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    Plastic ball grid array ruggedization
    7.
    发明授权
    Plastic ball grid array ruggedization 有权
    塑料球栅阵列加固

    公开(公告)号：US07804179B2

    公开(公告)日：2010-09-28

    申请号：US12108792

    申请日：2008-04-24

    申请人： Charles H. Dando, III ,  Stephen G. Gonya ,  William E. Murphy

    发明人： Charles H. Dando, III ,  Stephen G. Gonya ,  William E. Murphy

    IPC分类号： H01L21/00

    CPC分类号： B23K3/0623 ,  B23K2101/40 ,  H01L23/16 ,  H01L23/3121 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49833 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45147 ,  H01L2224/48 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2924/00012

    摘要： A method and product which provides a thin metal or ceramic plate to the top of a plastic grid array (PGA) as a stiffener to maintain its flatness over temperature during a column attach process, and the columns are used for attachment to circuit boards or other circuit devices. These may be constructed in this manner initially or may be retrofitted plastic ball grid arrays from which the solder balls are removed and, the stiffener is attached to the top, and the solder columns have been added to replace the solder balls. The stiffener is a bonded thin metal or ceramic plate attached to the top of the PGA to maintain its flatness over temperature during the column attach process. An aluminum plate bonded to the top of a PGA results in a significant reduction in warping during a temperature cycle. This allows attachment of solder columns to the PBGA. The high melt solder columns are attached to an area array pattern on the PBGA substrate. This array is typically either a solid or perimeter grid. It is critical that the ends of the solder columns opposite the ends attached to the substrate align precisely with the matching grid of solder pads on the printed wiring board. The purpose of the stiffening plate is to maintain the flatness of the PBGA during the process of attaching the columns to the substrate as well as attaching the component to the printed wiring board such that the columns maintain their alignment over this temperature range.

    摘要翻译： 一种方法和产品，其在塑料栅格阵列（PGA）的顶部提供薄金属或陶瓷板作为加强件，以在柱附着过程中保持其在温度下的平坦度，并且该列用于附接到电路板或其它 电路设备。 这些可以以这种方式最初构造，或者可以是改进的塑料球栅阵列，焊球从中去除，并且加强件附接到顶部，并且已经添加了焊料柱来代替焊球。 加强件是连接到PGA顶部的粘合薄金属或陶瓷板，以在柱连接过程中保持其在温度下的平坦度。 结合到PGA的顶部的铝板导致在温度循环期间翘曲的显着降低。 这样可以将焊料柱连接到PBGA。 高熔点焊料柱与PBGA基板上的区域阵列图案相连。 该阵列通常是固体或周边网格。 至关重要的是，与连接到衬底的端部相对的焊料柱的端部与印刷电路板上的焊盘的匹配格栅精确对准。 加强板的目的是在将柱附接到基板的过程中保持PBGA的平坦度，以及将部件附接到印刷线路板，使得柱在该温度范围内保持其对准。

    Signal cross-over interconnect for a double-sided circuit card assembly
    8.
    发明授权
    Signal cross-over interconnect for a double-sided circuit card assembly 有权
    用于双面电路卡组合的信号交叉互连

    公开(公告)号：US06410857B1

    公开(公告)日：2002-06-25

    申请号：US09927643

    申请日：2001-08-13

    申请人： Stephen G. Gonya

    发明人： Stephen G. Gonya

    IPC分类号： H05K100

    CPC分类号： H05K3/368 ,  H01R12/52 ,  H05K3/0061 ,  H05K3/361 ,  H05K3/365 ,  H05K2201/056 ,  H05K2203/0307

    摘要： A double-sided circuit card assembly comprises first and second printed wiring boards having first and second sets of electrical contacts mounted thereon, and a signal cross-over interconnect member interposed between the first and second printed wiring boards and bonded thereto so as to form therewith a three-component laminate. The cross-over interconnect member comprises a metal frame member having a slot defined therethrough, and a flex circuit member, having a third set of electrical contacts mounted thereon, is passed through the slot and bent around an internal edge portion of the frame member so as to electrically interconnect the first and second sets of electrical contacts of the first and second printed wiring boards. In this manner, the number of interconnection sites is enhanced, the fabrication of the electrical connections is facilitated, and the flex circuit member is disposed internally of the laminate structure so as not to be exposed to external environmental factors. The frame member also provides the requisite support for the flex circuit, and serves as a heat sink for dissipating heat generated by means of the first and second printed wiring boards.

    摘要翻译： 双面电路卡组件包括第一和第二印刷电路板，其具有安装在其上的第一组和第二组电触点，以及置于第一和第二印刷电路板之间并与之结合以便形成的信号交叉互连构件 三组分层压板。 交叉互连构件包括具有限定在其中的狭槽的金属框架构件，并且具有安装在其上的第三组电触点的柔性电路构件穿过狭槽并围绕框架构件的内部边缘部分弯曲 以便将第一和第二印刷线路板的第一和第二组电触点电互连。 以这种方式，增强了互连部位的数量，促进了电连接的制造，并且柔性电路部件设置在层叠结构的内部，以免暴露于外部环境因素。 框架构件还为柔性电路提供必要的支撑，并且用作散热器，用于散发由第一和第二印刷线路板产生的热量。

    PLASTIC BALL GRID ARRAY RUGGEDIZATION
    9.
    发明申请
    PLASTIC BALL GRID ARRAY RUGGEDIZATION 有权
    塑料球网阵列

    公开(公告)号：US20090267227A1

    公开(公告)日：2009-10-29

    申请号：US12108792

    申请日：2008-04-24

    申请人： Charles H. Dando, III ,  Stephen G. Gonya ,  William E. Murphy

    发明人： Charles H. Dando, III ,  Stephen G. Gonya ,  William E. Murphy

    IPC分类号： H01L23/488 ,  B23K31/02

    CPC分类号： B23K3/0623 ,  B23K2101/40 ,  H01L23/16 ,  H01L23/3121 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49833 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45147 ,  H01L2224/48 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2924/00012

    摘要： A method and product which provides a thin metal or ceramic plate to the top of a plastic grid array (PGA) as a stiffener to maintain its flatness over temperature during a column attach process, and the columns are used for attachment to circuit boards or other circuit devices. These may be constructed in this manner initially or may be retrofitted plastic ball grid arrays from which the solder balls are removed and, the stiffener is attached to the top, and the solder columns have been added to replace the solder balls. The stiffener is a bonded thin metal or ceramic plate attached to the top of the PGA to maintain its flatness over temperature during the column attach process. An aluminum plate bonded to the top of a PGA results in a significant reduction in warping during a temperature cycle. This allows attachment of solder columns to the PBGA. The high melt solder columns are attached to an area array pattern on the PBGA substrate. This array is typically either a solid or perimeter grid. It is critical that the ends of the solder columns opposite the ends attached to the substrate align precisely with the matching grid of solder pads on the printed wiring board. The purpose of the stiffening plate is to maintain the flatness of the PBGA during the process of attaching the columns to the substrate as well as attaching the component to the printed wiring board such that the columns maintain their alignment over this temperature range.

    摘要翻译： 一种方法和产品，其在塑料栅格阵列（PGA）的顶部提供薄金属或陶瓷板作为加强件，以在柱附着过程中保持其在温度下的平坦度，并且该列用于附接到电路板或其它 电路设备。 这些可以以这种方式最初构造，或者可以是改进的塑料球栅阵列，焊球从中去除，并且加强件附接到顶部，并且已经添加了焊料柱来代替焊球。 加强件是连接到PGA顶部的粘合薄金属或陶瓷板，以在柱连接过程中保持其在温度下的平坦度。 结合到PGA的顶部的铝板导致在温度循环期间翘曲的显着降低。 这样可以将焊料柱连接到PBGA。 高熔点焊料柱与PBGA基板上的区域阵列图案相连。 该阵列通常是固体或周边网格。 至关重要的是，与连接到衬底的端部相对的焊料柱的端部与印刷电路板上的焊盘的匹配格栅精确对准。 加强板的目的是在将柱附接到基板的过程中保持PBGA的平坦度，以及将部件附接到印刷线路板，使得柱在该温度范围内保持其对准。

    Seam arrangement for a radome
    10.
    发明授权
    Seam arrangement for a radome 有权
    天线罩的接缝安排

    公开(公告)号：US07242365B1

    公开(公告)日：2007-07-10

    申请号：US11099795

    申请日：2005-04-06

    申请人： Robert K. Boatman ,  Stephen G. Gonya

    发明人： Robert K. Boatman ,  Stephen G. Gonya

    IPC分类号： H01Q1/24 ,  H01Q1/36

    CPC分类号： H01Q1/42 ,  H01Q1/422

    摘要： A radome that defines an axis and has an open end. The radome includes a plurality of plies including a first ply and a second ply. At least one of the plies includes a first sheet that defines a first edge and a second sheet that defines a second edge. The first edge abuts against the second edge to define a seam. A core portion is disposed between the first ply and the second ply.

    摘要翻译： 定义轴并具有开口端的天线罩。 天线罩包括多个包括第一帘布层和第二帘布层的帘布层。 至少一个帘布层包括限定第一边缘的第一片材​​和限定第二边缘的第二片材。 第一边缘抵靠第二边缘以定义接缝。 芯部分设置在第一层和第二层之间。