/19 , B23K1/20 , Y02E30/128 , Y10S228/903 , Y10S376/90 , Y10T428/12507 , Y10T428/12576 , Y10T428/12611 , Y10T428/12764 , Y10T428/12903
摘要： The nuclear fusion reactor of the present invention presents a new vacuum vessel for enclosing plasma particles where a reactor wall exposed to the above plasma particles has a piled structure. A plurality of heat-resisting ceramic tiles are metallurgically bonded to a metal-base body having a cooling means through a brazing material. The ceramic tiles are preferably composed of sintered silicon carbide of high density and containing a little beryllium oxide between the boundaries of crystal grains.
摘要翻译： 本发明的核聚变反应器提供了用于封闭等离子体颗粒的新的真空容器，其中暴露于上述等离子体颗粒的反应器壁具有堆叠结构。 多个耐热陶瓷砖通过钎焊材料冶金地结合到具有冷却装置的金属基体上。 陶瓷砖优选由高密度的烧结碳化硅构成，并且在晶粒边界之间含有少量氧化铍。
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