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1.发明授权Additives to stop copper attack by alkaline etching agents such as ammonia and monoethanol amine (MEA) 有权碱性蚀刻剂如氨和单乙醇胺（MEA）阻止铜侵蚀的添加剂公开(公告)号：US07211204B2
公开(公告)日：2007-05-01
申请号：US10735424
申请日：2003-12-12
IPC分类号： H01B1/24
CPC分类号： C23G1/20 , C23F11/149 , H01C17/28 , H05K3/383 , H05K3/424 , H05K3/427 , H05K2201/0323 , H05K2203/124
摘要： A corrosive composition, such as an alkaline aqueous carbon dispersion, a cleaner, a cleaner conditioner, or a conditioner, comprises a corrosion inhibitor, e.g., benzotriazole. The corrosion inhibitor is present in an amount effective to reduce or stop the dissolution of metal from a metallic surface, such as a printed circuit board, in contact with the composition. A method to reduce or stop the dissolution of metal from a metallic surface in contact with a corrosive composition, and a method to stabilize or recover a corrosive composition containing metal contaminants by adding an effective amount of a corrosion inhibitor to the corrosive composition.
摘要翻译： 腐蚀性组合物，例如碱性含水碳分散体，清洁剂，清洁剂调理剂或调理剂，包括缓蚀剂，例如苯并三唑。 腐蚀抑制剂以有效地减少或停止金属与金属表面（例如印刷电路板）与组合物接触的溶解的量存在。 减少或停止与腐蚀性组合物接触的金属表面溶解金属的方法，以及通过向腐蚀性组合物中加入有效量的腐蚀抑制剂来稳定或回收含有金属污染物的腐蚀性组合物的方法。
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公开(公告)号：US07108795B2
公开(公告)日：2006-09-19
申请号：US11165097
申请日：2005-06-23
CPC分类号： B32B38/00 , B32B2038/0052 , B32B2311/12 , B32B2457/08 , C23C22/52 , C23F1/18 , H05K3/282 , H05K3/383 , H05K3/385 , H05K3/389 , H05K2201/0239 , H05K2203/0796 , H05K2203/121 , H05K2203/124
摘要： The invention is directed to a method and composition for providing chemically-resistant roughened copper surfaces suitable for subsequent multilayer lamination. In one embodiment, a smooth copper surface is contacted with an adhesion promoting composition under conditions effective to provide a roughened copper surface, the adhesion promoting composition comprising an oxidizer, a pH adjuster, a topography modifier, and a sulfur-containing coating stabilizer. In another embodiment, a smooth copper surface is contacted with an adhesion promoting composition under conditions effective to provide a roughened copper surface, the adhesion promoting composition comprising an oxidizer, a pH adjuster, and a topography modifier. Then, in a subsequent step, the roughened copper surface is contacted with an acid resistance promoting composition.
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公开(公告)号：US5476580A
公开(公告)日：1995-12-19
申请号：US232574
申请日：1994-05-03
IPC分类号： B01F17/00 , C08K3/04 , C08L101/00 , C09D201/00 , C25D5/54 , C25D7/00 , H05K3/42 , C25D5/02
CPC分类号： H05K3/424 , C25D5/54 , H05K2201/0323 , H05K2203/122 , H05K3/427
摘要： A composition and process for preparing a non-conductive substrate for electroplating. The composition comprises 0.1 to 20% by weight carbon (e.g. graphite or carbon black) having a mean particle size within the range of 0.05 to 50 microns; optionally, 0.01 to 10% by weight of a water soluble or dispersible binding agent for binding to the carbon particles; optionally, an effective amount of an anionic dispersing agent for dispersing the bound carbon particles; optionally, an amount of a surfactant that is effective for wetting the through hole; a pH within the range of 4-14; and an aqueous dispersing medium. Improved methods of applying the composition to a through hole, a printed wiring board having a through hole treated with the composition, and a method of fixing a carbon coating deposited on a through hole using an acid solution are also disclosed.
摘要翻译： 一种用于制备用于电镀的非导电基底的组合物和方法。 组合物包含0.1至20重量％的平均粒径在0.05至50微米范围内的碳（例如石墨或炭黑）; 任选地，0.01至10重量％的用于结合碳颗粒的水溶性或可分散结合剂; 任选地，有效量的用于分散结合的碳颗粒的阴离子分散剂; 任选地，一定量的有效润湿通孔的表面活性剂; pH在4-14范围内; 和水分散介质。 还公开了将组合物施加到通孔的改进方法，具有通过组合物处理的通孔的印刷线路板以及使用酸溶液固定沉积在通孔上的碳涂层的方法。
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4.发明申请Methods to stop copper attach by alkaline etching agents such as ammonia and monoethanol amine (MEA) 审中-公开碱性蚀刻剂如氨和单乙醇胺（MEA）阻止铜附着的方法公开(公告)号：US20060102879A1
公开(公告)日：2006-05-18
申请号：US11321409
申请日：2005-12-29
申请人： Roger Bernards , Beth LaFayette , Thao Pham
发明人： Roger Bernards , Beth LaFayette , Thao Pham
IPC分类号： H01B1/12
CPC分类号： C23G1/20 , C23F11/149 , H01C17/28 , H05K3/383 , H05K3/424 , H05K3/427 , H05K2201/0323 , H05K2203/124
摘要： A corrosive composition, such as an alkaline aqueous carbon dispersion, a cleaner, a cleaner conditioner, or a conditioner, comprises a corrosion inhibitor, e.g., benzotriazole. The corrosion inhibitor is present in an amount effective to reduce or stop the dissolution of metal from a metallic surface, such as a printed circuit board, in contact with the composition. A method to reduce or stop the dissolution of metal from a metallic surface in contact with a corrosive composition, and a method to stabilize or recover a corrosive composition containing metal contaminants by adding an effective amount of a corrosion inhibitor to the corrosive composition.
摘要翻译： 腐蚀性组合物，例如碱性含水碳分散体，清洁剂，清洁剂调理剂或调理剂，包括缓蚀剂，例如苯并三唑。 腐蚀抑制剂以有效地减少或停止金属与金属表面（例如印刷电路板）与组合物接触的溶解的量存在。 减少或停止与腐蚀性组合物接触的金属表面溶解金属的方法，以及通过向腐蚀性组合物中加入有效量的腐蚀抑制剂来稳定或回收含有金属污染物的腐蚀性组合物的方法。
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公开(公告)号：US6037020A
公开(公告)日：2000-03-14
申请号：US790294
申请日：1997-01-29
CPC分类号： H05K3/0088 , H05K3/424
摘要： A method for treating a non-conductive through hole surface of a printed wiring board is disclosed. A printed wiring board including through holes is cleaned, conditioned, and a conductive coating is applied to the initially-nonconductive through hole by contacting it with a series of baths. The conductive coating, for example a graphite dispersion coating, facilitates later electroplating of the conductive surface. While at least partially immersing the through hole in one or more of these baths, ultrasonic energy is introduced in the bath in the vicinity of the through hole. The ultrasonic energy can be introduced during the entire immersing step, before the immersing step, or both. The ultrasonic energy reduces the formation of blowholes during later processing (and especially soldering) of the printed wiring board. The ultrasonic treatment can also improve the dispersion of the conductive particles in a conductive carbon dispersion, reduce or eliminate the formation of pinhole defects, and provide other advantages.
摘要翻译： 公开了一种用于处理印刷电路板的非导电通孔表面的方法。 包括通孔的印刷电路板被清洁，调理，并且通过使其与一系列的浴接触，将导电涂层施加到初始非导电通孔。 导电涂层，例如石墨分散体涂层有利于导电表面的后续电镀。 尽管至少部分地将通孔浸入这些浴中的一个或多个中，但在通孔附近的浴中引入超声波能量。 在整个浸渍步骤期间，浸渍步骤之前或两者都可以引入超声波能量。 超声波能量在后续加工（尤其是焊接）印刷线路板时减少了气孔的形成。 超声波处理还可以改善导电颗粒在导电碳分散体中的分散，减少或消除针孔缺陷的形成，并提供其他优点。
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公开(公告)号：US07351353B1
公开(公告)日：2008-04-01
申请号：US09479089
申请日：2000-01-07
申请人： Roger Bernards , Hector Gonzalez , Al Kucera , Mike Schanhaar
发明人： Roger Bernards , Hector Gonzalez , Al Kucera , Mike Schanhaar
IPC分类号： C09K13/00
CPC分类号： C23C22/68 , C23C22/52 , C23C2222/20 , C23F1/18 , H05K3/383 , H05K3/385 , H05K3/389 , H05K3/4611 , H05K2201/0239 , H05K2203/0793 , H05K2203/0796 , H05K2203/124
摘要： The invention is directed to a method and composition for providing roughened copper surfaces suitable for subsequent multilayer lamination. A smooth copper surface is contacted with an adhesion promoting composition under conditions effective to provide a roughened copper surface, the adhesion promoting composition consisting essentially of an oxidizer, a pH adjuster, a topography modifier, and a uniformity enhancer. A coating promoter may be used in place of the uniformity enhancer or in addition to the uniformity enhancer. The adhesion promoting composition does not require a surfactant. The process may further comprise the step of contacting the uniform roughened copper surface with a post-dip, wherein the post-dip comprises an azole or silane compound or a combination of said azole and said silane. The post-dip may further comprise, alone or in combination, a titanate, zirconate, and an aluminate. The pH adjuster is preferably sulfuric acid and the oxidizer is preferably hydrogen peroxide. A hydrogen peroxide stabilizer may be used in the adhesion promoting composition.
摘要翻译： 本发明涉及一种用于提供适于随后的多层层压的粗糙化铜表面的方法和组合物。 在有效提供粗糙化铜表面的条件下，光滑的铜表面与增粘组合物接触，该粘附促进组合物基本上由氧化剂，pH调节剂，形貌改性剂和均匀性增强剂组成。 可以使用涂层促进剂来代替均匀性增强剂，或者除了均匀性增强剂之外。 粘合促进组合物不需要表面活性剂。 该方法还可以包括使均匀的粗糙化铜表面与浸渍后接触的步骤，其中后浸渍包括唑或硅烷化合物或所述唑和所述硅烷的组合。 后浸渍可以单独地或组合地包含钛酸盐，锆酸盐和铝酸盐。 pH调节剂优选为硫酸，氧化剂优选为过氧化氢。 在粘合促进组合物中可以使用过氧化氢稳定剂。
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7.发明授权Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substrates 有权用于制备耐化学腐蚀的粗糙铜表面用于粘合到基底的组合物和方法公开(公告)号：US06946027B2
公开(公告)日：2005-09-20
申请号：US10782177
申请日：2004-02-17
IPC分类号： B05D1/18 , B05D3/00 , B32B38/00 , C23C22/52 , C23F1/18 , H05K3/28 , H05K3/38 , C09K13/00 , B05D3/10 , C09K13/06
CPC分类号： B32B38/00 , B32B2038/0052 , B32B2311/12 , B32B2457/08 , C23C22/52 , C23F1/18 , H05K3/282 , H05K3/383 , H05K3/385 , H05K3/389 , H05K2201/0239 , H05K2203/0796 , H05K2203/121 , H05K2203/124
摘要： The invention is directed to a method and composition for providing chemically-resistant roughened copper surfaces suitable for subsequent multilayer lamination. In one embodiment, a smooth copper surface is contacted with an adhesion promoting composition under conditions effective to provide a roughened copper surface, the adhesion promoting composition comprising an oxidizer, a pH adjuster, a topography modifier, and a sulfur-containing coating stabilizer. In another embodiment, a smooth copper surface is contacted with an adhesion promoting composition under conditions effective to provide a roughened copper surface, the adhesion promoting composition comprising an oxidizer, a pH adjuster, and a topography modifier. Then, in a subsequent step, the roughened copper surface is contacted with an acid resistance promoting composition.
摘要翻译： 本发明涉及一种用于提供适于随后的多层层压的耐化学腐蚀的粗糙铜表面的方法和组合物。 在一个实施方案中，光滑的铜表面在有效提供粗糙的铜表面的条件下与促粘合组合物接触，该粘合促进组合物包含氧化剂，pH调节剂，形貌改性剂和含硫涂料稳定剂。 在另一个实施方案中，在有效提供粗糙化铜表面的条件下，光滑的铜表面与增粘组合物接触，所述粘合促进组合物包含氧化剂，pH调节剂和形貌改性剂。 然后，在随后的步骤中，将粗糙化的铜表面与耐酸性促进组合物接触。
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公开(公告)号：US5985040A
公开(公告)日：1999-11-16
申请号：US157909
申请日：1998-09-21
CPC分类号： H05K3/0055 , H05K2203/0783 , H05K2203/0793 , H05K2203/0796
摘要： An improved desmear process for removing resin smeared on an interior wall of a through hole drilled in a resinous substrate, especially resinous substrates made from epoxy, polyimide, cyanate ester resins and bis-maleimide triazine epoxy resins. The process involves contacting the resin smear with a solvent solution to soften the resin smear, followed by treatment with an alkaline permanganate solution to remove the softened resin, and treatment with a neutralizer to neutralize and remove the permanganate residues. The solvent solution comprises a mixture of at least two solvent components, with at least one solvent component being selected from the group consisting of gamma-butyrolactone, ethyl-3-ethoxypropionate, N-ethyl-2-pyrrolidone, N-cyclohexyl-2-pyrrolidone, N-(2-hydroxyethyl)-2-pyrrolidone, and N-octyl-2-pyrrolidone. The solvent solution is selective for the softening and removal of epoxy, polyimide, cyanate ester resins and bis-maleimide triazine epoxy resins.
摘要翻译： 用于去除在树脂基材中钻出的通孔的内壁上涂抹的树脂的改进的去污工艺，特别是由环氧树脂，聚酰亚胺，氰酸酯树脂和双马来酰亚胺三嗪环氧树脂制成的树脂基材。 该方法包括使树脂涂片与溶剂溶液接触以软化树脂涂片，然后用碱性高锰酸盐溶液处理以除去软化树脂，并用中和剂处理以中和除去高锰酸盐残留物。 溶剂溶液包含至少两种溶剂组分的混合物，至少一种溶剂组分选自γ-丁内酯，3-乙氧基丙酸乙酯，N-乙基-2-吡咯烷酮，N-环己基-2- 吡咯烷酮，N-（2-羟乙基）-2-吡咯烷酮和N-辛基-2-吡咯烷酮。 溶剂溶液对于环氧树脂，聚酰亚胺，氰酸酯树脂和双马来酰亚胺三嗪环氧树脂的软化和除去是选择性的。
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公开(公告)号：US5492595A
公开(公告)日：1996-02-20
申请号：US226017
申请日：1994-04-11
CPC分类号： C23C22/83 , C23C22/63 , H05K3/385 , H05K2201/0355 , H05K2203/0307 , H05K2203/0315 , H05K2203/0723 , H05K2203/1157 , H05K3/4611 , Y10T428/24917
摘要： The present invention is directed to an improved method for treating an oxidized surface of a copper film for bonding to a resinous layer such as in the formation of a single-sided, double-sided, or multi-layered circuit board and to a layered product produced by the method. In particular, the method of the present invention comprises the steps of: contacting the oxidized surface of a copper film, having cupric oxide whiskers protruding therefrom, with an acidic reducing solution having a pH of 1 to 6.5 and having an effective amount of a water soluble thiosulfate reducing agent dissolved therein to provide a reduced copper surface; and rinsing the reduced copper surface with an acidic solution to produce a rinsed and reduced copper surface having reduced whiskers protruding therefrom, said reduced whiskers each being a mix of cuprous oxide and metallic copper. Preferably, the reduced surface is treated with a passivating agent to minimize any reoxidation prior to laminate formation.
摘要翻译： 本发明涉及用于处理例如形成单面，双面或多层电路板的树脂层的铜膜的氧化表面的改进方法和层叠体 由该方法生产。 具体而言，本发明的方法包括以下步骤：将具有从其突出的具有氧化铜晶须的铜膜的氧化表面与pH为1至6.5的酸性还原溶液接触并具有有效量的水 可溶性硫代硫酸盐还原剂溶解在其中以提供还原铜表面; 并用酸性溶液冲洗还原的铜表面，以产生漂白和还原的铜表面，其中从其中突出的晶须减少，所述还原晶须各自是氧化亚铜和金属铜的混合物。 优选地，还原表面用钝化剂处理以最小化层压体形成之前的任何再氧化。
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公开(公告)号：US07186923B2
公开(公告)日：2007-03-06
申请号：US10728423
申请日：2003-12-05
IPC分类号： H05K1/09
CPC分类号： C25D5/44 , C25D5/54 , H05K3/424 , H05K3/427 , H05K2201/0323 , H05K2203/122
摘要： A printed wiring board comprising conductive layers separated by nonconductive material and having through holes or other nonconductive surfaces on which an electrically conductive carbon coating is formed. The conductive carbon coating includes electrically conductive carbon having a mean particle size not greater than about 1 micron and a water-dispersible organic binding agent. The conductive carbon coating formed on the nonconductive surfaces has a low electrical resistance and is tenacious enough to be plated and exposed to molten solder without creating voids or losing adhesion.
摘要翻译： 一种印刷电路板，包括由非导电材料分隔的导电层，并且具有形成有导电碳涂层的通孔或其它非导电表面。 导电碳涂层包括平均粒度不大于约1微米的导电碳和水分散性有机粘合剂。 形成在非导电表面上的导电碳涂层具有低电阻，并且足够坚固以电镀并暴露于熔融焊料，而不产生空隙或失去粘合力。
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