Invention Grant
- Patent Title: Method for forming electrical connection to the inner layers of a multilayer circuit board
- Patent Title (中): 用于形成与多层电路板的内层的电连接的方法
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Application No.: US351819Application Date: 1994-12-08
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Publication No.: US5472735APublication Date: 1995-12-05
- Inventor: Christina M. Boyko , Richard W. Carpenter , Raymond T. Galasco , Krystyna W. Semkow , Herbert Wegener
- Applicant: Christina M. Boyko , Richard W. Carpenter , Raymond T. Galasco , Krystyna W. Semkow , Herbert Wegener
- Applicant Address: NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: NY Armonk
- Main IPC: C25F3/02
- IPC: C25F3/02 ; H05K3/07 ; B05D5/12 ; C25D5/34 ; C25F3/14
Abstract:
The present invention relates to a method for selectively electroetching a metal from an electrical device having the steps of: immersing the electrical device in an etching solution; immersing a cathode in the etching solution; applying an etching potential to a preselected area of the metal; and maintaining a passivation potential at the metal to remain unetched. The metal to remain unetched is not electrically connected to the preselected area and the passivation potential does not equal the etching potential.The present invention further relates to a method of forming an electrical connection to the inner layers of a multilayer circuit board having a copper foil surface layer and copper containing inner layers.
Public/Granted literature
- USD323200S Toe piece for cross country ski binding Public/Granted day:1992-01-14
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