-
公开(公告)号：US5476580A
公开(公告)日：1995-12-19
申请号：US232574
申请日：1994-05-03
IPC分类号： B01F17/00 , C08K3/04 , C08L101/00 , C09D201/00 , C25D5/54 , C25D7/00 , H05K3/42 , C25D5/02
CPC分类号： H05K3/424 , C25D5/54 , H05K2201/0323 , H05K2203/122 , H05K3/427
摘要： A composition and process for preparing a non-conductive substrate for electroplating. The composition comprises 0.1 to 20% by weight carbon (e.g. graphite or carbon black) having a mean particle size within the range of 0.05 to 50 microns; optionally, 0.01 to 10% by weight of a water soluble or dispersible binding agent for binding to the carbon particles; optionally, an effective amount of an anionic dispersing agent for dispersing the bound carbon particles; optionally, an amount of a surfactant that is effective for wetting the through hole; a pH within the range of 4-14; and an aqueous dispersing medium. Improved methods of applying the composition to a through hole, a printed wiring board having a through hole treated with the composition, and a method of fixing a carbon coating deposited on a through hole using an acid solution are also disclosed.
摘要翻译： 一种用于制备用于电镀的非导电基底的组合物和方法。 组合物包含0.1至20重量％的平均粒径在0.05至50微米范围内的碳（例如石墨或炭黑）; 任选地，0.01至10重量％的用于结合碳颗粒的水溶性或可分散结合剂; 任选地，有效量的用于分散结合的碳颗粒的阴离子分散剂; 任选地，一定量的有效润湿通孔的表面活性剂; pH在4-14范围内; 和水分散介质。 还公开了将组合物施加到通孔的改进方法，具有通过组合物处理的通孔的印刷线路板以及使用酸溶液固定沉积在通孔上的碳涂层的方法。
-
2.发明授权Composition and process for preparing a non-conductive substrate for electroplating 失效用于制备用于电镀的非导电基底的组合物和方法
公开(公告)号：US5389270A
公开(公告)日：1995-02-14
申请号：US062943
申请日：1993-05-17
IPC分类号： C25D5/54 , H05K3/42 , C10M125/02
CPC分类号： H05K3/424 , C25D5/54 , H05K2201/0323 , H05K2203/122 , H05K3/427
摘要： The present invention is directed to an improved composition and process for preparing a non-conductive substrate for electroplating. The composition comprises 0.1 to 20% by weight graphite having a mean particle size within the range of 0.05 to 50 microns; 0.01 to 10% by weight of a water soluble or dispersible binding agent for binding to the graphite particles; an effective amount of an anionic dispersing agent for dispersing the bound graphite particles; a pH within the range of 4-14; and an aqueous dispersing medium. Optionally, the composition may contain an amount of a surfactant that is effective for wetting the through hole. The resulting graphite dispersion is capable of uniformly coating the through holes in either a double-sided or multi-layer circuit board prior to electroplating. Through holes that were treated with the disclosed graphite dispersion prior to electroplating were free of visible voids after electroplating.
摘要翻译： 本发明涉及用于制备用于电镀的非导电基底的改进的组合物和方法。 该组合物包含0.1至20重量％的平均粒度在0.05至50微米范围内的石墨; 0.01至10重量％的用于结合石墨颗粒的水溶性或可分散结合剂; 有效量的用于分散结合的石墨颗粒的阴离子分散剂; pH在4-14范围内; 和水分散介质。 任选地，组合物可以含有一定量的有效润湿通孔的表面活性剂。 所得到的石墨分散体能够在电镀之前均匀地涂覆在双面或多层电路板中的通孔。 在电镀之前用公开的石墨分散体处理的通孔在电镀后没有可见的空隙。
-
搜索结果
2 条记录 (耗时 0.01 秒)
