发明授权
- 专利标题： High temperature, lead-free, tin based solder composition
- 专利标题（中）： 耐高温，无铅锡锡焊料组成
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申请号： US79075申请日： 1993-06-16
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公开(公告)号： US5393489A公开(公告)日： 1995-02-28
- 发明人: Stephen G. Gonya , James K. Lake , Randy C. Long , Roger N. Wild
- 申请人： Stephen G. Gonya , James K. Lake , Randy C. Long , Roger N. Wild
- 申请人地址： NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： NY Armonk
- 主分类号： B23K35/26
- IPC分类号： B23K35/26 ; C22C13/00 ; H01L21/60 ; H01L23/488 ; H05K3/34
摘要：
Disclosed is a lead-free, high solidus temperature, high Sn alloy. The solder alloys contain in excess of 90 weight percent Sn, and an effective amount of Ag and Bi, optionally with Sb or with Sb and Cu. Another form of the alloy contains Ag and Sb, optionally with Bi.
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