发明授权
- 专利标题： Multi-chip electronic package module utilizing an adhesive sheet
- 专利标题（中）： 使用粘合片的多芯片电子封装模块
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申请号： US153240申请日： 1993-11-16
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公开(公告)号： US5360942A公开(公告)日： 1994-11-01
- 发明人: Paul R. Hoffman , Dexin Liang
- 申请人： Paul R. Hoffman , Dexin Liang
- 申请人地址： CA Manteca
- 专利权人： Olin Corporation
- 当前专利权人： Olin Corporation
- 当前专利权人地址： CA Manteca
- 主分类号： H01L25/18
- IPC分类号： H01L25/18 ; H01L21/58 ; H01L23/057 ; H01L23/13 ; H01L23/31 ; H01L23/495 ; H01L25/04 ; H01L23/02
摘要：
There is provided a module for supporting a plurality of semiconductor devices within an electronic package. The module has a support substrate and an apertured substrate laminated together with a polymer adhesive. A plurality of semiconductor devices are disposed within apertures formed in the apertured substrate and bonded to the support substrate by that same polymer adhesive.
公开/授权文献
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