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公开(公告)号：US5476580A
公开(公告)日：1995-12-19
申请号：US232574
申请日：1994-05-03
IPC分类号： B01F17/00 , C08K3/04 , C08L101/00 , C09D201/00 , C25D5/54 , C25D7/00 , H05K3/42 , C25D5/02
CPC分类号： H05K3/424 , C25D5/54 , H05K2201/0323 , H05K2203/122 , H05K3/427
摘要： A composition and process for preparing a non-conductive substrate for electroplating. The composition comprises 0.1 to 20% by weight carbon (e.g. graphite or carbon black) having a mean particle size within the range of 0.05 to 50 microns; optionally, 0.01 to 10% by weight of a water soluble or dispersible binding agent for binding to the carbon particles; optionally, an effective amount of an anionic dispersing agent for dispersing the bound carbon particles; optionally, an amount of a surfactant that is effective for wetting the through hole; a pH within the range of 4-14; and an aqueous dispersing medium. Improved methods of applying the composition to a through hole, a printed wiring board having a through hole treated with the composition, and a method of fixing a carbon coating deposited on a through hole using an acid solution are also disclosed.
摘要翻译： 一种用于制备用于电镀的非导电基底的组合物和方法。 组合物包含0.1至20重量％的平均粒径在0.05至50微米范围内的碳（例如石墨或炭黑）; 任选地，0.01至10重量％的用于结合碳颗粒的水溶性或可分散结合剂; 任选地，有效量的用于分散结合的碳颗粒的阴离子分散剂; 任选地，一定量的有效润湿通孔的表面活性剂; pH在4-14范围内; 和水分散介质。 还公开了将组合物施加到通孔的改进方法，具有通过组合物处理的通孔的印刷线路板以及使用酸溶液固定沉积在通孔上的碳涂层的方法。
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2.发明授权Composition and process for preparing a non-conductive substrate for electroplating 失效用于制备用于电镀的非导电基底的组合物和方法
公开(公告)号：US5389270A
公开(公告)日：1995-02-14
申请号：US062943
申请日：1993-05-17
IPC分类号： C25D5/54 , H05K3/42 , C10M125/02
CPC分类号： H05K3/424 , C25D5/54 , H05K2201/0323 , H05K2203/122 , H05K3/427
摘要： The present invention is directed to an improved composition and process for preparing a non-conductive substrate for electroplating. The composition comprises 0.1 to 20% by weight graphite having a mean particle size within the range of 0.05 to 50 microns; 0.01 to 10% by weight of a water soluble or dispersible binding agent for binding to the graphite particles; an effective amount of an anionic dispersing agent for dispersing the bound graphite particles; a pH within the range of 4-14; and an aqueous dispersing medium. Optionally, the composition may contain an amount of a surfactant that is effective for wetting the through hole. The resulting graphite dispersion is capable of uniformly coating the through holes in either a double-sided or multi-layer circuit board prior to electroplating. Through holes that were treated with the disclosed graphite dispersion prior to electroplating were free of visible voids after electroplating.
摘要翻译： 本发明涉及用于制备用于电镀的非导电基底的改进的组合物和方法。 该组合物包含0.1至20重量％的平均粒度在0.05至50微米范围内的石墨; 0.01至10重量％的用于结合石墨颗粒的水溶性或可分散结合剂; 有效量的用于分散结合的石墨颗粒的阴离子分散剂; pH在4-14范围内; 和水分散介质。 任选地，组合物可以含有一定量的有效润湿通孔的表面活性剂。 所得到的石墨分散体能够在电镀之前均匀地涂覆在双面或多层电路板中的通孔。 在电镀之前用公开的石墨分散体处理的通孔在电镀后没有可见的空隙。
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3.发明授权公开(公告)号：US06303181B1
公开(公告)日：2001-10-16
申请号：US09527706
申请日：2000-03-17
IPC分类号： B05D512
CPC分类号： C25D5/44 , C25D5/54 , H05K3/424 , H05K3/427 , H05K2201/0323 , H05K2203/122
摘要： A method of applying a conductive carbon coating to a nonconductive surface, conductive carbon compositions for that purpose, and a printed wiring board having through holes or other nonconductive surfaces treated with such carbon compositions are disclosed. A conditioning agent, made (for example) by condensing a polyamide and epichlorohydrin, is applied to the nonconductive surface to form a conditioned surface. A liquid dispersion of electrically conductive carbon (for example, graphite) having a mean particle size no greater than about 50 microns is coated on the conditioned surface to form an electrically conductive carbon coating. The conductive carbon coating is then optionally fixed on the (formerly) nonconductive surface. Fixing may be accomplished, for example, by applying a fixing liquid such as a dilute aqueous acid to the carbon-coated surface. The coating is then dried.
摘要翻译： 公开了一种将导电碳涂层施加到非导电表面的方法，用于此目的的导电碳组合物和具有通过这些碳组合物处理的通孔或其它非导电表面的印刷线路板。 通过将聚酰胺和表氯醇缩合制成（例如）的调理剂施加到非导电表面以形成调理表面。 将平均粒度不大于约50微米的导电碳（例如石墨）的液体分散体涂覆在调理表面上以形成导电碳涂层。 然后将导电碳涂层任选地固定在（原来）非导电表面上。 固定可以例如通过将诸如稀酸水的定影液施加到碳涂覆的表面来实现。 然后将涂层干燥。
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公开(公告)号：US06710259B2
公开(公告)日：2004-03-23
申请号：US09954486
申请日：2001-09-17
IPC分类号： H05K109
CPC分类号： C25D5/44 , C25D5/54 , H05K3/424 , H05K3/427 , H05K2201/0323 , H05K2203/122
摘要： A method of applying a conductive carbon coating to a non-conductive surface and a printed wiring board having through holes or other nonconductive surfaces treated with such carbon coatings are disclosed. A conditioning agent is applied to the non-conductive surface to form a conditioned surface. A liquid dispersion of electrically conductive carbon (for example, graphite) having a mean particle size no greater than about 50 microns, combined with an organic binding agent, is coated on the conditioned surface to form an electrically conductive carbon coating. The conductive carbon coating is then optionally fixed on the (formerly) nonconductive surface and dried. The resulting coating has a low electrical resistance and is tenacious enough to be plated and exposed to molten solder without creating voids or losing adhesion, yet is easily removable from copper surfaces of the substrate by microetching.
摘要翻译： 公开了一种将导电碳涂层施加到非导电表面的方法和具有通过这些碳涂层处理的通孔或其它非导电表面的印刷线路板。 将调理剂施加到非导电表面以形成调理表面。 将平均粒度不大于约50微米的导电碳（例如石墨）与有机粘合剂组合的液体分散体涂覆在调理表面上以形成导电碳涂层。 然后将导电碳涂层任选地固定在（以前）非导电表面上并干燥。 所得到的涂层具有低的电阻，并且足够坚固地镀覆并暴露于熔融焊料，而不产生空隙或失去粘附性，而通过微蚀刻可以很容易地从基底的铜表面上移除。
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公开(公告)号：US06171468B2
公开(公告)日：2001-01-09
申请号：US08975613
申请日：1997-11-21
IPC分类号： C25D502
CPC分类号： C25D5/44 , C25D5/54 , H05K3/424 , H05K3/427 , H05K2201/0323 , H05K2203/122
摘要： A method of applying a conductive carbon coating to a non-conductive surface, conductive carbon compositions for that purpose, and a printed wiring board having through holes or other nonconductive surfaces treated with such carbon compositions are disclosed. A liquid dispersion of electrically conductive carbon (for example, graphite) having a mean particle size no greater than about 50 microns is coated on the non-conductive surface to form an electrically conductive carbon coating. The conductive carbon coating is then fixed on the (formerly) nonconductive surface. Fixing may be accomplished in a variety of different ways. For example, the fixing step can be carried out by applying a fixing liquid to the carbon-coated surface. One example of a suitable fixing liquid is a dilute aqueous acid. Fixing may also be carried out by removing the excess carbon dispersion with an air knife or other source of compressed air. The fixing process removes excessive carbon composition deposits, and thus smooths the carbon coating on the recess surfaces by eliminating lumps and by making the coating more uniform. Fixing can also crosslink the first monolayer of carbon which is directly attached to the substrate or an aqueous organic binding agent associated with the coating. The resulting coating has a low electrical resistance and is tenacious enough to be plated and exposed to molten solder without creating voids or losing adhesion.
摘要翻译： 公开了一种将导电碳涂层施加到非导电表面的方法，用于该目的的导电性碳组合物和具有通过这种碳组合物处理的通孔或其它非导电表面的印刷线路板。 平均粒度不大于约50微米的导电碳（例如石墨）的液体分散体涂覆在非导电表面上以形成导电碳涂层。 然后将导电碳涂层固定在（以前）非导电表面上。 固定可以以各种不同的方式实现。 例如，可以通过向碳涂覆表面施加定影液来进行定影步骤。 合适的固定液体的一个实例是稀酸水溶液。 还可以通过用气刀或其它压缩空气源去除多余的碳分散体来进行固定。 定影过程消除了过多的碳组成沉积物，从而通过消除块状物并使涂层更均匀地平滑了凹陷表面上的碳涂层。 固定还可以交联直接连接到基底的第一单层碳或与涂层相关的水性有机粘合剂。 所得到的涂层具有低的电阻，并且足够坚固地被电镀并暴露于熔融焊料中，而不产生空隙或失去粘合力。
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公开(公告)号：US07186923B2
公开(公告)日：2007-03-06
申请号：US10728423
申请日：2003-12-05
IPC分类号： H05K1/09
CPC分类号： C25D5/44 , C25D5/54 , H05K3/424 , H05K3/427 , H05K2201/0323 , H05K2203/122
摘要： A printed wiring board comprising conductive layers separated by nonconductive material and having through holes or other nonconductive surfaces on which an electrically conductive carbon coating is formed. The conductive carbon coating includes electrically conductive carbon having a mean particle size not greater than about 1 micron and a water-dispersible organic binding agent. The conductive carbon coating formed on the nonconductive surfaces has a low electrical resistance and is tenacious enough to be plated and exposed to molten solder without creating voids or losing adhesion.
摘要翻译： 一种印刷电路板，包括由非导电材料分隔的导电层，并且具有形成有导电碳涂层的通孔或其它非导电表面。 导电碳涂层包括平均粒度不大于约1微米的导电碳和水分散性有机粘合剂。 形成在非导电表面上的导电碳涂层具有低电阻，并且足够坚固以电镀并暴露于熔融焊料，而不产生空隙或失去粘合力。
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公开(公告)号：US5725807A
公开(公告)日：1998-03-10
申请号：US486331
申请日：1995-06-07
CPC分类号： H05K3/424 , C25D5/44 , C25D5/54 , H05K2201/0323 , H05K2203/122
摘要： A method of applying a conductive carbon coating to a non-conductive layer, conductive carbon compositions, and a printed wiring board having through holes or other surfaces treated with such carbon compositions are disclosed. A board or other substrate including at least first and second electrically conductive metal layers separated by a non-conductive layer is provided. The board has a recess extending through at least one of the metal layers into the non-conductive layer. The recess has a non-conductive surface which is desired to be made electrically conductive. The carbon in the dispersion has a mean particle size no greater than about 50 microns. The method is carried out by applying the carbon dispersion to a non-conductive surface of the recess to form a substantially continuous, electrically conductive carbon coating. Optionally, the coating is then fixed, leaving the carbon deposit as a substantially continuous, electrically conductive layer. Chemical and physical fixing steps are disclosed. The resulting coating has a low electrical resistance and is tenacious enough to be plated and exposed to molten solder without creating voids or losing adhesion.
摘要翻译： 公开了一种将导电碳涂层施加到非导电层，导电碳组合物和具有通过这些碳组合物处理的通孔或其它表面的印刷线路板的方法。 提供了包括由非导电层分开的至少第一和第二导电金属层的板或其他基板。 板具有延伸穿过至少一个金属层进入非导电层的凹部。 凹槽具有期望导电的非导电表面。 分散体中的碳具有不大于约50微米的平均粒度。 该方法通过将碳分散体施加到凹陷的非导电表面上以形成基本连续的导电碳涂层来进行。 任选地，涂层然后固定，留下碳沉积物作为基本连续的导电层。 公开了化学和物理固定步骤。 所得到的涂层具有低的电阻，并且足够坚固地被电镀并暴露于熔融焊料中，而不产生空隙或失去粘合力。
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公开(公告)号：US5690805A
公开(公告)日：1997-11-25
申请号：US471871
申请日：1995-06-07
CPC分类号： C25D5/44 , C25D5/54 , H05K3/424 , H05K2201/0323 , H05K2203/122
摘要： A method of applying a conductive carbon coating to a non-conductive layer, conductive carbon compositions, and a printed wiring board having through holes or other surfaces treated with such carbon compositions are disclosed. A board or other substrate including at least first and second electrically conductive metal layers separated by a non-conductive layer is provided. The board has a recess extending through at least one of the metal layers into the non-conductive layer. The recess has a non-conductive surface which is desired to be made electrically conductive. The carbon in the dispersion has a mean particle size no greater than about 50 microns. The method is carried out by applying the carbon dispersion to a non-conductive surface of the recess to form a substantially continuous, electrically conductive carbon coating. Optionally, the coating is then fixed, leaving the carbon deposit as a substantially continuous, electrically conductive layer. Chemical and physical fixing steps are disclosed. The resulting coating has a low electrical resistance and is tenacious enough to be plated and exposed to molten solder without creating voids or losing adhesion.
摘要翻译： 公开了一种将导电碳涂层施加到非导电层，导电碳组合物和具有通过这些碳组合物处理的通孔或其它表面的印刷线路板的方法。 提供了包括由非导电层分开的至少第一和第二导电金属层的板或其他基板。 板具有延伸穿过至少一个金属层进入非导电层的凹部。 凹槽具有期望导电的非导电表面。 分散体中的碳具有不大于约50微米的平均粒度。 该方法通过将碳分散体施加到凹陷的非导电表面上以形成基本连续的导电碳涂层来进行。 任选地，涂层然后固定，留下碳沉积物作为基本连续的导电层。 公开了化学和物理固定步骤。 所得到的涂层具有低的电阻，并且足够坚固地被电镀并暴露于熔融焊料中，而不产生空隙或失去粘合力。
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公开(公告)号：US6037020A
公开(公告)日：2000-03-14
申请号：US790294
申请日：1997-01-29
CPC分类号： H05K3/0088 , H05K3/424
摘要： A method for treating a non-conductive through hole surface of a printed wiring board is disclosed. A printed wiring board including through holes is cleaned, conditioned, and a conductive coating is applied to the initially-nonconductive through hole by contacting it with a series of baths. The conductive coating, for example a graphite dispersion coating, facilitates later electroplating of the conductive surface. While at least partially immersing the through hole in one or more of these baths, ultrasonic energy is introduced in the bath in the vicinity of the through hole. The ultrasonic energy can be introduced during the entire immersing step, before the immersing step, or both. The ultrasonic energy reduces the formation of blowholes during later processing (and especially soldering) of the printed wiring board. The ultrasonic treatment can also improve the dispersion of the conductive particles in a conductive carbon dispersion, reduce or eliminate the formation of pinhole defects, and provide other advantages.
摘要翻译： 公开了一种用于处理印刷电路板的非导电通孔表面的方法。 包括通孔的印刷电路板被清洁，调理，并且通过使其与一系列的浴接触，将导电涂层施加到初始非导电通孔。 导电涂层，例如石墨分散体涂层有利于导电表面的后续电镀。 尽管至少部分地将通孔浸入这些浴中的一个或多个中，但在通孔附近的浴中引入超声波能量。 在整个浸渍步骤期间，浸渍步骤之前或两者都可以引入超声波能量。 超声波能量在后续加工（尤其是焊接）印刷线路板时减少了气孔的形成。 超声波处理还可以改善导电颗粒在导电碳分散体中的分散，减少或消除针孔缺陷的形成，并提供其他优点。
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10.发明授权公开(公告)号：US06691912B2
公开(公告)日：2004-02-17
申请号：US10087051
申请日：2002-03-01
申请人： Michael V. Carano , Frank Polakovic
发明人： Michael V. Carano , Frank Polakovic
IPC分类号： B23K3102
CPC分类号： H05K3/424
摘要： A composition and method for cleaning and conditioning a non-conductive surface defined by a through hole in a printed circuit board (PCB) is disclosed. The through hole surface is contacted with the composition of the invention to provide a cleaned and conditioned surface. The clean and conditioned surface is coated with conductive carbon particles (usually graphite) to provide a carbon-coated surface. The carbon-coated surface is electro plated and then soldered using hot solder. Those surfaces that have been soldered and also treated with the composition of the invention exhibit fewer blow hole problems. The composition of the invention comprises carbonates, binders, and resins, and combinations thereof, that improve the adhesion and coverage of a coating containing graphite to a surface defined by a through hole bore or other substrate. (“Through holes” as used herein refers both to through holes and to vias.)
摘要翻译： 公开了一种用于清洁和调节由印刷电路板（PCB）中的通孔限定的非导电表面的组合物和方法。 通孔表面与本发明的组合物接触以提供清洁和调理的表面。 清洁和调理表面涂覆有导电碳颗粒（通常为石墨），以提供碳涂层表面。 碳涂层表面电镀，然后使用热焊料焊接。 已经焊接并且用本发明的组合物处理的那些表面表现出较少的孔洞问题。 本发明的组合物包括碳酸盐，粘合剂和树脂及其组合，其改善了包含石墨的涂层在由通孔或其它基底限定的表面上的粘合性和覆盖性。 （本文所用的“通孔”是指通孔和通孔）。
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