The photosensitive resin composition of the present invention comprises an admixture of 5 to 100 weight parts of a photosensitive material having the following general formula (A) and 100 weight parts of an alkali-soluble resin:General formula (A) ##STR1## where R.sub.1 to R.sub.8 each independently represents a hydrogen atom, a hydroxyl group, a halogen atom, an alkyl group, an alkoxyl group, an aralkyl group, an aryl group, an amino group, a monoalkylamino group, a dialkylamino group, an acylamino group, an alkylcarbamoyl group, an arylcarbamoyl group, an alkylsulfamoyl group, an arylsulfamoyl group, a carboxyl group, a cyano group, a nitro group, an acyl group, an alkyloxycarbonyl group, an aryloxycarbonyl group, an acyloxy group, or --OD, --N(R)--D (where R represents a hydrogen atom or an alkyl group, and D represents a 1,2-napthoquinoediazide-5-sulfonyl group or a 1,2-napthoquinoediazide-4-sulfonyl group), and at least one of R.sub.1 to R.sub.8 represents --OD or --N(R)--D; R.sub.9 to R.sub.12 each independently represents a hydrogen atom, a lower alkyl group, or R.sub.9 and R.sub.10 and/or R.sub.11 and R.sub.12 may form a ring; R.sub.13 to R.sub.14 each independently represents a hydrogen atom, a lower alkyl group, or R.sub.13 or R.sub.14 and any of R.sub.15 or R.sub.16 may form a ring, whereas at least one of R.sub.13 to R.sub.16 is a substitution group other than hydrogen; and Z represents an oxygen atom or a single bond.