发明授权
US5389270A Composition and process for preparing a non-conductive substrate for
electroplating
失效
用于制备用于电镀的非导电基底的组合物和方法
- 专利标题: Composition and process for preparing a non-conductive substrate for electroplating
- 专利标题(中): 用于制备用于电镀的非导电基底的组合物和方法
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申请号: US062943申请日: 1993-05-17
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公开(公告)号: US5389270A公开(公告)日: 1995-02-14
- 发明人: Charles E. Thorn , Frank Polakovic , Charles A. Mosolf
- 申请人: Charles E. Thorn , Frank Polakovic , Charles A. Mosolf
- 申请人地址: OH Youngstown
- 专利权人: Electrochemicals, Inc.
- 当前专利权人: Electrochemicals, Inc.
- 当前专利权人地址: OH Youngstown
- 主分类号: C25D5/54
- IPC分类号: C25D5/54 ; H05K3/42 ; C10M125/02
摘要:
The present invention is directed to an improved composition and process for preparing a non-conductive substrate for electroplating. The composition comprises 0.1 to 20% by weight graphite having a mean particle size within the range of 0.05 to 50 microns; 0.01 to 10% by weight of a water soluble or dispersible binding agent for binding to the graphite particles; an effective amount of an anionic dispersing agent for dispersing the bound graphite particles; a pH within the range of 4-14; and an aqueous dispersing medium. Optionally, the composition may contain an amount of a surfactant that is effective for wetting the through hole. The resulting graphite dispersion is capable of uniformly coating the through holes in either a double-sided or multi-layer circuit board prior to electroplating. Through holes that were treated with the disclosed graphite dispersion prior to electroplating were free of visible voids after electroplating.